1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability. No terminal voltage may exceed
Vcc by +0.5V unless otherwise noted.
2. Inputs and Vcc terminals only.
3. Output and I/O terminals only.
CAPACITANCE
(T
A
= +25°C, F = 1.0MHz)
Symbol
C
IN
C
OUT
Parameter
(1)
Input Capacitance
Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Typ.
6
8
Max.
10
12
Unit
pF
pF
NOTE:
1. This parameter is measured at characterization but not tested.
2
B
6
IDT54/74FCT646T/AT/CT
FAST CMOS OCTAL TRANSCEIVER/REGISTER (3-STATE)
MILITARY AND INDUSTRIAL TEMPERATURE RANGES
FUNCTION TABLE
(1)
Inputs
G
H
H
L
L
L
L
DIR
X
X
L
L
H
H
CPAB
H or L
↑
X
X
X
H or L
CPBA
H or L
↑
X
H or L
X
X
SAB
X
X
X
X
L
H
SBA
X
X
L
H
X
X
Input
Output
Output
Input
A
1
- A
8
Input
Data I/O
(2)
B
1
- B
8
Input
Isolation
Store A and B Data
Real-Time B Data to A Bus
Stored B Data to A Bus
Real-Time A Data to B Bus
Stored A Data to B Bus
Operation or Function
NOTES:
1. H = HIGH
L = LOW
X = Don't Care
↑
= LOW-to-HIGH transition.
Select control = L: clocks can occur simultaneously.
Select control = H: clocks must be staggered in order to load both registers.
2. The data output functions may be enabled or disabled by various signals at the GAB or GBA inputs. Data input functions are always enabled, i.e. data at the bus pins will be
stored on every LOW-to-HIGH transition on the clock inputs.
3.
A
in B Register.
4.
B
in A Register.
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Industrial: T
A
= –40°C to +85°C, V
CC
= 5.0V ±5%; Military: T
A
= –55°C to +125°C, V
CC
= 5.0V ±10%
Symbol
V
IH
V
IL
I
IH
I
IL
I
OZH
I
OZL
I
I
V
IK
V
H
I
CC
Parameter
Input HIGH Level
Input LOW Level
Input HIGH Current
(4)
Input LOW Current
(4)
High Impedance Output Current
(3-State output pins)
(4)
Input HIGH Current
(4)
Clamp Diode Voltage
Input Hysteresis
Quiescent Power Supply Current
V
CC
= Max., V
I
= V
CC
(Max.)
V
CC
= Min, I
IN
= -18mA
—
V
CC
= Max., V
IN
= GND or V
CC
Test Conditions
(1)
Guaranteed Logic HIGH Level
Guaranteed Logic LOW Level
V
CC
= Max.
V
CC
= Max.
V
CC
= Max
V
I
= 2.7V
V
I
= 0.5V
V
O
= 2.7V
V
O
= 0.5V
Min.
2
—
—
—
—
—
—
—
—
—
Typ.
(2)
—
—
—
—
—
—
—
–0.7
200
0.01
Max.
—
0.8
±1
±1
±1
±1
±1
–1.2
—
1
µA
V
mV
µA
Unit
V
V
µA
µA
µA
OUTPUT DRIVE CHARACTERISTICS
Symbol
V
OH
Parameter
Output HIGH Voltage
V
CC
= Min
V
IN
= V
IH
or V
IL
Test Conditions
(1)
I
OH
= –6mA MIL
I
OH
= –8mA IND
I
OH
= –12mA MIL
I
OH
= –15mA IND
I
OL
= 48mA MIL
I
OL
= 64mA IND
Min.
2.4
2
—
–60
—
Typ.
(2)
3.3
3
0.3
–120
—
Max.
—
—
0.55
–225
±1
V
mA
µA
Unit
V
V
OL
I
OS
I
OFF
Output LOW Voltage
Short Circuit Current
Input/Output Power Off Leakage
(5)
V
CC
= Min
V
IN
= V
IH
or V
IL
V
CC
= Max., V
O
= GND
(3)
V
CC
= 0V, V
IN
or V
O
≤
4.5V
NOTES:
1. For conditions shown as Min. or Max., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V
CC
= 5.0V, +25°C ambient.
3. Not more than one output should be tested at one time. Duration of the test should not exceed one second.
4. The test limit for this parameter is ±5µA at T
A
= –55°C.
5. This parameter is guaranteed but not tested.
3
IDT54/74FCT646T/AT/CT
FAST CMOS OCTAL TRANSCEIVER/REGISTER (3-STATE)
MILITARY AND INDUSTRIAL TEMPERATURE RANGES
BUS
A
BUS
B
BUS
A
BUS
B
DIR
L
G
L
CPAB
X
CPBA
X
SAB
X
SBA
L
DIR
H
G
L
CPAB
X
CPBA
X
SAB
L
SBA
X
Real-Time Transfer
Bus B to A
Real-Time Transfer
Bus A to B
BUS
A
BUS
B
BUS
A
BUS
B
DIR
H
L
X
G
L
L
H
CPAB
↑
CPBA
X
↑
↑
SAB
X
X
X
SBA
X
X
X
X
↑
DIR
L
H
G
L
L
CPAB
X
H or L
CPBA
H or L
X
SAB
X
H
SBA
H
X
Storage From
A and/or B
Transfer Stores
(1)
Data to A and/or B
NOTE:
1. Cannot transfer data to A bus and B bus simultaneously.
4
IDT54/74FCT646T/AT/CT
FAST CMOS OCTAL TRANSCEIVER/REGISTER (3-STATE)
MILITARY AND INDUSTRIAL TEMPERATURE RANGES
POWER SUPPLY CHARACTERISTICS
Symbol
∆I
CC
I
CCD
Parameter
Quiescent Power Supply Current
TTL Inputs HIGH
Dynamic Power Supply
Current
(4)
V
CC
= Max.
V
IN
= 3.4V
(3)
V
CC
= Max.
Outputs Open
G
= DIR = GND
One Input Toggling
50% Duty Cycle
V
CC
= Max.
Outputs Open
f
CP
= 10MHz
50% Duty Cycle
G
= DIR = GND
One Bit Toggling
at fi = 5MHz
V
CC
= Max.
Outputs Open
f
CP
= 10MHz
50% Duty Cycle
G
= DIR = GND
Eight Bits Toggling
at fi = 2.5MHz
V
IN
= 3.4V
V
IN
= GND
—
6
16.3
(5)
V
IN
= V
CC
V
IN
= GND
Test Conditions
(1)
Min.
—
—
Typ.
(2)
0.5
0.15
Max.
2
0.25
Unit
mA
mA/
MHz
I
C
Total Power Supply Current
(6)
V
IN
= V
CC
V
IN
= GND
—
1.5
3.5
mA
V
IN
= 3.4V
V
IN
= GND
V
IN
= V
CC
V
IN
= GND
—
2
5.5
—
3.8
7.3
(5)
NOTES:
1. For conditions shown as Min. or Max., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V
CC
= 5.0V, +25°C ambient.
3. Per TTL driven input; (V
IN
= 3.4V). All other inputs at V
CC
or GND.
4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.
5. Values for these conditions are examples of
∆I
CC
formula. These limits are guaranteed but not tested.
6. I
C
= I
QUIESCENT
+ I
INPUTS
+ I
DYNAMIC
I
C
= I
CC
+
∆I
CC
D
H
N
T
+ I
CCD
(f
CP
/2+ f
i
N
i
)
I
CC
= Quiescent Current
∆I
CC
= Power Supply Current for a TTL High Input (V
IN
= 3.4V)
D
H
= Duty Cycle for TTL Inputs High
N
T
= Number of TTL Inputs at D
H
I
CCD
= Dynamic Current caused by an Input Transition Pair (HLH or LHL)
f
CP
= Clock Frequency for Register Devices (Zero for Non-Register Devices)
f
i
= Output Frequency
N
i
= Number of Outputs at f
i
All currents are in milliamps and all frequencies are in megahertz.
When AC current is overloaded, the AC voltage applied to the load and the AC current passing through the load will have a phase difference, from which people derive the concept of power factor. The el...
This book is suitable as a textbook for analog electronics flipped classroom and electronic design competition training. It is based on electronic system design, TI analog technology and MCU platform....
I need help from an expert. I have been working on the problem of installing soclib on FC7 for several days but have not been able to solve it. When using make in /soclib/utils/src, the following erro...
Hey guys, I'm a newbie.I have a question. I can download the program to MSP430 through the parallel port. Where is it downloaded to?Why is the program gone after I lose power or reset it?It's normal w...
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
On August 22, Lantu Motors officially launched its Lanhai Intelligent Hybrid technology via an online livestream. This intelligent hybrid technology, which integrates a full-range 800V high-voltage...[Details]
Core point: The automotive industry chain and the humanoid robot industry have collaborative advantages in hardware, software, and scenarios. Upstream and downstream companies in the automotive ind...[Details]
When discussing autonomous driving technology, there are often two extremes: on the one hand, there's the vision of "fully autonomous driving," while on the other, there's concern about potential s...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
Pure electric vehicles, structurally speaking, have components such as a power battery. In addition to the power battery, a small battery also powers some low-voltage electrical components and even...[Details]
Laird Thermal Systems has introduced the HiTemp ET series Peltier cooler modules, which can operate at high temperatures and provide on-site cooling for sensitive electronic devices.
Dig...[Details]
With the advent of the electric car era, the number of pure electric vehicles has increased significantly, but many car owners do not know how to properly maintain pure electric vehicles. In additi...[Details]
Magna's integrated in-cabin perception system fuses vision and millimeter-wave radar data to detect the presence of passengers, identify stranded children, monitor driver fatigue and vital signs, a...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Office (USPTO) for a patent for a door anti-collision system that may be used in future Ford vehicl...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
Plug-in hybrid vehicles (PHEVs) utilize two powertrains. Their pure electric range is typically inferior to that of pure electric vehicles, often reaching less than half that. Currently, mainstream...[Details]