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AM29F040-120DI

Description
Flash, 512KX8, 120ns, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32
Categorystorage    storage   
File Size129KB,4 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

AM29F040-120DI Overview

Flash, 512KX8, 120ns, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32

AM29F040-120DI Parametric

Parameter NameAttribute value
MakerAMD
Parts packaging codeDIP
package instructionHERMETIC SEALED, CERAMIC, DIP-32
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time120 ns
Other featuresBULK ERASE; AUTOMATIC WRITE
JESD-30 codeR-GDIP-T32
length42.1005 mm
memory density4194304 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX8
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height5.588 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
typeNOR TYPE
width15.24 mm
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