MXSMAJ4491CE3 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> diode> MXSMAJ4491CE3

MXSMAJ4491CE3: DescriptionZener Diode, 120V V(Z), 2%, 1.5W, Silicon, Unidirectional, DO-214BA, ROHS COMPLIANT, PLASTIC, SMAJ, 2 PIN; CategoryDiscrete semiconductor diode; File Size157KB，2 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

Download Datasheet Parametric View All

MXSMAJ4491CE3 Overview

Zener Diode, 120V V(Z), 2%, 1.5W, Silicon, Unidirectional, DO-214BA, ROHS COMPLIANT, PLASTIC, SMAJ, 2 PIN

MXSMAJ4491CE3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microsemi
Parts packaging code	DO-214BA
package instruction	R-PDSO-C2
Contacts	2
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	HIGH RELIABILITY, METALLURGICALLY BONDED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
JEDEC-95 code	DO-214BA
JESD-30 code	R-PDSO-C2
JESD-609 code	e3
Number of components	1
Number of terminals	2
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	1.5 W
Certification status	Not Qualified
Nominal reference voltage	120 V
surface mount	YES
technology	ZENER
Terminal surface	MATTE TIN
Terminal form	C BEND
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	2%
Working test current	2 mA

Preview

Download Datasheet

View All

SMAJ4460 thru SMAJ4496, e3

and SMAJ6485 thru SMAJ6491, e3

1.5 Watt Zener Diodes

SCOTTSDALE DIVISION

DESCRIPTION

This 1.5 watt zener series in a low-profile light-weight plastic surface mount

configuration, with stress-relief J-bend contacts, meets or exceeds the electrical

performance of the 1N4460 thru 1N4496 and 1N6485 thru 1N6491. It also provides

double the overall surge performance by using a larger active die element. This

includes ESD protection per IEC61000-4-2, EFT protection per IEC61000-4-4, and

higher surge levels defined herein. The low-flat profile provides easier insertion or

automatic handling compared to other MELF style packages. Its thermally efficient

design lowers junction temperatures and extends operating temperature range

before derating begins. Power derates to zero at 150°C for these plastic packages.

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

SURFACE MOUNT

ZENER

WWW .

Microsemi

DO-214BA or AC

(SMAJ)

FEATURES

•

Zener voltages: 3.3 volts to 200 volts

Metallurgically bonded

Reliability data per JESD22-A108, JESD22-A104,

JESD22-A113-B, JESD22-A101-B, and JESD22-A102

Thermally efficient surface mount with J-bends for

stress relief (flat handling surface for easier placement)

Options for screening in accordance with MIL-PRF-

19500/406 for JAN, JANTX, and JANTXV are available

by adding MQ, MX, or MV prefixes respectively to part

numbers. For example, designate a MXSMAJ4460 for a

JANTX screen.

RoHS Compliant devices available by adding “e3” suffix

APPLICATIONS / BENEFITS

•

For high reliability voltage regulation in low profile

surface mount locations requiring easy

placement and strain relief

•

Light weight for airborne or satellite applications

•

Superior surge quality to protect from ESD and

EFT transients per IEC61000-4-2 and -4-4 and

higher surge levels defined herein

MECHANICAL AND PACKAGING

•

Molded epoxy package meets UL94V-0

•

Terminals: Tin-lead or RoHS compliant annealed

matte-Tin plated solderable per MIL-STD-750,

method 2026

•

Body marked with P/N without SMAJ letters

(ie. 4460, 4496, 6485, 4460, etc.)

•

Polarity is indicated by cathode band

•

Weight: 0.064 grams (approximate)

•

Tape & Reel packaging per EIA-481-2 with 12

mm tape and 2500 units per reel (13 inch reel)

•

MAXIMUM RATINGS

•

Operating temperature: -55°C to +150°C

Storage temperature: -55°C to +150°C

1.5 watt steady-state maximum power

Thermal resistance, R

θJL

= 15 °C/W

Solder Temperatures: 260ºC for 10 s (maximum)

POWER DERATING – OUTLINE – MOUNTING PAD

Maximum Power Dissipation (Watts)

DIM

DIMENSIONS

MILLIMETERS

INCHES

MIN

MAX

MIN

MAX

.052

.103

1.32

2.62

.160

.180

4.06

4.57

.100

.110

2.54

2.79

.194

.216

4.93

5.49

.078

.115

1.98

2.92

.030

.060

0.76

1.52

.005

0.13

2.5

2.0

1.5

1.0

0.5

SMAJ4460 – SMAJ4496 &

SMAJ6485 – SMAJ6491

DIMENSION A IS WITHIN DO-214BA BUT HIGHER THAN

STANDARD JEDEC OUTLINES..DIMENSION B IS WIDER

THAN BOTH JEDEC OUTLINES FOR LOWER THERMAL

RESISTANCE

75 100 125 150 175 200

Outline

, Lead Temperature (ºC) 3/8” from body

Figure 1. Power Derating Curve

Mounting Pad

2007

6-20-07 REV B

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

Recommended Resources

25W 40-500kHz power amplifier

Non-touch delay switch

STK084 power amplifier circuit diagram

CB3450 combined semi-automatic turret lathe electrical schematic circuit 01

battery voltage monitor

Single tube amplifier transistor DC voltage stabilizing circuit

Looking for methods and steps to use BSP components to create an independent executable program (a kind of Bootable) under VxWorks (Tornado2.2, VxWorks5.5.1, the version matching is best): I need to use BSP components under VxWorks to build an independent executable program. This program should be independent of bootrom (because of incremental development, there is no interface in the p...; ABCD19871242 Real-time operating system RTOS

TMS320C50 Example Programming Sharing: [size=4]Write a TMS320C50 program with interrupt function in C language and debug it with hardware emulator. [/size] [size=4]/*This program is a serial port input and output program of TMS320C50. TMS3...; 灞波儿奔 DSP and ARM Processors

Engineer, if you don't develop from the perspective of engineering or product, how can you be worthy of the word "engineering"...: The older you get, the more things you have to do and the more you think. People say that you are aggressive when you are young because you are young and fearless. You don’t think too much. Think abou...; 懒猫爱飞 Talking

Understand the past and present of NFC in one article!: The topic we are going to talk about today is NFC.I believe everyone will be familiar with it.As a convenient communication technology, NFC has been serving us silently for many years.We see it from t...; btty038 RF/Wirelessly

Forward: "About the Basics, We Have to Say" and a junior student's opinion on this article: 《About the Basics, I Have to Say》[/backcolor][/color][/align][color=rgb(0, 0, 0)][backcolor=rgb(255, 255, 255)][/backcolor][/color][align=left][color=rgb(0, 0, 0)][backcolor=rgb(255, 255, 255)][/backc...; 天天1 Talking

Explanation of the code: GBLL THUMBCODE; define a global variable GBLL defines the initial value of the logical variable as {false} [ {CONFIG} = 16 THUMBCODE SETL {TRUE} //SETA instruction is used to set the value of a local ...; didi111 Embedded System

Passive Intermodulation Measurement and Solutions

1. Overview Will passive devices produce nonlinear intermodulation distortion? The answer is yes! Although there is no systematic theoretical analysis, it has been found in engineerin...[Details]
Using ZLGCAN Interface Function Library in LabVIEW

1. Overview The Virtual CAN Interface (VCI) function library is an application program interface specifically provided for the use of ZLGCAN devices on PCs. The functions in the library ar...[Details]
Design of paper machine transmission control system based on Profibus DP

1. Project Introduction Shandong Dezhou Xingtai Paper Co., Ltd. is a newly built high-end paperboard production enterprise with domestic leading level established by Shandong Zhaodongfang Pape...[Details]
AT89C52-based intelligent wireless security alarm

Introduction Nowadays, people pay more and more attention to the security alarm system, and people have higher and higher requirements for the functions and performance of the alarm. This paper prop...[Details]
Capacitors are indispensable in power supply design

Power supply is often the most easily overlooked link in the circuit design process. In fact, as an excellent design, power supply design should be very important, which greatly affects the perfor...[Details]
Testing DigRF on 3G Mobile Phones

DigRF is poised to replace the two main forms of data communication paths between RF and baseband semiconductor devices: analog signaling, and proprietary digital signaling (paralle...[Details]
Analysis of the structure and control technology of stepper motor

Stepper motors, also called steppers, use the principles of electromagnetism to convert electrical energy into mechanical energy and have been used since the 1920s. With the increasing popularity o...[Details]
Problems and maintenance of electric vehicle batteries

1 Causes of problems with electric vehicle batteries 1.1 Caused by the battery itself Why do we say that? In the previous issue, we learned about the working princi...[Details]
Eight advantages of lithium iron phosphate batteries

Lithium iron phosphate batteries are used as lithium-ion secondary batteries. Their main application is now in power batteries, which have great advantages over NI-H and Ni-Cd batteries. Lithi...[Details]
Design of a power supply protection device with configurable load threshold

With the continuous development of integrated circuit technology, integrated circuits have developed from thousands of gates to the current level of millions and tens of millions of gates. The applica...[Details]
Design of a simple electronic keyboard

1. Design topic: Design a simple electronic keyboard that can produce seven notes: 1, 2, 3, 4, 5, 6, and 7. Components used: AT89C51, LM324, speakers, buttons, etc. 2. Design Pur...[Details]
Building a Flexible Fuel Cell Test System

According to a survey by the International Energy Agency, Asia and Australia used 1.65 trillion liters of oil for energy in 2004. The survey also showed that since 1990, the demand for oil has been...[Details]
Analysis of battery operation and maintenance work

Different places have accumulated certain experience in equalizing charging of battery packs, but it is difficult to master it properly. Long-term non-equalizing charging or frequent equalizing cha...[Details]
Design of time synchronizer control unit based on ARM and FPGA

With the development of modern science and technology, the demand for information is constantly increasing. Satellite navigation and positioning systems have received much attention, and their applica...[Details]
Several issues in the development of PIC microcontrollers

PIC microcontrollers are becoming increasingly popular in China. This article introduces some experiences and techniques in software and hardware design during the development of Microchip PIC seri...[Details]

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components