EEWORLDEEWORLDEEWORLD

Part Number

Search

BYG23MF3G

Description
Rectifier Diode, 1 Phase, 1 Element, 1.5A, 1000V V(RRM), Silicon, DO-214AC, GREEN, PLASTIC, FOLDED SMA, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size377KB,4 Pages
ManufacturerTaiwan Semiconductor
Websitehttp://www.taiwansemi.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

BYG23MF3G Overview

Rectifier Diode, 1 Phase, 1 Element, 1.5A, 1000V V(RRM), Silicon, DO-214AC, GREEN, PLASTIC, FOLDED SMA, 2 PIN

BYG23MF3G Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerTaiwan Semiconductor
package instructionR-PDSO-C2
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresFREE WHEELING DIODE
applicationEFFICIENCY
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1.7 V
JEDEC-95 codeDO-214AC
JESD-30 codeR-PDSO-C2
JESD-609 codee3
Humidity sensitivity level1
Maximum non-repetitive peak forward current50 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current1.5 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
GuidelineAEC-Q101
Maximum repetitive peak reverse voltage1000 V
Maximum reverse current1 µA
Maximum reverse recovery time0.065 µs
surface mountYES
Terminal surfaceMatte Tin (Sn)
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

BYG23MF3G Preview

BYG23M
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Glass passivated junction chip.
- Ideal for automated placement
- Fast switching for high efficiency
- High surge current capability
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
- AEC-Q101 available
High Efficient Surface Mount Rectifiers
TYPICAL APPLICATION
The superior avalanche capability of BYG23M is specially
suited for free-wheeling, clamping, snubbering,
demagnetization in power supplies and other power switching applications.
DO-214AC (SMA)
MECHANICAL DATA
Case:
DO-214AC (SMA)
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity:
Indicated by cathode band
Weight:
0.064 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS
(T
A
=25°C unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current (@T
A
=65°C)
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage (Note 1)
@1A
Maximum reverse current @ rated VR
T
J
=25°C
T
J
=100°C
T
J
=125°C
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
BYG23M
1000
700
1000
1.5
50
1.7
1
I
R
15
50
E
RSM
t
rr
C
J
R
θJA
T
J
T
STG
30
65
15
70
- 55 to +150
- 55 to +150
O
UNIT
V
V
V
A
A
V
μA
Pulse energy in avalanche mode, non repetitive
(Inductive load switch off ) T
A
=25℃, I
(BR)R
=1.23A
Maximum reverse recovery time (Note 2)
Typical junction capacitance (Note 3)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse Test with PW=300μs, 1% Duty Cycle
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0Volts.
mJ
ns
pF
C/W
O
O
C
C
Document Number: DS_D1411087
Version: B14
BYG23M
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PACKING CODE
R3
R2
M2
BYG23M
F3
F2
F4
E3
E2
G
PACKING CODE
SUFFIX
PACKAGE
(Note 1)
SMA
SMA
SMA
Folded SMA
Folded SMA
Folded SMA
Clip SMA
Clip SMA
PACKING
1,800 / 7" Plastic reel
7,500 / 13" Paper reel
7,500 / 13" Plastic reel
1,800 / 7" Plastic reel
7,500 / 13" Paper reel
7,500 / 13" Plastic reel
1,800 / 7" Plastic reel
7,500 / 13" Plastic reel
Note 1: Package "SMA" and "Folded SMA" are AEC-Q101 qualified, Clip SMA doesn't.
EXAMPLE
PREFERRED
PART NO.
BYG23M R3
BYG23M R3G
PART NO.
BYG23M
BYG23M
PACKING CODE
R3
R3
G
PACKING CODE
SUFFIX
DESCRIPTION
AEC-Q101 qualified
AEC-Q101 qualified
Green compound
RATINGS AND CHARACTERISTICS CURVES
(T
A
=25°C unless otherwise noted)
FIG.1 MAXIMUM AVERAGE FORWARD CURRENT
DERATING
INSTANTANEOUS REVERSE CURRENT(μA)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
100
2
AVERAGE FORWARD CURRENT (A)
1.5
10
T
J
=125°C
1
0.5
1
0
0
25
50
75
100
125
150
T
J
=25°C
0.1
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
AMBIENT TEMPERATURE (
o
C)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWARD SURGE URRENT (A)
50
40
30
20
10
0
1
10
100
8.3ms Single Half Sine Wave
JUNCTION CAPACITANCE (pF)
70
60
50
40
30
20
10
0
0.1
FIG. 4 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vslg=50mVp-p
1
10
100
NUMBER OF CYCLES AT 60 Hz
REVERSE VOLTAGE (V)
Document Number: DS_D1411087
Version: B14
BYG23M
Taiwan Semiconductor
FIG. 5 TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
10
INSTANTANEOUS FORWARD CURRENT (A)
1
0.1
0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2 2.4 2.6 2.8
3
FORWARD VOLTAGE (V)
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
DIM.
A
B
C
D
E
F
G
H
Unit (mm)
Min
1.27
4.06
2.29
1.99
0.90
4.95
0.10
0.15
Max
1.58
4.60
2.83
2.50
1.41
5.33
0.20
0.31
Unit (inch)
Min
0.050
0.160
0.090
0.078
0.035
0.195
0.004
0.006
Max
0.062
0.181
0.111
0.098
0.056
0.210
0.008
0.012
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
Unit (mm)
1.68
1.52
3.93
2.41
5.45
Unit (inch)
0.066
0.060
0.155
0.095
0.215
MARKING DIAGRAM
P/N =
G=
YW =
F=
Document Number: DS_D1411087
Specific Device Code
Green Compound
Date Code
Factory Code
Version: B14
BYG23M
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1411087
Version: B14

BYG23MF3G Related Products

BYG23MF3G BYG23M M2G BYG23M R3G BYG23MR2G BYG23MF2 BYG23MR2 BYG23MM2
Description Rectifier Diode, 1 Phase, 1 Element, 1.5A, 1000V V(RRM), Silicon, DO-214AC, GREEN, PLASTIC, FOLDED SMA, 2 PIN DIODE GEN PURP 1.5A DO214AC DIODE GEN PURP 1.5A DO214AC Rectifier Diode, 1 Phase, 1 Element, 1.5A, 1000V V(RRM), Silicon, DO-214AC, GREEN, PLASTIC, SMA, 2 PIN Rectifier Diode, 1 Phase, 1 Element, 1.5A, 1000V V(RRM), Silicon, DO-214AC, ROHS COMPLIANT, PLASTIC, FOLDED SMA, 2 PIN Rectifier Diode, 1 Phase, 1 Element, 1.5A, 1000V V(RRM), Silicon, DO-214AC, ROHS COMPLIANT, PLASTIC, SMA, 2 PIN Rectifier Diode, 1 Phase, 1 Element, 1.5A, 1000V V(RRM), Silicon, DO-214AC, ROHS COMPLIANT, PLASTIC, SMA, 2 PIN
Diode type RECTIFIER DIODE standard standard RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE
Is it Rohs certified? conform to - - conform to conform to conform to conform to
Maker Taiwan Semiconductor - - Taiwan Semiconductor Taiwan Semiconductor Taiwan Semiconductor Taiwan Semiconductor
package instruction R-PDSO-C2 - - GREEN, PLASTIC, SMA, 2 PIN R-PDSO-C2 ROHS COMPLIANT, PLASTIC, SMA, 2 PIN R-PDSO-C2
Reach Compliance Code compliant - - compliant compliant compliant compliant
ECCN code EAR99 - - EAR99 EAR99 EAR99 EAR99
Other features FREE WHEELING DIODE - - FREE WHEELING DIODE FREE WHEELING DIODE FREE WHEELING DIODE FREE WHEELING DIODE
application EFFICIENCY - - EFFICIENCY EFFICIENCY EFFICIENCY EFFICIENCY
Configuration SINGLE - - SINGLE SINGLE SINGLE SINGLE
Diode component materials SILICON - - SILICON SILICON SILICON SILICON
Maximum forward voltage (VF) 1.7 V - - 1.7 V 1.7 V 1.7 V 1.7 V
JEDEC-95 code DO-214AC - - DO-214AC DO-214AC DO-214AC DO-214AC
JESD-30 code R-PDSO-C2 - - R-PDSO-C2 R-PDSO-C2 R-PDSO-C2 R-PDSO-C2
JESD-609 code e3 - - e3 e3 e3 e3
Humidity sensitivity level 1 - - 1 1 1 1
Maximum non-repetitive peak forward current 50 A - - 50 A 50 A 50 A 50 A
Number of components 1 - - 1 1 1 1
Phase 1 - - 1 1 1 1
Number of terminals 2 - - 2 2 2 2
Maximum operating temperature 150 °C - - 150 °C 150 °C 150 °C 150 °C
Minimum operating temperature -55 °C - - -55 °C -55 °C -55 °C -55 °C
Maximum output current 1.5 A - - 1.5 A 1.5 A 1.5 A 1.5 A
Package body material PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE - - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED 260 NOT SPECIFIED
Guideline AEC-Q101 - - AEC-Q101 AEC-Q101 AEC-Q101 AEC-Q101
Maximum repetitive peak reverse voltage 1000 V - - 1000 V 1000 V 1000 V 1000 V
Maximum reverse current 1 µA - - 1 µA 1 µA 1 µA 1 µA
Maximum reverse recovery time 0.065 µs - - 0.065 µs 0.065 µs 0.065 µs 0.065 µs
surface mount YES - - YES YES YES YES
Terminal surface Matte Tin (Sn) - - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form C BEND - - C BEND C BEND C BEND C BEND
Terminal location DUAL - - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED
I need some guidance on the direction of postgraduate study, thank you
I am a junior this year and want to take the postgraduate entrance examination. My major is: Electrical Engineering and Automation. Please give me some suggestions based on your own experience. I have...
liu583685 stm32/stm8
Keil uV4 font problem
Why can't I change the font size of the programming in my software? It's so small. There is no option to change the font size as before. The picture is as follows...
圈在指尖 51mcu
consult
Does anyone have some knowledge about some commonly used chip packages?...
移风 Analog electronics
The market size of semiconductors for digital TV doubled in 2011 compared to 2006
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 20:00[/i] iSuppli of the United States predicts that the market size of semiconductors for digital TV will be about twice that of 2006 in ...
yzxiao2007 Mobile and portable
UPS Power Supply
Chloride industrial-grade products provide comprehensive power protection for AC and DC loads in industrial environments. Highly flexible configuration, suitable for a variety of harsh working environ...
lhcft Power technology
MSP430 independent key interrupt problem
[color=#000][font=宋体,]MSP430 independent buttons display different contents on LCD. Mine seems to be unable to trigger interrupts. What is the reason? [/font][/color] [color=#000][font=宋体,]#include[/f...
jinger0311 Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1483  1245  1146  850  2718  30  26  24  18  55 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号