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IDT72V51553L7-5BBI

Description
FIFO, 128KX18, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Categorystorage    storage   
File Size468KB,51 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT72V51553L7-5BBI Overview

FIFO, 128KX18, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72V51553L7-5BBI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instruction17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Contacts256
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time4 ns
Other featuresALTERNATIVE MEMORY WIDTH:9-BIT
Spare memory width9
Maximum clock frequency (fCLK)133 MHz
period time7.5 ns
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
memory density2359296 bit
Memory IC TypeOTHER FIFO
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals256
word count131072 words
character code128000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX18
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA256,16X16,40
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply3.3 V
Certification statusNot Qualified
Maximum seat height3.5 mm
Maximum standby current0.01 A
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)3.45 V
Minimum supply voltage (Vsup)3.15 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width17 mm
3.3V MULTI-QUEUE FLOW-CONTROL DEVICES
(32 QUEUES) 18 BIT WIDE CONFIGURATION
1,179,648 bits
2,359,296 bits
IDT72V51543
IDT72V51553
FEATURES:
Choose from among the following memory density options:
IDT72V51543
Total Available Memory = 1,179,648 bits
IDT72V51553
Total Available Memory = 2,359,296 bits
Configurable from 1 to 32 Queues
166 MHz High speed operation (6ns cycle time)
3.7ns access time
Queues may be configured at master reset from the pool of
Total Available Memory in blocks of 512 x 18 or 1,024 x 9
Independent Read and Write access per queue
User programmable via serial port
Default multi-queue device configurations
-IDT72V51543: 2,048 x 18 x 32Q or 4,096 x 9 x 32Q
-IDT72V51553: 4,096 x 18 x 32Q or 8,192 x 9 x 32Q
100% Bus Utilization, Read and Write on every clock cycle
Individual, Active queue flags (OV,
FF, PAE, PAF)
8 bit parallel flag status on both read and write ports
Shows
PAE
and
PAF
status of 8 Queues
Direct or polled operation of flag status bus
Global Bus Matching - (All Queues have same Input Bus Width
and Output Bus Width)
User Selectable Bus Matching Options:
- x18in to x18out
- x9in to x18out
- x18in to x9out
- x9in to x9out
FWFT mode of operation on read port
Partial Reset, clears data in single Queue
Expansion of up to 8 multi-queue devices in parallel is available
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
MULTI-QUEUE FLOW-CONTROL DEVICE
Q
0
FSTR
WRADD
WEN
WCLK
8
READ CONTROL
WADEN
RADEN
ESTR
8
WRITE CONTROL
Q
1
RDADD
REN
RCLK
OE
Q
2
Din
Qout
x9, x18
DATA OUT
WRITE FLAGS
READ FLAGS
OV
PAE
PAEn
x9, x18
DATA IN
FF
PAF
PAFn
8
Q
31
8
5938 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2003
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
JUNE 2003
DSC-5938/8

IDT72V51553L7-5BBI Related Products

IDT72V51553L7-5BBI IDT72V51553L6BB IDT72V51543L6BB IDT72V51553L7-5BB IDT72V51543L7-5BB
Description FIFO, 128KX18, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX18, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX18, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Parts packaging code BGA BGA BGA BGA BGA
package instruction 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Contacts 256 256 256 256 256
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 4 ns 3.7 ns 3.7 ns 4 ns 4 ns
Other features ALTERNATIVE MEMORY WIDTH:9-BIT ALTERNATIVE MEMORY WIDTH:9-BIT ALTERNATIVE MEMORY WIDTH:9-BIT ALTERNATIVE MEMORY WIDTH:9-BIT ALTERNATIVE MEMORY WIDTH:9-BIT
Spare memory width 9 9 9 9 9
Maximum clock frequency (fCLK) 133 MHz 166 MHz 166 MHz 133 MHz 133 MHz
period time 7.5 ns 6 ns 6 ns 7.5 ns 7.5 ns
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609 code e0 e0 e0 e0 e0
length 17 mm 17 mm 17 mm 17 mm 17 mm
memory density 2359296 bit 2359296 bit 1179648 bit 2359296 bit 1179648 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 18 18 18 18 18
Humidity sensitivity level 3 3 3 3 3
Number of functions 1 1 1 1 1
Number of terminals 256 256 256 256 256
word count 131072 words 131072 words 65536 words 131072 words 65536 words
character code 128000 128000 64000 128000 64000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 70 °C 70 °C
organize 128KX18 128KX18 64KX18 128KX18 64KX18
Exportable YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 225 225 225
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm
Maximum standby current 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A
Maximum slew rate 0.1 mA 0.1 mA 0.1 mA 0.1 mA 0.1 mA
Maximum supply voltage (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V
Minimum supply voltage (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 20 20 20 20
width 17 mm 17 mm 17 mm 17 mm 17 mm
Maker IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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