HYS72D64500HR-7F-B datasheet, PDF

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HYS72D64500HR-7F-B: DescriptionDDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184; Categorystorage storage; File Size1MB，39 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/; Environmental Compliance

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HYS72D64500HR-7F-B Overview

DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184

HYS72D64500HR-7F-B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Infineon
Parts packaging code	DIMM
package instruction	DIMM,
Contacts	184
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Maximum access time	0.75 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N184
memory density	4831838208 bit
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	184
word count	67108864 words
character code	64000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64MX72
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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D a t a S h e e t , R e v . 1 . 0 3 , J a n . 2 00 4

HYS72D32500GR–[7F/7/8]–B

HYS72D64500GR–[7F/7/8]–B

HYS72D1285[20/21]GR–[7F/7]–B

HYS72D128521GR–8–B

Registered DDR SDRAM-Modules

D D R SD R A M

M e m or y P r o du c t s

N e v e r

s t o p

t h i n k i n g .

Edition 2004-01

Published by Infineon Technologies AG,

St.-Martin-Strasse 53,

EditionMünchen, Germany

81669 2004-01

Published by Infineon Technologies AG,

Infineon Technologies AG 2004.

St.-Martin-Strasse 53,

81669 München, Germany

Attention Technologies AG 2004.

Infineonplease!

The information herein is given to describe certain components and shall not be considered as a guarantee of

characteristics.

Attention please!

Terms of delivery and rights to technical change reserved.

The hereby disclaim any and all to describe certain components andto warranties considered as a guarantee of

We information herein is given warranties, including but not limited shall not be of non-infringement, regarding

characteristics.

circuits, descriptions and charts stated herein.

Terms of Technologiesrights approved CECC manufacturer.

Infineon delivery and is an to technical change reserved.

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding

circuits, descriptions and charts stated herein.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest

Information

Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide

For further information on technology, delivery terms and conditions and prices please contact your nearest

(www.infineon.com).

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in

Due to technical contact your nearest Infineon Technologies Office. substances. For information on the types in

question please requirements components may contain dangerous

question Technologies Components may only be used in life-support devices or systems with the express written

Infineon please contact your nearest Infineon Technologies Office.

Infineon Technologies Componentsifmay only of such components can reasonably be expected to cause the

approval of Infineon Technologies, a failure be used in life-support devices or systems with the express written

approval of Infineon Technologies, if system, or to affect the safetycaneffectiveness ofexpected to cause the failure

failure of that life-support device or a failure of such components or reasonably be that device or system. Life

of that life-support device or are intended to be implanted in the human body, that device orand/or maintain and

support devices or systems system, or to affect the safety or effectiveness of or to support system. Life support

devices and/or protect human life. Ifbe implanted in the human body, or to support and/or maintain or other

sustain or systems are intended to they fail, it is reasonable to assume that the health of the user and sustain

and/or protectbe endangered. fail, it is reasonable to assume that the health of the user or other persons may

persons may human life. If they

be endangered.

HYS72D64500HR-7F-B Related Products

	HYS72D64500HR-7F-B	HYS72D128521HR-8-B	HYS72D128521HR-7-B	HYS72D64500HR-8-B	HYS72D128520HR-7F-B	HYS72D128520HR-7-B	HYS72D128521HR-7F-B	HYS72D32500HR-7F-B	HYS72D32500HR-8-B
Description	DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 128MX72, 0.8ns, CMOS, DIMM-184	DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 64MX72, 0.8ns, CMOS, DIMM-184	DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 32MX72, 0.8ns, CMOS, DIMM-184
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Infineon	Infineon	Infineon	Infineon	Infineon	Infineon	Infineon	Infineon	Infineon
Parts packaging code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,
Contacts	184	184	184	184	184	184	184	184	184
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	SINGLE BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	SINGLE BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST
Maximum access time	0.75 ns	0.8 ns	0.75 ns	0.8 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.8 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184
memory density	4831838208 bit	9663676416 bit	9663676416 bit	4831838208 bit	9663676416 bit	9663676416 bit	9663676416 bit	2415919104 bi	2415919104 bi
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	72	72	72	72	72	72	72	72	72
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	184	184	184	184	184	184	184	184	184
word count	67108864 words	134217728 words	134217728 words	67108864 words	134217728 words	134217728 words	134217728 words	33554432 words	33554432 words
character code	64000000	128000000	128000000	64000000	128000000	128000000	128000000	32000000	32000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	64MX72	128MX72	128MX72	64MX72	128MX72	128MX72	128MX72	32MX72	32MX72
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	YES	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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