K8S3215ETF-FE7C0 datasheet, PDF

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K8S3215ETF-FE7C0: DescriptionFlash, 2MX16, 70ns, PBGA44, FBGA-44; Categorystorage storage; File Size1020KB，53 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K8S3215ETF-FE7C0 Overview

Flash, 2MX16, 70ns, PBGA44, FBGA-44

K8S3215ETF-FE7C0 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	FBGA, BGA44,8X14,20
Contacts	44
Reach Compliance Code	compliant
Maximum access time	70 ns
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B44
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	1
Number of departments/size	8,63
Number of terminals	44
word count	2097152 words
character code	2000000
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA44,8X14,20
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	1.8 V
Programming voltage	1.8 V
Certification status	Not Qualified
ready/busy	YES
Department size	4K,32K
Maximum standby current	0.00005 A
Maximum slew rate	0.07 mA
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
type	NOR TYPE

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K8S3215ET(B)F

NOR FLASH MEMORY

32Mb F-die SLC NOR Specification

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL

INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar

applications where Product failure could result in loss of life or personal or physical harm, or any military or

defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

Revision 1.2

October 2008

K8S3215ET(B)F

Table Of Contents

32Mb F-die SLC NOR Specification 1

NOR FLASH MEMORY

1. 0 FEATURES................................................................................................................................................................ 3

2. 0 GENERAL DESCRIPTION ........................................................................................................................................ 3

3. 0 PIN DESCRIPTION ................................................................................................................................................... 3

4. 0 PIN CONFIGURATION.............................................................................................................................................. 4

5. 0 FUNCTIONAL BLOCK DIAGRAM............................................................................................................................. 5

6. 0 ORDERING INFORMATION ..................................................................................................................................... 6

7. 0 PRODUCT INTRODUCTION .................................................................................................................................... 8

8. 0 COMMAND DEFINITIONS ........................................................................................................................................ 9

9. 0 DEVICE OPERATION ............................................................................................................................................... 11

9.1. Read Mode ............................................................................................................................................................. 11

9.1.1

Asynchronous Read Mode ................................................................................................................................. 11

9.1.2

Synchronous (Burst) Read Mode ....................................................................................................................... 11

9.2. Output Driver Setting .............................................................................................................................................. 12

9.3. Programmable Wait State....................................................................................................................................... 12

9.4. Handshaking........................................................................................................................................................... 12

9.5. Set Burst Mode Configuration Register .................................................................................................................. 12

9.5.1

Extended Configuration Register (option : K8S3015ET(B)F, K8S3315ET(B)F only) ......................................... 13

9.5.2

Programmable Wait State Configuration............................................................................................................ 13

9.5.3

Burst Read Mode Setting ................................................................................................................................... 13

9.5.4

RDY Configuration ............................................................................................................................................. 13

9.6. Autoselect Mode ..................................................................................................................................................... 13

9.7. Standby Mode......................................................................................................................................................... 14

9.8. Automatic Sleep Mode............................................................................................................................................ 14

9.9. Output Disable Mode .............................................................................................................................................. 14

9.10. Block Protection & Unprotection ........................................................................................................................... 14

9.10.1 Enhanced Block Protection (option : K8S3115ET(B)F, K8S3315ET(B)F only).................................................. 14

9.11. Hardware Reset.................................................................................................................................................... 19

9.12. Software Reset ..................................................................................................................................................... 19

9.13. Program ................................................................................................................................................................ 19

9.14. Accelerated Program Operation ........................................................................................................................... 19

9.15. Unlock Bypass ...................................................................................................................................................... 20

9.16. Chip Erase ............................................................................................................................................................ 20

9.17. Block Erase........................................................................................................................................................... 20

9.18. Erase Suspend / Resume..................................................................................................................................... 21

9.19. Program Suspend / Resume ................................................................................................................................ 21

9.20. Read While Write Operation ................................................................................................................................. 21

9.21. OTP Block Region ................................................................................................................................................ 21

9.22. Low VCC Write Inhibit........................................................................................................................................... 22

9.23. Logical Inhibit........................................................................................................................................................ 22

10. 0 FLASH MEMORY STATUS FLAGS ........................................................................................................................ 23

11. 0 Commom Flash Memory Interface .......................................................................................................................... 25

12. 0 ABSOLUTE MAXIMUM RATINGS

.................................................................................................................... 27

13. 0 RECOMMENDED OPERATING CONDITIONS ( Voltage reference to GND ).....................................................

14. 0 DC CHARACTERISTICS

.................................................................................................................................. 27

15. 0 CAPACITANCE(TA = 25 ×C, VCC = 1.8V, f = 1.0MHz)

..................................................................................... 29

16. 0 AC TEST CONDITION......................................................................................................................................

17. 0 AC CHARACTERISTICS......................................................................................................................................... 30

17.1. Synchronous/Burst Read

............................................................................................................................... 30

17.2. Asynchronous Read.......................................................................................................................................

17.3. Hardware Reset(RESET)

............................................................................................................................... 36

Revision 1.2

October 2008

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