KM418V256AZ-8 datasheet, PDF - EEWORLD Datasheet

KM418V256AZ-8: DescriptionFast Page DRAM, 256KX18, 80ns, CMOS, PZIP40, PLASTIC, ZIP-40; Categorystorage storage; File Size62KB，1 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM418V256AZ-8 Overview

Fast Page DRAM, 256KX18, 80ns, CMOS, PZIP40, PLASTIC, ZIP-40

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	ZIP
package instruction	ZIP, ZIP40,.1
Contacts	40
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	80 ns
Other features	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
I/O type	COMMON
JESD-30 code	R-PZIP-T40
JESD-609 code	e0
memory density	4718592 bit
Memory IC Type	FAST PAGE DRAM
memory width	18
Number of functions	1
Number of ports	1
Number of terminals	40
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	ZIP
Encapsulate equivalent code	ZIP40,.1
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	512
Maximum seat height	12.06 mm
self refresh	NO
Maximum standby current	0.0005 A
Maximum slew rate	0.085 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED
width	2.96 mm

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