K4R571669A/K4R881869A
Change History
Version 1.11( September 2001) - Preliminary
- First Copy
- Based on the Rambus
Datasheet Version 0.9
Direct RDRAM
™
Version 1.2( March 2002) - Preliminary
- Add 1066MHz -32 binning
- Modify VIN from 260mV swing to 300mV
Version 1.3( April 2002) - Preliminary
- Modify Timing Characteristics ( tQR1,tQF1,tPROP1)
- Add Minimum operation temperature at Absolute Maximum Ratings table
Version 1.4( July 2002)
- Combine 800MHz and 1066MHz
- Modify Timing Parameters(tRDP, tRTP)
Page 0
Version 1.4 July 2002
K4R571669A/K4R881869A
Overview
The RDRAM
device is a general purpose high-perfor-
mance memory device suitable for use in a broad range of
applications including computer memory, graphics, video,
and any other application where high bandwidth and low
latency are required.
The 256/288-Mbit RDRAM devices are extremely high-
speed CMOS DRAMs organized as 16M words by 16 or 18
bits. The use of Rambus Signaling Level (RSL) technology
permits up to 1066 MHz transfer rates while using conven-
tional system and board design technologies. RDRAM
devices are capable of sustained data transfers up to 0.938ns
per two bytes (7.5ns per sixteen bytes).
The architecture of RDRAM devices allows the highest
sustained bandwidth for multiple, simultaneous randomly
addressed memory transactions. The separate control and
data buses with independent row and column control yield
over 95% bus efficiency. The RDRAM device's 32 banks
support up to four simultaneous transactions.
System oriented features for mobile, graphics and large
memory systems include power management, byte masking,
and x18 organization. The two data bits in the x18 organiza-
tion are general and can be used for additional storage and
bandwidth or for error correction.
Direct RDRAM
™
SAMSUNG 230
K4RXXXX69A-Fxxx
Figure 1: Direct RDRAM CSP Package
The 256/288-Mbit RDRAM devices are offered in a CSP
horizontal package suitable for desktop as well as low-
profile add-in card and mobile applications.
Key Timing Parameters/Part Numbers
Speed
Organization
t
RAC
I/O
(Row
Bin Freq.
Access
MHz
Time) ns
-CM8
-CK8
-CT9
-CN9
512Kx18x32s
-CM9
-CM8
-CK8
800
800
1066
1066
1066
800
800
40
45
32P
32
35
40
45
Features
♦
Highest sustained bandwidth per DRAM device
Part Number
- 2.1GB/s sustained data transfer rate
- Separate control and data buses for maximized
efficiency
- Separate row and column control buses for
easy scheduling and highest performance
- 32 banks: four transactions can take place simul-
taneously at full bandwidth data rates
♦
Low latency features
512Kx16x32s
a
K4R571669A-F
b
C
c
M8
K4R571669A-FCK8
K4R881869A-FCT9
K4R881869A-FCN9
K4R881869A-FCM9
K4R881869A-FCM8
K4R881869A-FCK8
- Write buffer to reduce read latency
- 3 precharge mechanisms for controller flexibility
- Interleaved transactions
♦
Advanced power management:
- Multiple low power states allows flexibility in power
consumption versus time to transition to active state
- Power-down self-refresh
♦
Organization: 2kbyte pages and 32 banks, x 16/18
a.“32s” - 32 banks which use a
“split”
bank architecture.
b.“F” - WBGA package.
c.“C” - RDRAM core uses normal power self refresh.
- x18 organization allows ECC configurations or
increased storage/bandwidth
- x16 organization for low cost applications
♦
Interleaved Device Mode(IDM) for enhanced system reli-
ability
♦
Uses Rambus Signaling Level (RSL) for up to 1066MHz
operation
Page 1
Version 1.4 July 2002
K4R571669A/K4R881869A
Direct RDRAM
™
Table 2: Pin Description
Signal
I/O
Type
CMOS
a
# Pins
center
2
Description
Serial input/output. Pins for reading from and writing to the control regis-
ters using a serial access protocol. Also used for power management.
Command input. Pins used in conjunction with SIO0 and SIO1 for reading
from and writing to the control registers. Also used for power manage-
ment.
Serial clock input. Clock source used for reading from and writing to the
control registers
Supply voltage for the RDRAM core and interface logic.
Supply voltage for the RDRAM analog circuitry.
Supply voltage for CMOS input/output pins.
Ground reference for RDRAM core and interface.
Ground reference for RDRAM analog circuitry.
Data byte A. Nine pins which carry a byte of read or write data between
the Channel and the RDRAM device. DQA8 is not used (no connection)
by RDRAM devices with a x16 organization.
Clock from master. Interface clock used for receiving RSL signals from
the Channel. Positive polarity.
Clock from master. Interface clock used for receiving RSL signals from
the Channel. Negative polarity
Logic threshold reference voltage for RSL signals
Clock to master. Interface clock used for transmitting RSL signals to the
Channel. Negative polarity.
Clock to master. Interface clock used for transmitting RSL signals to the
Channel. Positive polarity.
Row access control. Three pins containing control and address informa-
tion for row accesses.
Column access control. Five pins containing control and address informa-
tion for column accesses.
Data byte B. Nine pins which carry a byte of read or write data between
the Channel and the RDRAM device. DQB8 is not used (no connection)
by RDRAM devices with a x16 organization.
SIO1,SIO0
I/O
CMD
I
CMOS
a
1
SCK
V
DD
V
DDa
V
CMOS
GND
GNDa
DQA8..DQA0
I
CMOS
a
1
24
1
2
28
2
I/O
RSL
b
9
CFM
CFMN
V
REF
CTMN
CTM
RQ7..RQ5 or
ROW2..ROW0
RQ4..RQ0 or
COL4..COL0
DQB8..
DQB0
I
I
RSL
b
RSL
b
1
1
1
I
I
I
I
RSL
b
RSL
b
RSL
b
RSL
b
1
1
3
5
I/O
RSL
b
9
92
Total pin count per package
a. All CMOS signals are high-true; a high voltage is a logic one and a low voltage is logic zero.
b. All RSL signals are low-true; a low voltage is a logic one and a high voltage is logic zero.
Page 3
Version 1.4 July 2002
Microcontroller MCU
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