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TM124FBK32H-60

Description
1MX32 EDO DRAM MODULE, 60ns, SMA72, SIMM-72
Categorystorage    storage   
File Size135KB,9 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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TM124FBK32H-60 Overview

1MX32 EDO DRAM MODULE, 60ns, SMA72, SIMM-72

TM124FBK32H-60 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Contains lead
MakerTexas Instruments
Parts packaging codeSIMM
package instructionSIMM, SSIM72
Contacts72
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE WITH EDO
Maximum access time60 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
Spare memory width16
I/O typeCOMMON
JESD-30 codeR-XSMA-N72
memory density33554432 bit
Memory IC TypeEDO DRAM MODULE
memory width32
Number of functions1
Number of ports1
Number of terminals72
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX32
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeSIMM
Encapsulate equivalent codeSSIM72
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply5 V
Certification statusNot Qualified
refresh cycle1024
Maximum seat height25.4 mm
self refreshNO
Maximum standby current0.002 A
Maximum slew rate0.32 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationSINGLE

TM124FBK32H-60 Related Products

TM124FBK32H-60 TM248GBK32I-60
Description 1MX32 EDO DRAM MODULE, 60ns, SMA72, SIMM-72 2MX32 EDO DRAM MODULE, 60ns, SMA72, SIMM-72
Brand Name Texas Instruments Texas Instruments
Is it lead-free? Contains lead Contains lead
Parts packaging code SIMM SIMM
package instruction SIMM, SSIM72 SIMM, SSIM72
Contacts 72 72
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
access mode FAST PAGE WITH EDO FAST PAGE WITH EDO
Maximum access time 60 ns 60 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
Spare memory width 16 16
I/O type COMMON COMMON
JESD-30 code R-XSMA-N72 R-XSMA-N72
memory density 33554432 bit 67108864 bit
Memory IC Type EDO DRAM MODULE EDO DRAM MODULE
memory width 32 32
Number of functions 1 1
Number of ports 1 1
Number of terminals 72 72
word count 1048576 words 2097152 words
character code 1000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 1MX32 2MX32
Output characteristics 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code SIMM SIMM
Encapsulate equivalent code SSIM72 SSIM72
Package shape RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
refresh cycle 1024 1024
Maximum seat height 25.4 mm 25.4 mm
self refresh NO NO
Maximum standby current 0.002 A 0.004 A
Maximum slew rate 0.32 mA 0.64 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm
Terminal location SINGLE SINGLE
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