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PEEL18CV8SI-15L

Description
EE PLD, 15ns, PAL-Type, CMOS, PDSO20, 0.300 INCH, LEAD FREE, SOIC-20
CategoryProgrammable logic devices    Programmable logic   
File Size645KB,9 Pages
ManufacturerDiodes
Websitehttp://www.diodes.com/
Environmental Compliance
Download Datasheet Parametric View All

PEEL18CV8SI-15L Overview

EE PLD, 15ns, PAL-Type, CMOS, PDSO20, 0.300 INCH, LEAD FREE, SOIC-20

PEEL18CV8SI-15L Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeSOIC
package instructionSOP, SOP20,.4
Contacts20
Reach Compliance Codeunknow
ArchitecturePAL-TYPE
maximum clock frequency41.6 MHz
JESD-30 codeR-PDSO-G20
JESD-609 codee3
length12.8 mm
Humidity sensitivity level3
Dedicated input times9
Number of I/O lines8
Number of entries18
Output times8
Number of product terms74
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize9 DEDICATED INPUTS, 8 I/O
Output functionMACROCELL
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP20,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
power supply5 V
Programmable logic typeEE PLD
propagation delay15 ns
Certification statusNot Qualified
Maximum seat height2.64 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.5 mm
Base Number Matches1
Not recommended for New designs -
contact factory for availability
PEEL™ 18CV8 -7/-10/-15/-25
CMOS Programmable Electrically Erasable Logic Device
Features
Multiple Speed Power, Temperature Options
- V
CC
= 5 Volts ±10%
- Speeds ranging from 7ns to 25 ns
- Power as low as 37mA at 25MHz
- Commercial and industrial versions available
CMOS Electrically Erasable Technology
- Superior factory testing
- Reprogrammable in plastic package
- Reduces retrofit and development costs
Development / Programmer Support
- Third party software and programmers
- WinPLACE Development Software
- PLD-to-PEEL™ JEDEC file translator
Architectural Flexibility
- Enhanced architecture fits in more logic
- 74 product terms x 36 input AND array
- 10 inputs and 8 I/O pins
- 12 possible macrocell configurations
- Asynchronous clear
- Independent output enables
- 20 Pin DIP/SOIC/TSSOP and PLCC
Application Versatility
- Replaces random logic
- Super sets PLDs (PAL, GAL, EPLD)
- Enhanced Architecture fits more logic than ordinary PLDs
General Description
The PEEL™18CV8 is a Programmable Electrically Erasable
Logic (PEEL™) device providing an attractive alternative to
ordinary PLDs. The PEEL™18CV8 offers the performance, flex-
ibility, ease of design and production practicality needed by logic
designers today.
The PEEL™18CV8 is available in 20-pin DIP, PLCC, SOIC and
TSSOP packages with speeds ranging from 7ns to 25ns with
power consumption as low as 37mA. EE-Reprogrammability
provides the convenience of instant reprogramming for develop-
ment and reusable production inventory minimizing the impact of
programming changes or errors. EE-Reprogrammability also
improves factory testability, thus assuring the highest quality pos-
sible.
The PEEL™18CV8 architecture allows it to replace over 20 stan-
dard 20-pin PLDs (PAL, GAL, EPLD etc.). It also provides addi-
tional architecture features so more logic can be put into every
design. Anachip’s JEDEC file translator instantly converts to the
PEEL™18CV8 existing 20-pin PLDs without the need to rework
the existing design. Development and programming support for the
PEEL™18CV8 is provided by popular third-party program- mers
and development software.
Figure 3 Block Diagram
Figure 2 Pin Configuration
I/CLK
I
I
I
I
I
I
I
I
GND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
DIP
TSSOP
PLCC
SOIC
This datasheet contains new product information. Anachip Corp. reserves the rights to modify the product specification without notice. No liability is assumed as a result of the use of this product. No rights under any patent
accompany the sale of the product.
Rev. 1.0 Dec 16, 2004
1/9
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