Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SC70
Junction-to-Ambient Thermal Resistance (Θ
JA
).............324°C/W
Junction-to-Case Thermal Resistance (Θ
JC
)..................115°C/W
SOT23
Junction-to-Ambient Thermal Resistance (Θ
JA
)..........255.9°C/W
Junction-to-Case Thermal Resistance (Θ
JC
)....................81°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
DC ELECTRICAL CHARACTERISTICS—2.7V OPERATION
(V
DD
= 2.7V, V
SS
= 0V, V
CM
= 0V, R
L
= 5.1kI connected to V
DD
, typical values are at T
A
= +25NC, unless otherwise noted.
Boldface
limits apply at the defined temperature extremes.) (Note 2)
PARAMETER
Input Offset Voltage
Input Voltage Hysteresis
Input Offset Voltage Average
Temperature Drift
Input Bias Current
SYMBOL
V
OS
V
HYST
TCV
OS
T
A
= +25NC
I
B
T
A
= -40NC to +85NC
T
A
= -40NC to +125NC
T
A
= +25NC
Input Offset Current
I
OS
T
A
= -40NC to +85NC
T
A
= -40NC to +125NC
Input Voltage Range
Voltage Gain
Output Saturation Voltage
Output Sink Current
Supply Current
Output Leakage Current
V
CM
A
V
V
SAT
I
O
I
S
MAX9647 only
I
SINK
P
1mA
V
O
P
1.5V
(Note 3)
T
A
= +25NC
T
A
= -40NC to +85NC
T
A
= -40NC to +125NC
5
-0.1
2.0
500
25
16
52
0.005
1
2
FA
100
Q0.0003
MAX9648 only
CONDITIONS
MIN
TYP
0.4
2
1.5
Q0.0003
Q250
±400
±400
Q50
±150
±150
V
V/mV
mV
mA
FA
nA
nA
MAX
7
UNITS
mV
mV
FV/NC
Maxim Integrated
2
MAX9647/MAX9648
General-Purpose, Low-Voltage,
Tiny Pack Comparators
AC ELECTRICAL CHARACTERISTICS—2.7V OPERATION
(V
DD
= 2.7V, V
SS
= 0V, V
CM
= 0V, R
L
= 5.1kI connected to V
DD
, typical values are at T
A
= +25NC, unless otherwise noted.
Boldface
limits apply at the defined temperature extremes.) (Note 2)
PARAMETER
Propagation Delay Output
High to Low (Note 4)
Propagation Delay Output
Low to High (Note 4)
SYMBOL
t
PHL
t
PLH
CONDITIONS
Input overdrive = 10mV
Input overdrive = 100mV
Input overdrive = 10mV
Input overdrive = 100mV
MIN
TYP
70
50
115
100
MAX
UNITS
ns
ns
DC ELECTRICAL CHARACTERISTICS–5.0V OPERATION
(V
DD
= 5V, V
SS
= 0V, V
CM
= 0V, R
L
= 5.1kI connected to V
DD
, typical values are at T
A
= +25NC, unless otherwise noted.
Boldface
limits apply at the defined temperature extremes.) (Note 2)
PARAMETER
Input Offset Voltage
Input Voltage Hysteresis
Input Offset Voltage Average
Temperature Drift
Input Bias Current
SYMBOL
T
A
= +25NC
V
OS
T
A
= -40NC to +85NC
T
A
= -40NC to +125NC
MAX9648 only
TCV
OS
T
A
= +25NC
I
B
T
A
= -40NC to +85NC
T
A
= -40NC to +125NC
T
A
= +25NC
Input Offset Current
I
OS
T
A
= -40NC to +85NC
T
A
= -40NC to +125NC
Input Voltage Range
Voltage Gain
Output Saturation Voltage
Output Sink Current
Supply Current (Note 3)
V
CM
A
V
V
SAT
I
O
I
S
MAX9647 only
T
A
= +25NC
I
SINK
P
4mA
V
O
P
1.5V
T
A
= +25NC
T
A
= -40NC to +85NC
T
A
= -40NC to +125NC
T
A
= +25NC
Output Leakage Current
T
A
= -40NC to +85NC
T
A
= -40NC to +125NC
0.005
1
2
FA
T
A
= -40NC to +85NC
T
A
= -40NC to +125NC
10
35
60
120
150
170
FA
20
-0.1
4.2
500
120
400
700
700
mA
mV
Q0.007
2
1.5
Q0.007
Q250
±400
±400
Q50
±150
±150
V
V/mV
nA
nA
CONDITIONS
MIN
TYP
0.4
MAX
7
9
9
mV
FV/NC
mV
UNITS
Maxim Integrated
3
MAX9647/MAX9648
General-Purpose, Low-Voltage,
Tiny Pack Comparators
AC ELECTRICAL CHARACTERISTICS–5.0V OPERATION
(V
DD
= 5V, V
SS
= 0V, V
CM
= 0V, R
L
= 5.1kI connected to V
DD
, typical values are at T
A
= +25NC, unless otherwise noted.
Boldface
limits apply at the defined temperature extremes.) (Note 2)
PARAMETER
Propagation Delay Output
High to Low (Note 4)
Propagation Delay Output
Low to High (Note 4)
SYMBOL
t
PHL
t
PLH
CONDITIONS
Input overdrive = 10mV
Input overdrive = 100mV
Input overdrive = 10mV
Input overdrive = 100mV
MIN
TYP
70
50
110
100
MAX
UNITS
ns
ns
DC ELECTRICAL CHARACTERISTICS—1.8V OPERATION
(V
DD
= 1.8V, V
SS
= 0V, V
CM
= 0V, R
L
= 5.1kI connected to V
DD
, typical values are at T
A
= +25NC, unless otherwise noted.
Boldface
limits apply at the defined temperature extremes.) (Note 2)
PARAMETER
Input Offset Voltage
Input Voltage Hysteresis
Input Offset Voltage Average
Temperature Drift
Input Bias Current
Input Offset Current
Input Voltage Range
Output Saturation Voltage
Power-Supply Rejection Ratio
Output Sink Current
Supply Current
Output Leakage Current
TCV
OS
I
B
I
OS
V
CM
V
SAT
PSRR
I
O
I
S
I
SINK
P
1mA
V
DD
= 1.8V to 5.5V
V
O
P
1.5V
(Note 3)
60
SYMBOL
V
OS
MAX9648 only
CONDITIONS
MIN
TYP
0.4
2
1.5
0.0003
0.0003
-0.1
1
56
90
6.4
50
0.001
100
MAX
5
UNITS
mV
mV
FV/NC
nA
nA
V
mV
dB
mA
FA
FA
AC ELECTRICAL CHARACTERISTICS—1.8V OPERATION
(V
DD
= 1.8V, V
SS
= 0V, V
CM
= 0V, R
L
= 5.1kI connected to V
DD
, typical values are at T
A
= +25NC, unless otherwise noted.
Boldface
limits apply at the defined temperature extremes.) (Note 2)
PARAMETER
Propagation Delay Output
High to Low (Note 4)
Propagation Delay Output
Low to High (Note 4)
SYMBOL
t
PHL
t
PLH
CONDITIONS
Input overdrive = 10mV
Input overdrive = 100mV
Input overdrive = 10mV
Input overdrive = 100mV
MIN
TYP
70
60
120
110
MAX
UNITS
ns
ns
Note 2:
All devices are production tested at T
A
= +25NC. All temperature limits are guaranteed by design.
Note 3:
Supply current when output is high.
Note 4:
Input overdrive is the overdrive voltage beyond the offset and hysteresis-determined trip points.
introduction
Since the beginning of the 21st century, the world of information has changed rapidly. Maybe a high-tech product will be released today and a better similar product will be releas...[Details]
The Portable Digital Data Acquisition System (PDDAS) uses LabVIEW Real-Time and PXI to control the wind tunnel test and record air pressure data from 128 different channels.
"The LabVIEW Real-...[Details]
This paper designs a dot matrix LED text display screen that is easy to update, expandable, and low-cost. The way to reduce costs is
① Use the Bluetooth data transmission function of mobile ph...[Details]
1. Introduction
With the gradual automation and modernization of industrial control systems, fieldbus control systems have received more and more attention and application. CAN bus is currentl...[Details]
I. Introduction
Since RS232 has a short communication distance (only 15 meters according to EAT/TAI-232 standard), and can only perform point-to-point communication, it cannot directly f...[Details]
1 Introduction
PROFIBUS is an international, open, and manufacturer-independent fieldbus standard. It is widely used in manufacturing automation, process industry automation, and automatio...[Details]
1 Introduction
The Third Steel Plant of Jigang Group is a key investment project of Jigang Group during the "15th Five-Year Plan". It has introduced first-class domestic and foreign advanced eq...[Details]
PV inverter manufacturer SMA has launched its first DC arc fault circuit interrupter (AFCI) PV inverter and has received UL certification.
The new SunnyBoy AFCI inverter models include 3000-US...[Details]
Digital array radar (DAR) uses digital beam forming (DBF) in both receiving and transmitting modes to achieve flexible distribution and reception of RF signal power in the airspace, obtain excellent t...[Details]
TC9012F is a universal CMOS large-scale integrated circuit for infrared remote control signal transmission, suitable for remote control of TV, VTR, laser player and other equipment. In the market, ...[Details]
Spatial Division Multiplexing (SDM) MIMO processing can significantly improve spectrum efficiency and thus greatly increase the capacity of wireless communication systems. Spatial Division Multip...[Details]
LED light sources have many environmental advantages, but early products still have certain technical bottlenecks in heat dissipation and high brightness design that cannot be broken through....[Details]
0 Introduction
High-precision current source can provide high-precision current supply for precision instruments, and is suitable for automatic measurement tasks of various resistors in semico...[Details]
0 Introduction
Under normal circumstances, the three-phase power in the power system is symmetrical, and they meet certain amplitude and phase conditions; but when the load changes, the syst...[Details]
introduction
LEDs continue to gain popularity in automotive applications, thanks to their long lifespan and the flexibility they offer for body styling and interior design. Some may be surpris...[Details]
京公网安备 11010802033920号
EEWORLD
