SMJ55161-70GBM datasheet, PDF - EEWORLD Datasheet

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SMJ55161-70GBM: Description256KX16 VIDEO DRAM, 70ns, CPGA68, CERAMIC, PGA-68; Categorystorage storage; File Size2MB，61 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SMJ55161-70GBM Overview

256KX16 VIDEO DRAM, 70ns, CPGA68, CERAMIC, PGA-68

SMJ55161-70GBM Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	PGA
package instruction	PGA, PGA68,9X9
Contacts	68
Reach Compliance Code	not_compliant
ECCN code	EAR99
access mode	FAST PAGE WITH EDO
Maximum access time	70 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT
JESD-30 code	S-CPGA-P68
length	24.38 mm
memory density	4194304 bit
Memory IC Type	VIDEO DRAM
memory width	16
Number of functions	1
Number of ports	2
Number of terminals	68
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256KX16
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA68,9X9
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
refresh cycle	512
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.012 A
Maximum slew rate	0.225 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	24.38 mm

SMJ55161-70GBM Related Products

	SMJ55161-70GBM	5962-9454901MXA	5962-9454901MYA	SMJ55161-70HKCM
Description	256KX16 VIDEO DRAM, 70ns, CPGA68, CERAMIC, PGA-68	256KX16 VIDEO DRAM, 80ns, CPGA68, CERAMIC, PGA-68	IC 256K X 16 VIDEO DRAM, 80 ns, DFP64, Dynamic RAM	256KX16 VIDEO DRAM, 70ns, CDFP64, CERAMIC, DFP-64
package instruction	PGA, PGA68,9X9	PGA, PGA68,9X9	DFP,	GDFP, TPAK64,1.6SQ,20
Reach Compliance Code	not_compliant	not_compliant	unknown	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO
Maximum access time	70 ns	80 ns	80 ns	70 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT
JESD-30 code	S-CPGA-P68	S-CPGA-P68	R-XDFP-F64	R-CDFP-F64
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	VIDEO DRAM	VIDEO DRAM	VIDEO DRAM	VIDEO DRAM
memory width	16	16	16	16
Number of functions	1	1	1	1
Number of ports	2	2	2	2
Number of terminals	68	68	64	64
word count	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	256KX16	256KX16	256KX16	256KX16
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA	PGA	DFP	GDFP
Package shape	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	FLATPACK	FLATPACK, GUARD RING
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	PIN/PEG	PIN/PEG	FLAT	FLAT
Terminal pitch	2.54 mm	2.54 mm	0.5 mm	0.5 mm
Terminal location	PERPENDICULAR	PERPENDICULAR	DUAL	DUAL
Is it Rohs certified?	incompatible	incompatible	-	incompatible
Parts packaging code	PGA	PGA	-	DFP
Contacts	68	68	-	64
length	24.38 mm	-	18.985 mm	18.985 mm
Encapsulate equivalent code	PGA68,9X9	PGA68,9X9	-	TPAK64,1.6SQ,20
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
power supply	5 V	5 V	-	5 V
Filter level	38535Q/M;38534H;883B	MIL-STD-883	-	38535Q/M;38534H;883B
Maximum standby current	0.012 A	0.012 A	-	0.012 A
Maximum slew rate	0.225 mA	0.195 mA	-	0.225 mA
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
width	24.38 mm	-	10.985 mm	10.985 mm

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