M95512-DRDW6G datasheet, PDF - EEWORLD Datasheet

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M95512-DRDW6G: Description64KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.169 INCH, ROHS COMPLIANT, TSSOP-8; Categorystorage storage; File Size2MB，50 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M95512-DRDW6G Overview

64KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.169 INCH, ROHS COMPLIANT, TSSOP-8

M95512-DRDW6G Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	SOIC
package instruction	0.169 INCH, ROHS COMPLIANT, TSSOP-8
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	5 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
length	4.4 mm
memory density	524288 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	65536 words
character code	64000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2/5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Serial bus type	SPI
Maximum standby current	0.000005 A
Maximum slew rate	0.008 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE/SOFTWARE

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M95512-W M95512-R

M95512-DR M95512-DF

512-Kbit serial SPI bus EEPROM

Datasheet

production data

Features

•

Compatible with the Serial Peripheral Interface

(SPI) bus

SO8 (MN)

150 mil width

•

Memory array

– 512 Kb (64 Kbytes) of EEPROM

– Page size: 128 bytes

•

Write

– Byte Write within 5 ms

– Page Write within 5 ms

TSSOP8 (DW)

169 mil width

•

Additional Write lockable page (Identification

page)

•

Write Protect: quarter, half or whole memory

array

•

High-speed clock: 16 MHz

•

Single supply voltage:

– 2.5 V to 5.5 V for M95512-W

– 1.8 V to 5.5 V for M95512-R and M95512-

– 1.7 V to 5.5 V for M95512-DF

•

Operating temperature range: from -40°C up to

+85°C

UFDFPN8

2 x 3 mm (MC)

WLCSP (CS)

(preliminary data)

•

Enhanced ESD protection

•

More than 4 million Write cycles

•

More than 200-year data retention

•

Packages

– RoHS compliant and halogen-free

(ECOPACK

)

June 2013

This is information on a product in full production.

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www.st.com

Contents

M95512-W M95512-R M95512-DR M95512-DF

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

Serial Data Output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Connecting to the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.1

SPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.1

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.1.1

5.1.2

5.1.3

5.1.4

Operating supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.2

5.3

5.4

5.5

Active Power and Standby Power modes . . . . . . . . . . . . . . . . . . . . . . . . 14

Hold condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Data protection and protocol control . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.1

6.2

6.3

Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6.3.1

WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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6.3.2

6.3.3

6.3.4

Contents

WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

SRWD bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6.4

6.5

6.6

6.7

6.8

6.9

6.10

Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Read from Memory Array (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Write to Memory Array (WRITE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6.6.1

Cycling with Error Correction Code (ECC) . . . . . . . . . . . . . . . . . . . . . . 25

Read Identification Page (available only in M95512-D devices) . . . . . . . 26

Write Identification Page (available only in M95512-D devices) . . . . . . . 27

Read Lock Status (available only in M95512-D devices) . . . . . . . . . . . . . 28

Lock ID (available only in M95512-D devices) . . . . . . . . . . . . . . . . . . . . . 29

Power-up and delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

7.1

7.2

Power-up state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

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List of tables

M95512-W M95512-R M95512-DR M95512-DF

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Write-protected block size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

M95512-D instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Status Register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Protection modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Operating conditions (M95512-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Operating conditions (M95512-R and M95512-DR, device grade 6) . . . . . . . . . . . . . . . . . 32

Operating conditions (M95512-DF, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Cycling performance by groups of four bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

DC characteristics (previous M95512-W products, device grade 6). . . . . . . . . . . . . . . . . . 34

DC characteristics (M95512-W products, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . 35

DC characteristics (M95512-R and M95512-DR products, device grade 6). . . . . . . . . . . . 36

DC characteristics (M95512-DF products, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . 37

AC characteristics (previous M95512-W products, device grade 6) . . . . . . . . . . . . . . . . . . 38

AC characteristics (M95512-W products, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . 39

AC characteristics (M95512-R and M95512-DF, device grade 6) . . . . . . . . . . . . . . . . . . . 40

SO8N – 8-lead plastic small outline, 150 mils body width, mechanical data . . . . . . . . . . . 42

TSSOP8 – 8-lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 43

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

M95512-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package mechanical data. 46

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

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List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Figure 20.

Figure 21.

Figure 22.

Figure 23.

Figure 24.

Figure 25.

Figure 26.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

WLCSP connections for M95512-DFCS6TP/K

(top view, marking side, with bumps on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Bus master and memory devices on the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Hold condition activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Write Enable (WREN) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Disable (WRDI) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Read Status Register (RDSR) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Write Status Register (WRSR) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Read from Memory Array (READ) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Byte Write (WRITE) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Page Write (WRITE) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Read Identification Page sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Write identification page sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Read Lock Status sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Lock ID sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Serial output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

SO8N – 8-lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 42

TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 43

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat no lead, package outline. . . . . . . 44

M95512-DFCS6TP/K – WLCSP 8-bump wafer-level chip scale package outline . . . . . . . 45

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M95512-DRDW6G Related Products

	M95512-DRDW6G	M95512-DRDW6P	M95512-DRMN6G	M95512-DRMN6TG	M95512-DRDW6TG
Description	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.169 INCH, ROHS COMPLIANT, TSSOP-8	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.169 INCH, ROHS COMPLIANT, TSSOP-8	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.169 INCH, ROHS COMPLIANT, TSSOP-8
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	0.169 INCH, ROHS COMPLIANT, TSSOP-8	0.169 INCH, ROHS COMPLIANT, TSSOP-8	SOP, SOP8,.25	SOP, SOP8,.25	0.169 INCH, ROHS COMPLIANT, TSSOP-8
Contacts	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz
Data retention time - minimum	40	40	40	40	40
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
length	4.4 mm	4.4 mm	4.9 mm	4.9 mm	4.4 mm
memory density	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	8	8	8	8	8
word count	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	64KX8	64KX8	64KX8	64KX8	64KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	TSSOP	SOP	SOP	TSSOP
Encapsulate equivalent code	TSSOP8,.25	TSSOP8,.25	SOP8,.25	SOP8,.25	TSSOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.75 mm	1.75 mm	1.2 mm
Serial bus type	SPI	SPI	SPI	SPI	SPI
Maximum standby current	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
Maximum slew rate	0.008 mA	0.008 mA	0.008 mA	0.008 mA	0.008 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	1.27 mm	1.27 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	3 mm	3 mm	3.9 mm	3.9 mm	3 mm
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

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