MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP2-32
| Parameter Name | Attribute value |
| Maker | SHARP |
| package instruction | 8 X 20 MM, PLASTIC, TSOP2-32 |
| Reach Compliance Code | unknown |
| Maximum access time | 120 ns |
| JESD-30 code | R-PDSO-G32 |
| length | 18.4 mm |
| memory density | 4194304 bit |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP1 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| width | 8 mm |
| LH534R00T-12 | LH534R00D-12 | LH534R00N-12 | |
|---|---|---|---|
| Description | MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP2-32 | MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 |
| Maker | SHARP | SHARP | SHARP |
| package instruction | 8 X 20 MM, PLASTIC, TSOP2-32 | 0.600 INCH, PLASTIC, DIP-32 | 0.525 INCH, PLASTIC, SOP-32 |
| Reach Compliance Code | unknown | unknown | unknown |
| Maximum access time | 120 ns | 120 ns | 120 ns |
| JESD-30 code | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 |
| length | 18.4 mm | 41 mm | 20.6 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 |
| word count | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 512KX8 | 512KX8 | 512KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP1 | DIP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 5.2 mm | 3.1 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING |
| Terminal pitch | 0.5 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL |
| width | 8 mm | 15.24 mm | 11.3 mm |
京公网安备 11010802033920号
EEWORLD
