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KM23C4000AG-12

Description
MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32
Categorystorage    storage   
File Size93KB,4 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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KM23C4000AG-12 Overview

MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32

KM23C4000AG-12 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeSOIC
package instructionSOP, SOP32,.56
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time120 ns
JESD-30 codeR-PDSO-G32
JESD-609 codee0
length20.47 mm
memory density4194304 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP32,.56
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height3 mm
Maximum standby current0.00005 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm

KM23C4000AG-12 Related Products

KM23C4000AG-12 KM23C4000A-12
Description MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker SAMSUNG SAMSUNG
Parts packaging code SOIC DIP
package instruction SOP, SOP32,.56 DIP, DIP32,.6
Contacts 32 32
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Maximum access time 120 ns 120 ns
JESD-30 code R-PDSO-G32 R-PDIP-T32
JESD-609 code e0 e0
length 20.47 mm 41.91 mm
memory density 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
memory width 8 8
Number of functions 1 1
Number of terminals 32 32
word count 524288 words 524288 words
character code 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 512KX8 512KX8
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP
Encapsulate equivalent code SOP32,.56 DIP32,.6
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum seat height 3 mm 5.08 mm
Maximum standby current 0.00005 A 0.00005 A
Maximum slew rate 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount YES NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 11.43 mm 15.24 mm
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