HY23C04000D-100 datasheet, PDF

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HY23C04000D-100: DescriptionMASK ROM, 512KX8, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32; Categorystorage storage; File Size83KB，6 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY23C04000D-100 Overview

MASK ROM, 512KX8, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

HY23C04000D-100 Parametric

Parameter Name	Attribute value
Maker	SK Hynix
Parts packaging code	DIP
package instruction	DIP, DIP32,.6
Contacts	32
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	100 ns
JESD-30 code	R-PDIP-T32
length	41.91 mm
memory density	4194304 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.826 mm
Maximum standby current	0.00005 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

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HY23C04000

Description

512KX8 BIT

CMOS MASK ROM

The HY23C04000 high performance read only memory is organized 524,288 x 8 bit (byte mode) and has

an access time of 70/100/120ns. The low power feature allows the battery operation. The large size

of 4M bit memory density is ideal for charactergenerator, data or program memory in micro-processor

application. The HY23C04000 is packaged 32pin DIP or 32 pin SOP.

Key features

• 524,288 X 8bit organiszation

• Single 5V power supply operation

• Access Time : 70/100/120ns (Max)

• Standby Current : 50 (Max)

• Operating Current : 60 (Max)

• TTL compatible inputs and outputs

• 3-State outputs for wired-OR expansion

• Programmable CE or OE pin

• Fully static operation

• Package

HY23C04000D : 32pin Plastic DIP(600 mil)

HY23C04000S : 32pin Plastic SOP(500mil)

Pin Description

A0~A18

Q0~Q7

CEB*

OEB*

VCC

VSS

Function

Address inputs

Data Outputs

Chip Enable input

Output Enable input

Power supply

Ground

* User selectable polarity

• CEB : CE/CEB

• OEB : OE/OEB

Pin Configuration

A16

A15

A12

VSS

32DIP

VCC

A18

A17

A14

A13

A11

OEB

A10

CEB

A16

A15

A12

VSS

32SOP

VCC

A18

A17

A14

A13

A11

OEB

A10

CEB

HY23C04000D

HY23C04000S

Rev0 Page 1 of 6

HY23C04000D-100 Related Products

	HY23C04000D-100	HY23C04000S-120	HY23C04000S-70	HY23C04000S-100	HY23C04000D-120
Description	MASK ROM, 512KX8, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 0.500 INCH, PLASTIC, SOP-32	MASK ROM, 512KX8, 70ns, CMOS, PDSO32, 0.500 INCH, PLASTIC, SOP-32	MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.500 INCH, PLASTIC, SOP-32	MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	DIP	SOIC	SOIC	SOIC	DIP
package instruction	DIP, DIP32,.6	SOP, SOP32,.56	SOP, SOP32,.56	SOP, SOP32,.56	DIP, DIP32,.6
Contacts	32	32	32	32	32
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	100 ns	120 ns	70 ns	100 ns	120 ns
JESD-30 code	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32
length	41.91 mm	20.4978 mm	20.4978 mm	20.4978 mm	41.91 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	32	32	32	32	32
word count	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
organize	512KX8	512KX8	512KX8	512KX8	512KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	SOP	DIP
Encapsulate equivalent code	DIP32,.6	SOP32,.56	SOP32,.56	SOP32,.56	DIP32,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.826 mm	2.769 mm	2.769 mm	2.769 mm	4.826 mm
Maximum standby current	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A
Maximum slew rate	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	11.2015 mm	11.2015 mm	11.2015 mm	15.24 mm

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