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HSMP-386F-BLKG

Description
50 V, SILICON, PIN DIODE
CategoryDiscrete semiconductor    diode   
File Size234KB,10 Pages
ManufacturerAVAGO
Websitehttp://www.avagotech.com/
Environmental Compliance
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HSMP-386F-BLKG Overview

50 V, SILICON, PIN DIODE

HSMP-386F-BLKG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAVAGO
Parts packaging codeSC-70
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresLOW DISTORTION
applicationATTENUATOR; SWITCHING
Minimum breakdown voltage50 V
ConfigurationCOMMON CATHODE, 2 ELEMENTS
Nominal diode capacitance0.2 pF
Diode component materialsSILICON
Maximum diode forward resistance22 Ω
Diode resistance test current1 mA
Diode resistance test frequency100 MHz
Diode typePIN DIODE
JESD-30 codeR-PDSO-G3
JESD-609 codee3
Minority carrier nominal lifetime0.5 µs
Humidity sensitivity level1
Number of components2
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Reverse test voltage50 V
surface mountYES
technologyPOSITIVE-INTRINSIC-NEGATIVE
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
HSMP-386x
Surface Mount PIN Diodes
Data Sheet
Description/Applications
The HSMP-386x series of general purpose PIN diodes are
designed for two classes of applications. The first is attenu-
ators where current consumption is the most important
design consideration. The second application for this
series of diodes is in switches where low capacitance is the
driving issue for the designer.
The HSMP-386x series Total Capacitance (C
T
) and Total
Resistance (R
T
) are typical specifications. For applications
that require guaranteed performance, the general purpose
HSMP-383x series is recommended.
A SPICE model is not available for PIN diodes as SPICE
does not provide for a key PIN diode characteristic, carrier
lifetime.
Features
Unique Configurations in Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
Switching
– Low Distortion Switching
– Low Capacitance
Attenuating
– Low Current Attenuating for Less Power
Consumption
Matched Diodes for Consistent Performance
Better Thermal Conductivity for Higher Power
Dissipation
Low Failure in Time (FIT) Rate
[1]
Lead-free
Note:
1. For more information see the Surface Mount PIN Reliability Data
Sheet.
Pin Connections and Package Marking, SOT-363
1
2
3
6
5
4
LUx
Notes:
1. Package marking provides orientation, identification, and date code.
2. See “Electrical Specifications” for appropriate package marking.

HSMP-386F-BLKG Related Products

HSMP-386F-BLKG HSMP-3860-BLKG HSMP-3862-BLKG HSMP-3863-BLKG HSMP-3864-BLKG HSMP-386B-BLKG HSMP-386C-BLKG HSMP-386E-BLKG HSMP-386L-BLKG
Description 50 V, SILICON, PIN DIODE 50 V, SILICON, PIN DIODE 50 V, SILICON, PIN DIODE 50 V, SILICON, PIN DIODE 50 V, SILICON, PIN DIODE 50 V, SILICON, PIN DIODE 50 V, SILICON, PIN DIODE 50 V, SILICON, PIN DIODE 50 V, SILICON, PIN DIODE
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to
Maker AVAGO AVAGO AVAGO AVAGO AVAGO AVAGO AVAGO AVAGO AVAGO
package instruction R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G6
Contacts 3 3 3 3 3 3 3 3 6
Reach Compliance Code compli compliant compliant compliant compli compli compli compliant compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Other features LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION
application ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING
Minimum breakdown voltage 50 V 50 V 50 V 50 V 50 V 50 V 50 V 50 V 50 V
Configuration COMMON CATHODE, 2 ELEMENTS SINGLE SERIES CONNECTED, CENTER TAP, 2 ELEMENTS COMMON ANODE, 2 ELEMENTS COMMON CATHODE, 2 ELEMENTS SINGLE SERIES CONNECTED, CENTER TAP, 2 ELEMENTS COMMON ANODE, 2 ELEMENTS SEPARATE, 3 ELEMENTS
Nominal diode capacitance 0.2 pF 0.2 pF 0.2 pF 0.2 pF 0.2 pF 0.2 pF 0.2 pF 0.2 pF 0.2 pF
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON
Diode type PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE
JESD-30 code R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G6
JESD-609 code e3 e4 e4 e4 e4 e3 e3 e3 e3
Minority carrier nominal lifetime 0.5 µs 0.5 µs 0.5 µs 0.5 µs 0.5 µs 0.5 µs 0.5 µs 0.5 µs 0.5 µs
Humidity sensitivity level 1 1 1 1 1 1 1 1 1
Number of components 2 1 2 2 2 1 2 2 3
Number of terminals 3 3 3 3 3 3 3 3 6
Maximum operating temperature 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Reverse test voltage 50 V 50 V 50 V 50 V 50 V 50 V 50 V 50 V 50 V
surface mount YES YES YES YES YES YES YES YES YES
technology POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE
Terminal surface Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Parts packaging code SC-70 - - - - SC-70 SC-70 SC-70 SC-70
Maximum diode forward resistance 22 Ω 22 Ω 22 Ω 22 Ω 22 Ω 22 Ω 22 Ω 22 Ω -
Diode resistance test current 1 mA 1 mA 1 mA 1 mA 1 mA 1 mA 1 mA 1 mA -
Diode resistance test frequency 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz -
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