DS1245EE-100 datasheet, PDF - EEWORLD Datasheet

DS1245EE-100: DescriptionNon-Volatile SRAM Module, 128KX8, 100ns, CMOS,; Categorystorage storage; File Size466KB，8 Pages; ManufacturerDALLAS; Websitehttp://www.dalsemi.com

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DS1245EE-100 Overview

Non-Volatile SRAM Module, 128KX8, 100ns, CMOS,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	DALLAS
Reach Compliance Code	unknown
Maximum access time	100 ns
Other features	BATTERY BACK-UP
JESD-30 code	R-XDMA-T32
JESD-609 code	e0
memory density	1048576 bit
Memory IC Type	NON-VOLATILE SRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Exportable	YES
Package body material	UNSPECIFIED
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.005 A
Maximum slew rate	0.085 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

	DS1245EE-100	DS1245EE-120
Description	Non-Volatile SRAM Module, 128KX8, 100ns, CMOS,	Non-Volatile SRAM Module, 128KX8, 120ns, CMOS,
Is it Rohs certified?	incompatible	incompatible
Reach Compliance Code	unknown	unknown
Maximum access time	100 ns	120 ns
Other features	BATTERY BACK-UP	BATTERY BACK-UP
JESD-30 code	R-XDMA-T32	R-XDMA-T32
JESD-609 code	e0	e0
memory density	1048576 bit	1048576 bit
Memory IC Type	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE
memory width	8	8
Number of functions	1	1
Number of ports	1	1
Number of terminals	32	32
word count	131072 words	131072 words
character code	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	128KX8	128KX8
Exportable	YES	YES
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP32,.6	DIP32,.6
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum standby current	0.005 A	0.005 A
Maximum slew rate	0.085 mA	0.085 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED

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