
Rectifier Diode, 1 Element, 0.2A, 250V V(RRM), Silicon,
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Central Semiconductor |
| package instruction | O-LELF-R2 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Diode component materials | SILICON |
| Diode type | RECTIFIER DIODE |
| Maximum forward voltage (VF) | 1.25 V |
| JESD-30 code | O-LELF-R2 |
| JESD-609 code | e3 |
| Humidity sensitivity level | 1 |
| Maximum non-repetitive peak forward current | 4 A |
| Number of components | 1 |
| Number of terminals | 2 |
| Maximum operating temperature | 200 °C |
| Minimum operating temperature | -65 °C |
| Maximum output current | 0.2 A |
| Package body material | GLASS |
| Package shape | ROUND |
| Package form | LONG FORM |
| Peak Reflow Temperature (Celsius) | 260 |
| Maximum power dissipation | 0.5 W |
| Certification status | Not Qualified |
| Maximum repetitive peak reverse voltage | 250 V |
| Maximum reverse current | 0.1 µA |
| Maximum reverse recovery time | 0.05 µs |
| surface mount | YES |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | WRAP AROUND |
| Terminal location | END |
| Maximum time at peak reflow temperature | 10 |
| CLL2003TRLEADFREE | CLL2003BK | CLL2003BKLEADFREE | CLL2003TR13 | CLL2003TR13LEADFREE | CLL2003TR | |
|---|---|---|---|---|---|---|
| Description | Rectifier Diode, 1 Element, 0.2A, 250V V(RRM), Silicon, | Rectifier Diode, 1 Element, 0.2A, 250V V(RRM), Silicon, | Rectifier Diode, 1 Element, 0.2A, 250V V(RRM), Silicon, | Rectifier Diode, 1 Element, 0.2A, 250V V(RRM), Silicon, | Rectifier Diode, 1 Element, 0.2A, 250V V(RRM), Silicon, | Rectifier Diode, 1 Element, 0.2A, 250V V(RRM), Silicon, |
| Is it lead-free? | Lead free | Contains lead | Lead free | Contains lead | Lead free | Contains lead |
| Is it Rohs certified? | conform to | incompatible | conform to | incompatible | conform to | incompatible |
| Reach Compliance Code | compliant | not_compliant | compliant | not_compliant | compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Shell connection | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Diode component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| Diode type | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
| Maximum forward voltage (VF) | 1.25 V | 1.25 V | 1.25 V | 1.25 V | 1.25 V | 1.25 V |
| JESD-30 code | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 |
| JESD-609 code | e3 | e0 | e3 | e0 | e3 | e0 |
| Maximum non-repetitive peak forward current | 4 A | 4 A | 4 A | 4 A | 4 A | 4 A |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | 2 | 2 | 2 | 2 |
| Maximum operating temperature | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C |
| Minimum operating temperature | -65 °C | -65 °C | -65 °C | -65 °C | -65 °C | -65 °C |
| Maximum output current | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A |
| Package body material | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS |
| Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
| Package form | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED |
| Maximum power dissipation | 0.5 W | 0.5 W | 0.5 W | 0.5 W | 0.5 W | 0.5 W |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum repetitive peak reverse voltage | 250 V | 250 V | 250 V | 250 V | 250 V | 250 V |
| Maximum reverse current | 0.1 µA | 0.1 µA | 0.1 µA | 0.1 µA | 0.1 µA | 0.1 µA |
| Maximum reverse recovery time | 0.05 µs | 0.05 µs | 0.05 µs | 0.05 µs | 0.05 µs | 0.05 µs |
| surface mount | YES | YES | YES | YES | YES | YES |
| Terminal surface | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | TIN LEAD | MATTE TIN (315) | Tin/Lead (Sn/Pb) |
| Terminal form | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND |
| Terminal location | END | END | END | END | END | END |
| Maximum time at peak reflow temperature | 10 | NOT SPECIFIED | 10 | NOT SPECIFIED | 10 | NOT SPECIFIED |
| Maker | Central Semiconductor | - | - | Central Semiconductor | Central Semiconductor | Central Semiconductor |