BUS-65112-170 datasheet, PDF - EEWORLD Datasheet

BUS-65112 and BUS-65117

MIL-STD-1553 DUAL REDUNDANT

REMOTE TERMINAL HYBRID

FEATURES

BUS-65112 DDIP

BUS-65117 Flat Pack

•

Small Size and Low Power

•

Complete RTU Protocol

•

Supports 13 Mode Codes:

Any Combination Can be Illegalized

DESCRIPTION

The BUS-65112 is a complete dual

redundant MIL-STD-1553 Remote

Terminal Unit (RTU) packaged in a

small 1.9” x 2.1” hybrid. Based upon

DDC custom ICs, it includes two

transceivers, two encoder/decoders,

two bit processors, RTU protocol,

data buffers, and timing control

logic. It supports all 13 mode codes

for dual redundant operation, any

combination of which can be illegal-

ized.

Parallel data transfers are accom-

plished with a DMA-type hand-

shaking, compatible with most CPU

types. Data transfers to/from memo-

ry are simplified by the latched com-

mand word and word count out-

puts. Error detection and recovery

are enhanced by BUS-65112 spe-

cial features. A 14-bit built-in-test

word register stores RTU informa-

tion, and sends it to the Bus

Controller in response to the Mode

Command Transmit Bit Word. The

BUS-65112 performs continuous

on-line wraparound self-test, and

provides four error flags to the host

CPU. Inputs are provided for host

CPU control of six bits of the RTU

Status Word.

Its small hermetic package, -55°C to

+125°C operating temperature

range, and complete RTU operation

make the BUS-65112 ideal for most

MIL-STD-1553 applications.

•

Transfers Data with DMA-Type

Handshaking

•

Latched Outputs for Command Word

and Word Count

•

14-Bit Built-in-Test Word Register

•

Four Error Flag Outputs

•

Continuous Online Self-Test

•

Plug-in and Flat Pack Packaging

DATA

BUS A

TRANSCEIVER

ENCODER/

DECODER

BIT

PROCESSOR

BUFFER

DB0-DB15

BUF ENA

DTREQ

DTGRT

DTACK

DTSTB

R/W

A5

TRANSFER

CONTROLS

DATA

BUS B

TRANSCEIVER

ENCODER/

DECODER

BIT

PROCESSOR

CURRENT

WORD

COUNTER

MUX

PROTOCOL

SEQUENCER

AND

CONTROL

LOGIC

COMMAND

LATCH

A0-A4

A6-A11

DAT/CMD

ILL CMD (ME)

SS REQ

ADBC

RT FLAG

SS BUSY

SS FLAG

MESS ERR

RT FAIL

HS FAIL

RTADD ERR

NBGT

INCMD

BITEN

STATEN

GBR

STATUS

REGISTER

ERROR FLAGS

TIMING FLAGS

BU-65112/655117 BLOCK DIAGRAM

©

1995, 1999 Data Device Corporation

M

Custom DDC Monolithics utilized in this product are copyright under the Semiconductor Chip Protection Act.

BUS-65112 DDIP PIN FUNCTIONS

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

FUNCTION

A10

A8

A6

DB1

DB3

DB5

DB7

DB9

DB11

DB13

DB15

BRO ENA

ADDRE

ADDRC

ADDRA

RTADERR

TXDATA B

+15VB

GND B

RXDATA B

A3

A1

DTGRT

INCMD

HSFAIL

DTSTR

(DAT/CMD) A5

RTFAIL

DTREQ

ADBC

TEST 2

A11 (T/R)

ILLCMD

SRQ

BITEN

RXDATA A

+ 5VA

-15VA

TXDATA A

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

FUNCTION

NBGT

A9

A7

DB0

DB2

DB4

DB6

DB8

DB10

DB12

DB14

+5V

GND

ADDRD

ADDRB

ADDRP

TXDATA B

-15VB

+5VB

RXDATA B

A2

A0

DTACK

A4

R/W

GBR

12 MHz IN

BUF ENA

RESET

RTFLAG

TEST 1

BUSY

SSFLAG

ME

RXDATA A

GNDA

+15VA

TXDATA A

STATEN

0.210

MAX

(5.33)

2.100 MAX

(53.34)

PIN NUMBERS FOR

REFERENCE ONLY

40

41

78

77

1.500

(38.1)

1

1.650

(41.91)

1

1.800 MAX

(45.72)

34

35

2

1

0.100 TYP (2.54)

0.050 TYP (1.27)

SEE DETAIL "A"

1

1.800 (45.72)

1.900 (48.26)

1

INDEX

DENOTES

PIN 1

2

0.018 ±0.002 DIA TYP

(0.46 ±0.05)

0.250 ±0.010

(6.35 ±0.25)

NOTES:

1 LEAD CLUSTER TO BE LOCATED WITH

±0.005 (±0.127) OF CASE CENTER LINE.

2 CERAMIC PACKAGE KOVAR COVER.

3. DIMENSIONS ARE IN INCHES (mm).

DETAIL "A"

BUS-65112 MECHANICAL OUTLINE (DDIP)

2

BUS-65117 FLAT PACK PIN FUNCTIONS

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

FUNCTION

NC

A10

A9F

A8

A7

A6

DB0

DB1

DB2

DB3

DB4

DB5

DB6

DB7

DB8

DB9

DB10

DB11

DB12

DB13

DB14

DB15

+5V

BRO ENA

GROUND

ADDRE

ADDRD

ADDRC

ADDRB

ADDRA

ADDRP

RTADERR

TXDATA OUT B

-15VB

+ 15VB

+ 5VB

GND B

RXDATA IN B

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

FUNCTION

NC

NBGT

STATEN

TXDATA OUT A

-15VA

+ 15VA

+5VA

GNDA

RXDATA IN A

BITEN

ME

SRQ

SSFLAG

ILLCMD

BUSY

A11

TEST 1

TEST2

RT FLAG

ABDC

RESET

DTREQ

BUF ENA

RTFAIL

12 MHz IN

A5

GBR

DTSTR

RzW

HSFAIL

A4

INCMD

DTACK

DTGRT

A0

A1

A2

A3

0.400 (MIN) (TYP)

(10)

1

1.605 MAX

(40.8)

82

2.195 MAX

(55.8)

PIN1 DENOTED BY

CONTRASTING

COLORED BEAD

40 EQ.SP

0.050 ± 2.000

(TOL NON-CUM)

(1.27 ± 50.8)

PIN NUMBERS

ARE FOR

REF ONLY

0.015 ± 0.003

(TYP)

(0.38 ± 0.076)

0.095 (REF)

(2.413)

41

0.181 MAX

(4.6)

0.080 (TYP)

(2.032)

TOP VIEW

42

0.010 ± 0.002

(TYP)

(0.254 ± 0.051)

SIDE VIEW

Note: Dimensions are in inches (millimeters).

BUS-65117 MECHANICAL OUTLINE (FLAT PACK)

41 NC

82 NC

3

ORDERING INFORMATION

BUS-6511X- X X 0 X

Supplemental Process Requirements:

S = Pre-Cap Source Inspection

L = Pull Test

Q = Pull Test and Pre-Cap Inspection

K = One Lot Date Code

W = One Lot Date Code and PreCap Source

Y = One Lot Date Code and 100% Pull Test

Z = One Lot Date Code, PreCap Source and 100% Pull Test

Blank = None of the Above

Process Requirements:

0 = Standard DDC Processing, no Burn-In (See page xiii.)

1 = MIL-PRF-38534 Compliant

2 = B*

3 = MIL-PRF-38534 Compliant with PIND Testing

4 = MIL-PRF-38534 Compliant with Solder Dip

5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip

6 = B* with PIND Testing

7 = B* with Solder Dip

8 = B* with PIND Testing and Solder Dip

9 = Standard DDC Processing with Solder Dip, no Burn-In (See page xiii.)

Temperature Grade/Data Requirements:

1 = -55°C to +125°C

2 = -40°C to +85°C

3 = 0°C to +70°C

4 = -55°C to +125°C with Variables Test Data

5 = -40°C to +85°C with Variables Test Data

8 = 0°C to +70°C with Variables Test Data

Power Supply and Packaging

2 = ±15 VDC DDIP

7 = ±15 VDC Flat Pack

The information in this data sheet is believed to be accurate; however, no responsibility is

assumed by Data Device Corporation for its use, and no license or rights are

granted by implication or otherwise in connection therewith.

Specifications are subject to change without notice.

105 Wilbur Place, Bohemia, New York 11716-2482

For Technical Support - 1-800-DDC-5757 ext. 7257 or 7381

Headquarters -

Tel: (631) 567-5600 ext. 7257 or 7381, Fax: (631) 567-7358

Southeast -

Tel: (703) 450-7900, Fax: (703) 450-6610

West Coast -

Tel: (714) 895-9777, Fax: (714) 895-4988

Europe -

Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264

Asia/Pacific -

Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689

World Wide Web -

http://www.ddc-web.com

ILC DATA DEVICE CORPORATION

REGISTERED TO ISO 9001

FILE NO. A5976

K-ABR

PRINTED IN U.S.A.

4

Parameter Name	Attribute value
Maker	Data Device Corporation
Parts packaging code	QIP
package instruction	QIP,
Contacts	78
Reach Compliance Code	unknown
Address bus width	12
boundary scan	NO
maximum clock frequency	12 MHz
letter of agreement	MIL-STD-1553
Data encoding/decoding methods	BIPH-LEVEL(MANCHESTER)
Maximum data transfer rate	0.125 MBps
External data bus width	16
JESD-30 code	R-XQIP-P78
low power mode	NO
Number of serial I/Os	2
Number of terminals	78
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	UNSPECIFIED
encapsulated code	QIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.334 mm
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	QUAD
width	41.91 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

BUS-65112-170

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BUS-65112-170 Parametric

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