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MT4LSDT464LHG-10EC3

Description
Synchronous DRAM Module, 4MX64, 6ns, CMOS, SODIMM-144
Categorystorage    storage   
File Size628KB,28 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric Compare View All

MT4LSDT464LHG-10EC3 Overview

Synchronous DRAM Module, 4MX64, 6ns, CMOS, SODIMM-144

MT4LSDT464LHG-10EC3 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicron Technology
Parts packaging codeSODIMM
package instructionSODIMM-144
Contacts144
Reach Compliance Codenot_compliant
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)125 MHz
I/O typeCOMMON
JESD-30 codeR-XZMA-N144
JESD-609 codee0
memory density268435456 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals144
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM144,32
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)235
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height25.4 mm
self refreshYES
Maximum standby current0.008 A
Maximum slew rate0.76 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch0.8 mm
Terminal locationZIG-ZAG
Maximum time at peak reflow temperature30
4 MEG x 64
SDRAM SODIMM
SMALL-OUTLINE
SDRAM MODULE
FEATURES
• JEDEC-standard PC66 and PC100 rev 1.0 144-pin,
small-outline dual in-line memory module
(SODIMM)
• Utilizes 100 MHz, 125 MHz, and 133 MHz SDRAM
components
• Unbuffered
• 32MB (4 Meg x 64)
• Single +3.3V ±0.3V power supply
• Fully synchronous; all signals registered on
positive edge of system clock
• Internal pipelined operation; column address can
be changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8 or full page
• Auto Precharge and Auto Refresh Modes
• Self Refresh Mode: Standard and Low Power
• 64ms, 4,096-cycle refresh
• LVTTL-compatible inputs and outputs
• Serial Presence-Detect (SPD)
MT4LSDT464(L)H
For the latest data sheet, please refer to the Micron Web
site:
www.micron.com/mti/msp/html/datasheet.html
PIN ASSIGNMENT
(Front View, 133 MHz/100 MHz)
144-Pin Small-Outline DIMM
OPTIONS
• Self Refresh Current
Standard
Low power
• Package
144-pin SODIMM (gold)
MARKING
None
L
G
• Frequency/CAS Latency
133 MHz/CL = 2 (7.5ns, 133 MHz SDRAMs)
133 MHz/CL = 3 (7.5ns, 133 MHz SDRAMs)
100 MHz/CL = 2 (8ns, 125 MHz SDRAMs)
66 MHz/CL = 2 (10ns, 100 MHz SDRAMs)
-13E
-133
-10E
-662
• Module Height (based on part number extension)
1.15" (66 MHz)
-662_1
1.00" (66 MHz)
-662_2
1.00" (100 MHz)
-10E_3
1.00" (133 MHz)
-133_3
1.00" (133 MHz)
-13E_3
PIN
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
FRONT
V
SS
DQ0
DQ1
DQ2
DQ3
V
DD
DQ4
DQ5
DQ6
DQ7
V
SS
DQMB0
DQMB1
V
DD
A0
A1
A2
V
SS
DQ8
DQ9
DQ10
DQ11
V
DD
DQ12
DQ13
DQ14
DQ15
V
SS
NC
NC
CK0
V
DD
RAS#
WE#
S0#
S1#
PIN
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
BACK
V
SS
DQ32
DQ33
DQ34
DQ35
V
DD
DQ36
DQ37
DQ38
DQ39
V
SS
DQMB4
DQMB5
V
DD
A3
A4
A5
V
SS
DQ40
DQ41
DQ42
DQ43
V
DD
DQ44
DQ45
DQ46
DQ47
V
SS
NC
NC
CKE0
V
DD
CAS#
CKE1
RFU (A12)
RFU (A13)
PIN
73
75
77
79
81
83
85
87
89
91
93
95
97
99
101
103
105
107
109
111
113
115
117
119
121
123
125
127
129
131
133
135
137
139
141
143
FRONT
DNU
V
SS
NC
NC
V
DD
DQ16
DQ17
DQ18
DQ19
V
SS
DQ20
DQ21
DQ22
DQ23
V
DD
A6
A8
V
SS
A9
A10
V
DD
DQMB2
DQMB3
V
SS
DQ24
DQ25
DQ26
DQ27
V
DD
DQ28
DQ29
DQ30
DQ31
V
SS
SDA
V
DD
PIN
74
76
78
80
82
84
86
88
90
92
94
96
98
100
102
104
106
108
110
112
114
116
118
120
122
124
126
128
130
132
134
136
138
140
142
144
BACK
CK1
V
SS
NC
NC
V
DD
DQ48
DQ49
DQ50
DQ51
V
SS
DQ52
DQ53
DQ54
DQ55
V
DD
A7
BA0
V
SS
BA1
A11
V
DD
DQMB6
DQMB7
V
SS
DQ56
DQ57
DQ58
DQ59
V
DD
DQ60
DQ61
DQ62
DQ63
V
SS
SCL
V
DD
NOTE:
Symbols in parentheses are not used on these
modules but may be used for other modules in
this product family. They are for reference only.
4 Meg x 64 SDRAM SODIMM
ZM26_4.p65 – Rev. 3/00
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2000, Micron Technology, Inc.

MT4LSDT464LHG-10EC3 Related Products

MT4LSDT464LHG-10EC3 MT4LSDT464LHG-662C2 MT4LSDT464HG-10EC3 MT4LSDT464HG-662C1 MT4LSDT464HG-662C2 MT4LSDT464LHG-662C1
Description Synchronous DRAM Module, 4MX64, 6ns, CMOS, SODIMM-144 Synchronous DRAM Module, 4MX64, 7.5ns, CMOS, SODIMM-144 Synchronous DRAM Module, 4MX64, 6ns, CMOS, SODIMM-144 Synchronous DRAM Module, 4MX64, 7.5ns, CMOS, SODIMM-144 Synchronous DRAM Module, 4MX64, 7.5ns, CMOS, SODIMM-144 Synchronous DRAM Module, 4MX64, 7.5ns, CMOS, SODIMM-144
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology
Parts packaging code SODIMM SODIMM SODIMM SODIMM SODIMM SODIMM
package instruction SODIMM-144 SODIMM-144 DIMM, DIMM144,32 DIMM, DIMM144,32 DIMM, DIMM144,32 DIMM, DIMM144,32
Contacts 144 144 144 144 144 144
Reach Compliance Code not_compliant unknown not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 6 ns 7.5 ns 6 ns 7.5 ns 7.5 ns 7.5 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 125 MHz 100 MHz 125 MHz 100 MHz 100 MHz 100 MHz
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XZMA-N144 R-XZMA-N144 R-XZMA-N144 R-XZMA-N144 R-XZMA-N144 R-XZMA-N144
memory density 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 64 64 64 64 64 64
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 144 144 144 144 144 144
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000 4000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 4MX64 4MX64 4MX64 4MX64 4MX64 4MX64
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM DIMM DIMM DIMM
Encapsulate equivalent code DIMM144,32 DIMM144,32 DIMM144,32 DIMM144,32 DIMM144,32 DIMM144,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 4096 4096 4096 4096 4096 4096
Maximum seat height 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm
self refresh YES YES YES YES YES YES
Maximum standby current 0.008 A 0.012 A 0.008 A 0.012 A 0.012 A 0.012 A
Maximum slew rate 0.76 mA 0.68 mA 0.76 mA 0.68 mA 0.68 mA 0.68 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location ZIG-ZAG ZIG-ZAG ZIG-ZAG ZIG-ZAG ZIG-ZAG ZIG-ZAG
JESD-609 code e0 - e0 e0 e0 -
Peak Reflow Temperature (Celsius) 235 - 235 235 235 -
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Maximum time at peak reflow temperature 30 - 30 30 30 -
Base Number Matches - - 1 1 1 1
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