MOBILE PENTIUM
II PROCESSOR IN
Micro-PGA AND BGA PACKAGES AT 400 MHz, 366 MHz,
333 MHz, 300PE MHz, AND 266PE MHz
Available at 400 MHz, 366 MHz, 333 MHz,
300PE MHz, and 266PE MHz
Supports the Intel Architecture with
Dynamic Execution
Integrated primary 16-Kbyte instruction
cache and 16-Kbyte write back data cache
Integrated second level cache (256-Kbyte)
Micro-PGA and BGA packaging
technologies
— Supports thin form factor notebook
designs
— Exposed die enables more efficient heat
dissipation
Fully compatible with previous Intel
microprocessors
— Binary compatible with all applications
— Support for MMX™ technology
Power Management Features
— Quick Start and Deep Sleep modes
provide extremely low power
dissipation
Low-Power GTL+ processor system bus
interface
Integrated math co-processor
Integrated thermal diode
The Intel
Mobile Pentium
II processor introduces a higher level of performance for today’s mobile
computing environment, including multimedia enhancements and improved Internet and communications
1
capabilities. It provides an improved performance available for applications running on advanced operating
systems such as Windows* 98. On top of its built-in power management capabilities, the Pentium II
processor takes advantage of software designed for Intel’s MMX technology to unleash enhanced color,
smoother graphics and other multimedia and communications enhancements.
The Mobile Pentium
II processor may contain design defects or errors know as errata that may cause the
product to deviate from published specifications. Current characterized errata are available upon request.
1.
Refer to the
Mobile Pentium
II Processor Performance Brief
.
INTEL CORPORATION
ORDER NUMBER: 245103-003
MOBILE PENTIUM
®
II PROCESSOR IN MICRO-PGA AND BGA PACKAGES
AT 400 MHz, 366 MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document or by the sale of Intel products. Except as provided in
Intel's terms and conditions of sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or
implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving or life sustaining applications.
Intel retains the right to make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them.
The Mobile Pentium® II processor may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be
obtained by calling 1-800-548-4725 or by visiting Intel’s website at http://www.intel.com
Copyright © Intel Corporation, 1999.
*Third-party brands and names are the property of their respective owners.
ii
INTEL CORPORATION
MOBILE PENTIUM
II PROCESSOR IN MICRO-PGA AND BGA PACKAGES
AT 400 MHZ, 366 MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ
CONTENTS
PAGE
1. INTRODUCTION .............................................. 1
1.1 Overview.................................................... 2
1.2 Terminology ............................................... 2
1.3 References ................................................ 2
2. MOBILE PENTIUM
®
II PROCESSOR
FEATURES ...................................................... 4
2.1 Feature Differences between the Mobile
®
Pentium II Processor at 400 MHz and
®
Mobile Pentium II Processor at 366 MHz
and
below ........................................................ 4
2.2 Power Management ................................... 4
2.2.1 Clock Control Architecture ................ 4
2.2.2 Normal State .................................... 6
2.2.3 Auto Halt State ................................. 6
2.2.4 STOP GRANT State ......................... 6
2.2.5 QUICK START State ........................ 6
2.2.6 HALT/GRANT SNOOP State............ 7
2.2.7 SLEEP State .................................... 8
2.2.8 Deep Sleep State ............................. 8
2.2.9 Operating System Implications of
Quick Start and Sleep States............ 8
2.3 Low Power GTL+ ....................................... 8
2.3.1 GTL+ Signals.................................... 9
®
2.4 Mobile Pentium II Processor CPUID......... 9
3. ELECTRICAL SPECIFICATIONS .................. 11
3.1 Processor System Signals ....................... 11
3.1.1 Power Sequencing Requirements... 12
3.1.2 Test Access Port (TAP) Connection 13
3.1.3 Catastrophic Thermal Protection .... 13
3.1.4 Unused Signals .............................. 13
3.1.5 Signal State in Low Power States ... 13
3.2 Power Supply Requirements .................... 14
3.2.1 Decoupling Recommendations ....... 14
3.2.2 Voltage Planes ............................... 14
3.3 System Bus Clock and Processor Clocking15
PAGE
3.4 Maximum Ratings .................................... 16
3.5 DC Specifications..................................... 18
3.6 AC Specifications ..................................... 23
3.6.1 System Bus, Clock, APIC, TAP,
CMOS and Open-Drain AC
Specifications ................................. 23
4. SYSTEM SIGNAL SIMULATIONS ................. 37
4.1 System Bus Clock (BCLK) Signal Quality
Specifications........................................... 37
4.2 Low Power GTL+ Signal Quality
Specifications........................................... 38
4.3 Non-Low Power GTL+ Signal Quality
Specifications........................................... 41
4.3.1 Overshoot and Undershoot Guidelines42
4.3.1 Ringback Specification.................... 43
4.3.2 Settling Limit Guideline ................... 43
5. MECHANICAL SPECIFICATIONS ................. 44
5.1 Dimensions of the Micro-PGA Package ... 44
5.2 Dimensions of the BGA Package ............. 46
5.3 Signal Listings.......................................... 49
6. THERMAL SPECIFICATIONS........................ 62
6.1 Thermal Diode.......................................... 63
6.2 Case Temperature ................................... 64
7. PROCESSOR INITIALIZATION AND
CONFIGURATION.......................................... 65
7.1 Description ............................................... 65
7.1.1 Quick Start Enable.......................... 65
7.1.2 System Bus Frequency................... 65
7.1.3 APIC Disable .................................. 65
7.2 Clock Frequencies and Ratios.................. 65
8. PROCESSOR INTERFACE............................ 66
8.1 Alphabetical Signal Reference ................. 66
8.2 Signal Summaries .................................... 72
INTEL CORPORATION
iii
MOBILE PENTIUM
®
II PROCESSOR IN MICRO-PGA AND BGA PACKAGES
AT 400 MHz, 366 MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ
LIST OF FIGURES
PAGE
®
Figure 1.1 Signal Groups of a Mobile Pentium II
Processor-Based System .................... 1
Figure 2.1 Clock Control States............................. 5
Figure 3.1 Ramp Rate Requirement ..................... 13
Figure 3.2 PLL LC Filter ...................................... 14
Figure 3.3 Generic Clock Waveform.................... 30
Figure 3.4 Valid Delay Timings............................ 31
Figure 3.5 Setup and Hold Timings ..................... 31
Figure 3.6 Reset and Configuration Timings........ 32
Figure 3.7 Power-On Reset Timings.................... 33
Figure 3.8 Test Timings (Boundary Scan) ........... 34
Figure 3.9 Test Reset Timings............................. 34
Figure 3.10 Quick Start/Deep Sleep Timing......... 35
Figure 3.11 Stop Grant/Sleep/Deep Sleep Timing36
Figure 4.1 BCLK Generic Clock Waveform ......... 38
Figure 4.2 GTL+ Receiver Ringback Tolerance .... 39
Figure 4.3 Maximum Acceptable GTL+
Overshoot/Undershoot Waveform for
the Mobile Pentium® II Processor at
400 MHz ............................................ 41
Figure 4.4 Non-GTL+ Signal Ringback and Settling
Limit................................................... 42
Figure 5.1 Micro-PGA Package-Top and Side
View................................................... 45
Figure 5.2 Micro-PGA Package - Bottom View .... 46
Figure 5.3 Surface-Mount BGA Package - Top and
Side View........................................... 48
Figure 5.4 Surface-Mount BGA Package - Bottom
View................................................... 49
Figure 5.5 Pin/Ball Map - Top View ..................... 50
Figure 6.1 Technique for Measuring Case
Temperature ...................................... 64
Figure 8.1 PWRGOOD Relationship at Power-On70
iv
INTEL CORPORATION
MOBILE PENTIUM
II PROCESSOR IN MICRO-PGA AND BGA PACKAGES
AT 400 MHZ, 366 MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ
LIST OF TABLES
PAGE
Table 2.1 VTOL, CMOS and Open Drain Signal
Characteristics..................................... 4
Table 2.2 Clock State Characteristics.................... 7
Table 2.3 Mobile Pentium
II Processor CPUID .... 9
Table 2.4 Mobile Pentium
II Processor CPUID
Cache and TLB Descriptors ................. 9
Table 3.1 System Signal Groups ......................... 11
Table 3.2 Recommended Resistors for Open Drain
Signals............................................... 12
Table 3.3 LC Filter Specifications ........................ 15
Table 3.4 Core Frequency to System Bus Ratio
Configuration ..................................... 15
Table 3.5 Absolute Maximum Ratings for Mobile
Pentium
II Processor at 400 MHz .... 16
Table 3.6 Absolute Maximum Ratings for Mobile
Pentium
II Processor at 366 MHz and
Below................................................. 17
Table 3.7 Power Specifications for Mobile
Pentium® II Processor at 400 MHz.... 18
Table 3.8 Power Specifications for Mobile
Pentium® II Processor at 366 MHz and
Below................................................. 19
Table 3.9 Power Specifications for Low Voltage
Pentium® II Processor....................... 20
Table 3.10 Low Power GTL+ Signal Group DC
Specifications .................................... 21
Table 3.11. Low Power GTL+ Bus DC
Specifications .................................... 21
Table 3.12 Clock, APIC, TAP, CMOS and Open-
Drain Signal Group DC Specifications
for the Mobile Pentium® II Processor at
400 MHz ............................................ 22
Table 3.13 Clock, APIC, TAP, CMOS and Open-
Drain Signal Group DC Specifications
for the Mobile Pentium® II Processor at
366 MHz and Below........................... 23
Table 3.14 System Bus Clock AC Specifications. 24
Table 3.15 Valid Mobile Pentium
II Processor
Frequencies....................................... 25
Table 3.16 Low Power GTL+ Signal Groups AC
Specifications .................................... 25
Table 3.17 CMOS and Open-Drain Signal Groups
AC Specifications .............................. 26
Table 3.18 Reset Configuration AC Specifications27
PAGE
Table 3.19 TAP Signal AC Specifications ............ 28
Table 3.20 Quick Start/Deep Sleep AC
Specifications..................................... 29
Table 3.21 Stop Grant/Sleep/Deep Sleep AC
Specifications..................................... 29
Table 4.1 BCLK Signal Quality Specifications...... 37
Table 4.2 Low Power GTL+ Signal Group Ringback
Specification for the Mobile Pentium® II
Processor .......................................... 39
Table 4.3. GTL+ Signal Group
Overshoot/Undershoot Tolerance at the
Processor Core for the Mobile
Pentium® II Processor at
400 MHz ............................................ 40
Table 4.4 Signal Ringback Specifications for Non-
GTL+ Signals for the Mobile Pentium®
II Processor at 400 MHz..................... 43
Table 4.5 Signal Ringback Specifications for Non-
GTL+ Signals for the Mobile Pentium®
II Processor at 366 MHz and Below ... 43
Table 5.1 Micro-PGA Package Mechanical
Specifications..................................... 44
Table 5.2 Surface-Mount BGA Package
Specifications..................................... 47
Table 5.3 Signal Listing in Order by Pin/Ball
Number.............................................. 51
Table 5.4 Signal Listing in Order by Signal Name 57
Table 5.5 Voltage and No-Connect Ball/Pin
Locations ........................................... 61
Table 6.1 Mobile Pentium
II Processor (0.18 m)
Power Specifications.......................... 62
Table 6.2 Thermal Diode Interface....................... 63
Table 6.3. Thermal Diode Specifications ............. 63
Table 8.1 Input Signals ........................................ 73
Table 8.2 Output Signals ..................................... 74
Table 8.3 Input/Output Signals (Single Driver) ..... 74
Table 8.4 Input/Output Signals (Multiple Driver)... 75
INTEL CORPORATION
v
京公网安备 11010802033920号
EEWORLD
