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DPS256X16CA3-35C

Description
SRAM Module, 512KX8, 35ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50
Categorystorage    storage   
File Size229KB,10 Pages
ManufacturerTwilight Technology Inc.
Download Datasheet Parametric View All

DPS256X16CA3-35C Overview

SRAM Module, 512KX8, 35ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50

DPS256X16CA3-35C Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTwilight Technology Inc.
Parts packaging codePGA
package instructionAPGA, PGA50,5X10
Contacts50
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time35 ns
Other featuresUSER CONFIGURABLE AS 256K X 16
I/O typeCOMMON
JESD-30 codeR-CPGA-P50
length25.146 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of terminals50
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeAPGA
Encapsulate equivalent codePGA50,5X10
Package shapeRECTANGULAR
Package formGRID ARRAY, PIGGYBACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height11.9888 mm
Maximum standby current0.001 A
Minimum standby current2 V
Maximum slew rate0.34 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width13.716 mm
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