SRAM Module, 512KX8, 35ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Twilight Technology Inc. |
| Parts packaging code | PGA |
| package instruction | APGA, PGA50,5X10 |
| Contacts | 50 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 35 ns |
| Other features | USER CONFIGURABLE AS 256K X 16 |
| I/O type | COMMON |
| JESD-30 code | R-CPGA-P50 |
| length | 25.146 mm |
| memory density | 4194304 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 50 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | APGA |
| Encapsulate equivalent code | PGA50,5X10 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, PIGGYBACK |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 11.9888 mm |
| Maximum standby current | 0.001 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.34 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 13.716 mm |
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