CYStech Electronics Corp.
10Amp. Glass Passivated Efficient Fast Recovery Rectifiers
Spec. No. : C749E3
Issued Date : 2006.07.26
Revised Date :
Page No. : 1/3
EF10CXXE3 Series
•
Fast switching for high efficiency
•
Low forward voltage drop
•
High current capability
•
Low reverse leakage current
•
High surge current capability
Features
Mechanical Data
•
Case: Molded plastic, TO-220AB
•
Terminals: Solderrable per MIL-STD-202 method 208
•
Epoxy: UL 94V-0 rate flame retardant
•
Mounting Position: Any
•
Weight: 2.24 grams
Maximum Ratings and Electrical Characteristics
(
Rating at 25°C ambient temperature unless otherwise specified.
resistive or inductive load.
Parameter
Single phase, half wave, 60Hz,
For capacitive load, derate current by 20%.)
Symbol
V
RRM
V
RMS
V
DC
V
F
I
(AV)
I
FSM
EF
10C01
50
35
50
EF
10C02
100
70
100
0.95
10
100
Type
EF
10C03
200
140
200
EF
10C05
400
280
400
1.25
EF
10C06
600
420
600
1.85
Units
V
V
V
V
A
A
Maximum Recurrent peak reverse
voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward
voltage@ I
F
=5A
Maximum Average forward rectified
current @ T
L
=100
℃
Peak forward surge current @8.3ms
single half sine wave superimposed
on rated load (JEDEC method)
Maximum DC reverse current
V
R
=V
RRM
,T
J
=25
℃
V
R
=V
RRM
,T
J
=125
℃
Diode junction capacitance @ f=1MHz
and applied 4V reverse voltage
Maximum reverse recovery time@
I
F
=0.5A, I
R
=1A, Irr=0.25A
Typical thermal resistance, junction to
lead
Storage temperature
Operating temperature
EF10CXXE3
I
R
C
J
trr
R
θJC
Tstg
T
J
10
250
65
25
2.2
-55 ~ +150
-55 ~ +150
µA
pF
ns
℃
/W
℃
℃
CYStek Product Specification
CYStech Electronics Corp.
TO-220AB Dimension
Spec. No. : C749E3
Issued Date : 2006.07.26
Revised Date :
Page No. : 3/3
Equivalent Circuit :
Style: Pin 1.Anode 2.Cathode 3.Anode
3-Lead TO-220AB Plastic Package
CYStek Package Code: E3
DIM
A
B
C
D
E
F
G
Inches
Min.
Max.
-
0.412
0.103
0.113
0.05
0.06
0.587
0.594
0.14
0.16
0.53
0.56
0.037
0.027
Millimeters
Min.
Max.
-
10.5
2.62
2.87
1.27
1.52
14.9
15.1
3.56
4.06
13.46
14.22
0.94
0.68
DIM
H
I
J
K
L
M
R
Inches
Min.
Max.
0.105
0.095
0.175
0.185
0.045
0.055
0.27
0.23
0.10
0.11
0.014
0.025
0.148
0.154
Millimeters
Min.
Max.
2.67
2.41
4.44
4.70
1.14
1.40
6.86
5.84
2.54
2.79
0.35
0.64
3.74
3.91
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: 42 Alloy ; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
EF10CXXE3
CYStek Product Specification
Embedded System
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