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KM23C16000C-12

Description
MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42
Categorystorage    storage   
File Size168KB,3 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

KM23C16000C-12 Overview

MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42

KM23C16000C-12 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeDIP
package instructionDIP, DIP42,.6
Contacts42
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time120 ns
Other featuresCONFIGURABLE AS 1M X 16
Spare memory width8
JESD-30 codeR-PDIP-T42
JESD-609 codee0
length52.42 mm
memory density16777216 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals42
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP42,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum standby current0.00005 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm

KM23C16000C-12 Related Products

KM23C16000C-12 KM23C16000C-15 KM23C16000CG-15 KM23C16000C-10 KM23C16000CG-12 KM23C16000CG-10
Description MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 MASK ROM, 2MX8, 150ns, CMOS, PDIP42, 0.600 INCH, DIP-42 MASK ROM, 2MX8, 150ns, CMOS, PDSO44, 0.600 INCH, SOP-44 MASK ROM, 2MX8, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 MASK ROM, 2MX8, 120ns, CMOS, PDSO44, 0.600 INCH, SOP-44 MASK ROM, 2MX8, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG
Parts packaging code DIP DIP SOIC DIP SOIC SOIC
package instruction DIP, DIP42,.6 DIP, DIP42,.6 SOP, SOP44,.63 DIP, DIP42,.6 SOP, SOP44,.63 SOP, SOP44,.63
Contacts 42 42 44 42 44 44
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 120 ns 150 ns 150 ns 100 ns 120 ns 100 ns
Other features CONFIGURABLE AS 1M X 16 CONFIGURABLE AS 1M X 16 CONFIGURABLE AS 1M X 16 CONFIGURABLE AS 1M X 16 CONFIGURABLE AS 1M X 16 CONFIGURABLE AS 1M X 16
Spare memory width 8 8 8 8 8 8
JESD-30 code R-PDIP-T42 R-PDIP-T42 R-PDSO-G44 R-PDIP-T42 R-PDSO-G44 R-PDSO-G44
JESD-609 code e0 e0 e0 e0 e0 e0
length 52.42 mm 52.42 mm 28.5 mm 52.42 mm 28.5 mm 28.5 mm
memory density 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 42 42 44 42 44 44
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 2MX8 2MX8 2MX8 2MX8 2MX8 2MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP SOP DIP SOP SOP
Encapsulate equivalent code DIP42,.6 DIP42,.6 SOP44,.63 DIP42,.6 SOP44,.63 SOP44,.63
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 5.08 mm 3.1 mm 5.08 mm 3.1 mm 3.1 mm
Maximum standby current 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES NO YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 15.24 mm 12.6 mm 15.24 mm 12.6 mm 12.6 mm

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