Framer, CMOS, PDIP40, PLASTIC, DIP-40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Exar |
| Parts packaging code | DIP |
| package instruction | DIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| length | 51.7525 mm |
| Number of functions | 1 |
| Number of terminals | 40 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 6.35 mm |
| Maximum slew rate | 10 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Telecom integrated circuit types | FRAMER |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| XR-T5690IP | XR-T5690CJ | XR-T5690CP | XR-T5690IJ | |
|---|---|---|---|---|
| Description | Framer, CMOS, PDIP40, PLASTIC, DIP-40 | Framer, CMOS, PQCC44, PLASTIC, LCC-44 | Framer, CMOS, PDIP40, PLASTIC, DIP-40 | Framer, CMOS, PQCC44, PLASTIC, LCC-44 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | LCC | DIP | LCC |
| package instruction | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ |
| Contacts | 40 | 44 | 40 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T40 | S-PQCC-J44 | R-PDIP-T40 | S-PQCC-J44 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 51.7525 mm | 16.5862 mm | 51.7525 mm | 16.5862 mm |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 40 | 44 | 40 | 44 |
| Maximum operating temperature | 85 °C | 70 °C | 70 °C | 85 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCJ | DIP | QCCJ |
| Encapsulate equivalent code | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 | LDCC44,.7SQ |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 6.35 mm | 4.57 mm | 6.35 mm | 4.57 mm |
| Maximum slew rate | 10 mA | 10 mA | 10 mA | 10 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Telecom integrated circuit types | FRAMER | FRAMER | FRAMER | FRAMER |
| Temperature level | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 16.5862 mm | 15.24 mm | 16.5862 mm |
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