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DPZ4MX16NV3-12B

Description
EEPROM
Categorystorage    storage   
File Size996KB,15 Pages
ManufacturerTwilight Technology Inc.
Download Datasheet Parametric View All

DPZ4MX16NV3-12B Overview

EEPROM

DPZ4MX16NV3-12B Parametric

Parameter NameAttribute value
MakerTwilight Technology Inc.
package instruction,
Reach Compliance Codeunknown
64 Megabit FLASH EEPROM
DPZ4MX16NV3
DESCRIPTION:
The DPZ4MX16NV3 ‘’VERSA-STACK’’ module is a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers
(SLCC) mounted on a co-fired ceramic substrate. It offers 64
Megabits of FLASH EEPROM in a single package envelope of
1.090" x 1.090" x .400".
The DPZ4MX16NV3 is built with two stacks of 4 SLCC
packages each containing a 1 Meg x 8 FLASH memory
devices. Each SLCC is hermetically sealed making the
module suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules offers
a higher board density of memory than available with
conventional through-hole, surface mount, module or hybrid
techniques.
FEATURES:
Organizations: 4Meg x 16, 8 Meg x 8
Fast Access Times: 90, 100, 120, 150ns (max.)
High-Density Symmetrically
Blocked Architecture
- Sixteen 64 Kbyte Blocks Per Device
Extended Cycling Capability
- 10K Block Erase Cycles
Automated Byte Write and Block Erase
- Command User Interface
- Status Register
SRAM-Compatible Write Interface
Hardware Data Protection Feature
- Erase / Write Lockout during
Power Transitions
66 - Pin PGA ‘’VERSA-STACK’’ Package
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
A0 - A19
I/O0 - I/O15
CE0 - CE7
WE
OE
V
PP
V
DD
V
SS
N.C.
Address Inputs
Data Input/Output
Chip Enables
Write Enable
Output Enable
Programming
Voltage (+12.0V)
Power (+5V)
Ground
No Connect
PIN-OUT DIAGRAM
30A123-04
REV. D
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
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