DPZ128X32VSP-25C datasheet, PDF

DPZ128X32VSP-25C: DescriptionFlash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66; Categorystorage storage; File Size99KB，3 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPZ128X32VSP-25C Overview

Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	B&B Electronics Manufacturing Company
Parts packaging code	PGA
package instruction	PGA, PGA66,11X11
Contacts	66
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	250 ns
Other features	USER CONFIGURABLE AS 128K X 32
Spare memory width	16
Data polling	NO
JESD-30 code	S-CPGA-P66
JESD-609 code	e0
memory density	4194304 bit
Memory IC Type	FLASH MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	8.382 mm
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
switch bit	NO
type	NOR TYPE

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