DPS512X16BA3-35I datasheet, PDF

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DPS512X16BA3-35I: DescriptionSRAM Module, 1MX8, 35ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50; Categorystorage storage; File Size840KB，10 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPS512X16BA3-35I Overview

SRAM Module, 1MX8, 35ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50

DPS512X16BA3-35I Parametric

Parameter Name	Attribute value
Maker	B&B Electronics Manufacturing Company
Parts packaging code	PGA
package instruction	APGA,
Contacts	50
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	35 ns
Other features	USER CONFIGURABLE AS 512K X 16
JESD-30 code	R-CPGA-P50
length	25.146 mm
memory density	8388608 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	50
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	APGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, PIGGYBACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	21.0312 mm
Minimum standby current	2 V
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	13.716 mm

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8 Megabit High Speed CMOS SRAM

DPS512X16Cn3/DPS512X16Bn3

DESCRIPTION:

The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM ‘’STACK’’

modules are a revolutionary new memory subsystem using Dense-Pac

Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).

Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages,

or mounted on a 50-pin PGA co-fired ceramic substrate. The module

packs 8-Megabits of low-power CMOS static RAM in an area as small

as 0.463 in

, while maintaining a total height as low as 0.705 inches.

The DPS512X16Cn3/DPS512X16Bn3 STACK modules contain eight

individual 128K x 8 SRAMs, each packaged in a hermetically sealed

SLCC, making the modules suitable for commercial, industrial and

military applications.

The DPS512X16Bn3 has one active low Chip Enable (CE) and while

the DPS512X16Cn3 an active low Chip Enable (CE) and an active high

Select Line (SEL).

By using SLCCs, the ‘’Stack’’ family of modules offer a higher board

density of memory than available with conventional through-hole,

surface mount or hybrid techniques.

SLCC Stack

Straight Leaded

Stack

FEATURES:

•

Organizations Available: 512Kx16 or 1024Kx8

Access Times: 20*, 25, 30, 35, 45ns

Fully Static Operation - No clock or refresh required

Single +5V Power Supply,

10% Tolerance

TTL Compatible

Common Data Inputs and Outputs

Low Data Retention Voltage: 2.0V min.

Packages Available:

48 - Pin SLCC Stack

48 - Pin Straight Leaded Stack

48 - Pin ‘’J’’ Leaded Stack

48 - Pin Gullwing Leaded Stack

50 - Pin PGA Dense-Stack

‘’J’’ Leaded

Stack

Commercial only.

Dense-Stack

Gullwing

Leaded Stack

30A097-38

REV. D

This document contains information on a product that is currently released

to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the

right to change products or specifications herein without prior notice.

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