SRAM Module, 1MX8, 30ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Twilight Technology Inc. |
| Parts packaging code | PGA |
| package instruction | APGA, |
| Contacts | 50 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 30 ns |
| Other features | USER CONFIGURABLE AS 512K X 16 |
| JESD-30 code | R-CPGA-P50 |
| length | 25.146 mm |
| memory density | 8388608 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 50 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 1MX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | APGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, PIGGYBACK |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 21.0312 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 13.716 mm |
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