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GS8170LW18GC-333

Description
Standard SRAM, 1MX18, 1.6ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
Categorystorage    storage   
File Size878KB,33 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance  
Download Datasheet Parametric View All

GS8170LW18GC-333 Overview

Standard SRAM, 1MX18, 1.6ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

GS8170LW18GC-333 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeBGA
package instructionLBGA,
Contacts209
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time1.6 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B209
JESD-609 codee1
length22 mm
memory density18874368 bit
Memory IC TypeSTANDARD SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals209
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX18
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Preliminary
GS8170LW18/36/72C-333/300/250
209-Bump BGA
Commercial Temp
Industrial Temp
18Mb
Σ1x1
Late Write
SigmaRAM™ SRAM
250 MHz–333 MHz
1.8 V V
DD
1.8 V and 1.5 V I/O
Features
• Late Write mode
• Pipeline read operation
• JEDEC-standard SigmaRAM
pinout and package
• 1.8 V +150/–100 mV core power supply
• 1.5 V or 1.8 V I/O supply
• Dual Cycle Deselect
• Synchronous Burst operation
• Fully coherent read and write pipelines
• Echo Clock outputs track data output drivers
• ZQ mode pin for user-selectable output drive strength
• Byte write operation (9-bit bytes)
• 2 user-programmable chip enable inputs for easy depth
expansion.
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package
• Pin-compatible with future 36Mb, 72Mb, and 144Mb devices
- 333
3.0 ns
1.6 ns
Bottom View
209-Bump, 14 mm x 22 mm BGA
1 mm Bump Pitch, 11 x 19 Bump Array
Pipeline mode
tKHKH
tKHQV
Functional Description
Because
ΣRAMs
are synchronous devices, address, data
inputs, and read/write control inputs are captured on the rising
edge of the input clock. Write cycles are internally self-timed
and initiated by the rising edge of the clock input. This feature
eliminates complex off-chip write pulse generation required by
asynchronous SRAMs and simplifies input signal timing.
This
ΣRAM
reads in Pipeline mode. In Pipeline mode, single
data rate
ΣRAMs
incorporate a rising-edge-triggered output
register. For read cycles, a pipelined SRAM’s output data is
staged at the input of an edge-triggered output register during
the access cycle and then released to the output drivers at the
next rising edge of clock.
GS8170LW18/36/72C
ΣRAMs
are implemented with GSI's
high performance CMOS technology and are packaged in a
209-bump BGA.
SigmaRAM Family Overview
GS8170LW18/36/72 SigmaRAMs (ΣRAM
™)
are built in
compliance with the
ΣRAM
pinout standard for synchronous
SRAMs. They are 18,874,368-bit (18Mb) SRAMs. These are
the first in a family of wide, very low voltage CMOS I/O
SRAMs designed to operate at the speeds needed to implement
economical high performance networking systems.
GSI's
ΣRAMs
are offered in a number of configurations that
emulate other synchronous SRAMs, such as Burst RAMs,
NBT, Late Write, or Double Data Rate (DDR) SRAMs. The
logical differences between the protocols employed by these
RAMs hinge mainly on various combinations of address
bursting, output data registering and write cueing. The
ΣRAM
family standard allows a user to implement the interface
protocol best suited to the task at hand.
Rev: 1.01 7/2002
1/33
© 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.

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