Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature (soldering) Reflow............................+235°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
jobszheng5 M4 development board trial week plan submitted. It is divided into 4 small projects. The attached word document starts from the second page to explain the preparation of the project in deta...
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introduction
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introduction
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0 Introduction
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1 Introduction to the overall system solution
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Introduction
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Microcontroller MCU
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