The BCM3814x60E15A3yzz in a VIA package is a high efficiency
Bus Converter, operating from a 36 to 60V
DC
high voltage bus to
deliver an isolated 9 to 15V
DC
unregulated, low voltage.
This unique ultra-low profile module incorporates DC-DC
conversion, integrated filtering and PMBus™ commands and
controls in a chassis or PCB mount form factor.
The BCM offers low noise, fast transient response and industry
leading efficiency and power density. A low voltage side referenced
PMBus compatible telemetry and control interface provides access
to the BCM’s configuration, fault monitoring and other
telemetry functions.
Leveraging the thermal and density benefits of Vicor’s VIA
packaging technology, the BCM module offers flexible thermal
management options with very low top and bottom side
thermal impedances.
When combined with downstream Vicor DC-DC conversion
components and regulators, the BCM allows the Power Design
Engineer to employ a simple, low-profile design, which will
differentiate the end system without compromising on cost or
performance metrics.
Typical Applications
•
DC Power Distribution
•
Information and Communication
Technology (ICT) Equipment
•
High End Computing Systems
•
Automated Test Equipment
•
Industrial Systems
•
High Density Energy Systems
•
Transportation
Part Ordering Information
Product
Function
BCM
BCM =
Bus Converter
Module
[1]
The
[2]
Size:
3.76 x 1.40 x 0.37in
95.59 x 35.54 x 9.40mm
Max
High
Side
Voltage
60
High
Max
Side
Low
Voltage
Side
Range
Voltage
Ratio
E
15
Max
Low
Product Grade
Side
(Case Temperature)
Current
A3
y
C = -20 to 100°C
[1]
T = -40 to 100°C
[1]
Package
Length
38
Length in
Inches x 10
Package
Width
14
Width in
Inches x 10
Package
Type
x
B = Board VIA
V = Chassis VIA
Option Field
zz
02 = Chassis/PMBus
06 = Short Pin/PMBus
10 = Long Pin/PMBus
Internal Reference
PMBus name, SMIF, Inc. and logo are trademarks of SMIF, Inc.
High temperature current derating may apply; See Figure 1, specified thermal operating area.
BCM
®
in a VIA Package
Page 1 of 40
Rev 1.5
12/2016
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800 927.9474
BCM3814x60E15A3yzz
Typical Applications
BCM in a VIA package
+HI
+LO
EXT_BIAS
SCL
SDA
SGND
ADDR
5V
-HI
ISOLATION BOUNDARY
-LO
R1
SCL
CLOCK
DATA
SDA
SGND
Host PMBus™
DC
+
–
BCM in a VIA package
+HI
+LO
EXT_BIAS
SCL
SDA
SGND
ADDR
5V
L
O
A
D
GROUND
-HI
ISOLATION BOUNDARY
-LO
R2
Paralleling PMBus BCM in a VIA package – connection to Host PMBus
BCM
®
in a VIA Package
Page 2 of 40
Rev 1.5
12/2016
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800 927.9474
BCM3814x60E15A3yzz
Typical Applications (Cont.)
Host PMBus™
PMBus
V
EXT
+
–
SGND
SGND
BCM in a VIA Package
EXT_BIAS
SCL
SDA
SGND
ADDR
FUSE
V
HI
SGND
}
3
SGND
+HI
C
HI
+LO
–HI
SOURCE_RTN
HV
LV
ISOLATION BOUNDARY
–LO
Non-Isolated
Point of Load
Regulators
LOAD
BCM3814x60E15A3yzz at point of load – connection to Host PMBus
Host PMBus™
PMBus
V
EXT
+
–
SGND
SGND
SGND
BCM in a VIA Package
EXT_BIAS
SCL
SDA
SGND
ADDR
FUSE
V
HI
}
3
SGND
+HI
C
HI
+LO
LOAD
–HI
–LO
HV
LV
ISOLATION BOUNDARY
SOURCE_RTN
BCM3814x60E15A3yzz direct to load – connection to Host PMBus
BCM
®
in a VIA Package
Page 3 of 40
Rev 1.5
12/2016
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800 927.9474
BCM3814x60E15A3yzz
Pin Configuration
1
+HI
10
–LO
TOP VIEW
12
–LO
3
+LO
5
6
7
8
9
+LO
4
EXT BIAS
SCL
SDA
SGND
ADDR
PMBus™
–HI
2
–LO
11
–LO
13
BCM in a 3814 VIA Package - Chassis (Lug) Mount
2
–HI
11
–LO
TOP VIEW
13
–LO
4
+LO
9
8
7
6
5
+LO
3
ADDR
SGND
SDA
SCL
EXT BIAS
PMBus™
+HI
1
–LO
10
–LO
12
BCM in a 3814 VIA Package - Board (PCB) Mount
Note:
The dot on the VIA housing indicates the location of the signal pin 9.
Pin Descriptions
Pin Number
1
2
3, 4
5
6
7
8
9
10, 11, 12, 13
Signal Name
+HI
–HI
+LO
EXT BIAS
SCL
SDA
SGND
ADDR
–LO
Type
HIGH SIDE POWER
HIGH SIDE POWER
RETURN
LOW SIDE
POWER
INPUT
INPUT
INPUT/OUTPUT
LOW SIDE
SIGNAL RETURN
INPUT
LOW SIDE
POWER RETURN
Function
High voltage side positive power terminal
High voltage side negative power terminal
Low voltage side positive power terminal
5V supply input
I
2
C™
[1]
Clock, PMBus™ Compatible
I
2
C Data, PMBus Compatible
Signal Ground
Address assignment - Resistor based
Low voltage side negative power terminal
Notes:
All signal pins (5, 6, 7, 8, 9) are referenced to the low voltage side and isolated from the high voltage side.
Keep SGND signal separated from the low voltage side power return terminal (–LO) in electrical design.
[1]
I
2
C™
is a trademark of NXP Semiconductor
BCM
®
in a VIA Package
Page 4 of 40
Rev 1.5
12/2016
vicorpower.com
800 927.9474
BCM3814x60E15A3yzz
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
+HI to –HI
HI_DC or LO_DC Slew Rate
+LO to –LO
EXT BIAS to SGND
SCL to SGND
SDA to SGND
ADDR to SGND
Basic insulation (high voltage side to case)
Isolation Voltage /
Dielectric Withstand
[1]
Comments
Min
-1
Max
80
1
Unit
V
V/µs
V
V
A
V
V
V
V
DC
V
DC
V
DC
-1
-0.3
20
10
0.15
-0.3
-0.3
-0.3
1500
1500
N/A
5.5
5.5
3.6
Basic insulation (high voltage side to low voltage side)
[1]
Functional insulation (low voltage side to case)
The absolute maximum rating listed above for the dielectric withstand (high voltage side to the low voltage side) refers to the VIA package. The internal
safety approved isolating component (ChiP) provides basic insulation (2250V) from the high voltage side to the low voltage side. However, the VIA
package itself can only be tested at a basic insulation value (1500V).
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