Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed Grade
-187E
-25E
-25
-3E
-3
-37E
CL = 3
400
400
400
400
400
400
CL = 4
533
533
533
667
533
533
CL = 5
800
800
667
667
667
n/a
CL = 6
800
800
800
n/a
n/a
n/a
CL = 7
1066
n/a
n/a
n/a
n/a
n/a
t
RC
(ns)
54
55
55
54
55
55
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
128 Meg x 4
32 Meg x 4 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[11, 9:0] (2K)
64 Meg x 8
16 Meg x 8 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[9:0] (1K)
32 Meg x 16
8 Meg x 16 x 4 banks
8K
A[12:0] (8K)
BA[1:0] (4)
A[9:0] (1K)
Figure 1: 512Mb DDR2 Part Numbers
Example Part Number:
MT47H128M4HR-25E :G
-
MT47H
Configuration
Package
Speed
:
Revision
Configuration
128 Meg x 4
64 Meg x 8
32 Meg x 16
128M4
64M8
32M16
:F/:G
Revision
L Low power
IT Industrial temperature
AT Automotive temperature
Package
Pb-free
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
Lead Solder
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
HW
JN
HR
CF
-37E
-3
-3E
-25
-25E
-187E
Speed Grade
tCK = 3.75ns, CL = 4
tCK = 3ns, CL = 5
tCK = 3ns, CL = 4
tCK = 2.5ns, CL = 6
tCK = 2.5ns, CL = 5
tCK = 1.875ns, CL = 7
Note:
1. Not all speeds and configurations are available in all packages.
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
Contents
State Diagram .................................................................................................................................................. 9
Industrial Temperature ............................................................................................................................... 10
Automotive Temperature ............................................................................................................................ 11
General Notes ............................................................................................................................................ 11
Truth Tables ............................................................................................................................................... 70
Burst Type .................................................................................................................................................. 78
CAS Latency (CL) ........................................................................................................................................ 80
READ with Precharge .................................................................................................................................. 96
READ with Auto Precharge .......................................................................................................................... 98
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