BXM80536GC1600F datasheet, PDF

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BXM80536GC1600F: DescriptionMicroprocessor, 32-Bit, 1600MHz, CMOS, CPGA478, FLIP CHIP, PGA-478; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，84 Pages; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

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BXM80536GC1600F Overview

Microprocessor, 32-Bit, 1600MHz, CMOS, CPGA478, FLIP CHIP, PGA-478

BXM80536GC1600F Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Intel
Parts packaging code	PGA
package instruction	SPGA, PGA478,26X26,50
Contacts	478
Reach Compliance Code	unknown
Address bus width	32
bit size	32
boundary scan	YES
External data bus width	64
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-CPGA-P478
length	35 mm
low power mode	YES
Number of terminals	478
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	SPGA
Encapsulate equivalent code	PGA478,26X26,50
Package shape	SQUARE
Package form	GRID ARRAY, SHRINK PITCH
power supply	1.3 V
Certification status	Not Qualified
Maximum seat height	3.27 mm
speed	1600 MHz
Maximum slew rate	21000 mA
Maximum supply voltage	1.26 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	NO
technology	CMOS
Terminal form	PIN/PEG
Terminal pitch	1.27 mm
Terminal location	PERPENDICULAR
width	35 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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Intel

Pentium

M Processor on

90 nm Process with 2-MB L2

Cache

Datasheet

January 2006

Document Number: 302189-008

IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL

PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Pentium

M processor on 90 nm process with 2-MB L2 cache may contain design defects or errors known as errata which may cause the

product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across

different processor families. See www.intel.com/products/processor_number for details.

Intel, Pentium, Celeron, MMX, Intel SpeedStep and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the

United States and other countries.

*Other names and brands may be claimed as the property of others.

Intel

Datasheet

Contents

Introduction....................................................................................................................................

1.1

1.2

2.1

Terminology .......................................................................................................................... 9

References ........................................................................................................................... 9

Clock Control and Low Power States ................................................................................. 11

2.1.1 Normal State .......................................................................................................... 11

2.1.2 AutoHALT Power-Down State ............................................................................... 11

2.1.3 Stop-Grant State .................................................................................................... 12

2.1.4 HALT/Grant Snoop State ....................................................................................... 12

2.1.5 Sleep State ............................................................................................................ 13

2.1.6 Deep Sleep State................................................................................................... 13

2.1.7 Deeper Sleep State ............................................................................................... 14

Enhanced Intel SpeedStep

Technology ........................................................................... 14

Front Side Bus Low Power Enhancements ........................................................................ 15

Processor Power Status Indicator (PSI#) Signal ................................................................ 15

Power and Ground Pins...................................................................................................... 17

3.1.1 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 17

Voltage Identification .......................................................................................................... 17

Catastrophic Thermal Protection ........................................................................................ 18

Signal Terminations and Unused Pins................................................................................ 19

FSB Frequency Select Signals (BSEL[1:0]) ....................................................................... 19

FSB Signal Groups ............................................................................................................. 19

CMOS Signals .................................................................................................................... 20

Maximum Ratings ............................................................................................................... 21

Processor DC Specifications ..............................................................................................21

Processor Pinout and Pin List............................................................................................. 54

Alphabetical Signals Reference .......................................................................................... 70

Thermal Specifications ....................................................................................................... 80

5.1.1 Thermal Diode ....................................................................................................... 80

5.1.2 Thermal Diode Offset............................................................................................. 81

5.1.3 Intel

Thermal Monitor........................................................................................... 82

Low Power Features....................................................................................................................

2.2

2.3

2.4

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.1

4.2

5.1

Electrical Specifications

............................................................................................................. 17

Package Mechanical Specifications and Pin Information

....................................................... 47

Thermal Specifications and Design Considerations................................................................

Datasheet

Figures

2-1 Clock Control States................................................................................................................... 11

3-1 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#A)............................ 31

3-2 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#A) ................... 32

3-3 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#B)............................ 33

3-4 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#B) ................... 34

3-5 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#C) ........................... 35

3-6 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#C) ................... 36

3-7 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#D) ........................... 37

3-8 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#D) ................... 38

3-9 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#E)............................ 39

3-10 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#E) ................... 40

3-11 Active VCC and ICC Load Line .................................................................................................. 43

3-12 Deep Sleep VCC and ICC Load Line ......................................................................................... 44

4-1 Micro-FCPGA Package Top and Bottom Isometric Views ......................................................... 47

4-2 Micro-FCPGA Package - Top and Side Views ........................................................................... 48

4-3 Micro-FCPGA Package - Bottom View ....................................................................................... 49

4-4 Micro-FCBGA Package Top and Bottom Isometric Views ......................................................... 51

4-5 Micro-FCBGA Package Top and Side Views ............................................................................. 52

4-6 Micro-FCBGA Package Bottom View ......................................................................................... 54

4-7 The Coordinates of the Processor Pins as Viewed from the Top of the Package ...................... 55

Datasheet

Tables

1-1 References ................................................................................................................................... 9

3-1 Voltage Identification Definition .................................................................................................. 18

3-2 FSB Pin Groups.......................................................................................................................... 20

3-3 Processor DC Absolute Maximum Ratings................................................................................. 21

3-4 Voltage and Current Specifications - Standard Voltage Processors .......................................... 22

3-5 Voltage and Current Specifications - Low Voltage Processors .................................................. 24

3-6 Voltage and Current Specifications - Ultra Low Voltage Processors.......................................... 26

3-7 Voltage and Current Specifications (Continued)......................................................................... 28

3-8 Voltage Tolerances for the Intel

Pentium

M Processor (Active State) VID#A ........................ 31

3-9 Voltage Tolerances for the Intel

Pentium

M Processor (Deep Sleep State) VID#A ............... 32

3-10 Voltage Tolerances for the Intel

Pentium

M Processor (Active State) VID#B ........................ 33

3-11 Voltage Tolerances for the Intel

Pentium

M Processor (Deep Sleep State) VID#B ............... 34

3-12 Voltage Tolerances for the Intel

Pentium

M Processor (Active State) VID#C ........................ 35

3-13 Voltage Tolerances for the Intel

Pentium

M Processor (Deep Sleep State) VID#C ............... 36

3-14 Voltage Tolerances for the Intel

Pentium

M Processor (Active State) VID#D ........................ 37

3-15 Voltage Tolerances for the Intel

Pentium

M Processor (Deep Sleep State) VID#D ............... 38

3-16 Voltage Tolerances for the Intel

Pentium

M Processor (Active State) VID#E ........................ 39

3-17 Voltage Tolerances for the Intel

Pentium

M Processor (Deep Sleep State) VID#E ............... 40

3-18 Voltage Tolerances for the Intel

Pentium

M Processor LV (Active State) .............................. 41

3-19 Voltage Tolerances for the Intel

Pentium

M Processor LV (Deep Sleep State) ..................... 42

3-20 Voltage Tolerances for the Intel

Pentium

M Processor ULV (Active State)............................ 42

3-21 Voltage Tolerances for the Intel

Pentium

M Processor ULV (Deep Sleep State)................... 43

3-22 FSB Differential BCLK Specifications ......................................................................................... 44

3-23 AGTL+ Signal Group DC Specifications ..................................................................................... 45

3-24 CMOS Signal Group DC Specifications...................................................................................... 45

3-25 Open Drain Signal Group DC Specifications .............................................................................. 46

4-1 Micro-FCPGA Package Dimensions........................................................................................... 50

4-2 Micro-FCBGA Package Dimensions........................................................................................... 53

4-3 Pin Listing by Pin Name.............................................................................................................. 57

4-4 Pin Listing by Pin Number .......................................................................................................... 63

4-5 Signal Description....................................................................................................................... 70

5-1 Power Specifications for the Intel

Pentium M Processor .......................................................... 78

5-2 Thermal Diode Interface ............................................................................................................. 81

5-3 Thermal Diode Specification....................................................................................................... 81

Datasheet

BXM80536GC1600F Related Products

	BXM80536GC1600F	RH80536GC0452M	RJ80536LC0252M	RJ80536LC0252M/SL8QF	BXM80536GC1800F	BXM80536GC2100F	BXM80536GC2100FSL7V3	BXM80536GC1500F/SL7GL
Description	Microprocessor, 32-Bit, 1600MHz, CMOS, CPGA478, FLIP CHIP, PGA-478	Microprocessor, 32-Bit, 2100MHz, CMOS, CPGA478, FLIP CHIP, PGA-478	Microprocessor, 32-Bit, 1600MHz, CMOS, CPGA478, FLIP CHIP, PGA-478	RISC Microprocessor, 64-Bit, 1600MHz, CMOS, PBGA479	Microprocessor, 32-Bit, 1800MHz, CMOS, CPGA478, FLIP CHIP, PGA-478	Microprocessor, 32-Bit, 2100MHz, CMOS, CPGA478, FLIP CHIP, PGA-478	RISC Microprocessor, 64-Bit, 2100MHz, CMOS, CPGA478	RISC Microprocessor, 64-Bit, 1500MHz, CMOS, CPGA478
Is it Rohs certified?	conform to	conform to	incompatible	incompatible	conform to	conform to	conform to	conform to
package instruction	SPGA, PGA478,26X26,50	SPGA, PGA478,26X26,50	SPGA, BGA479,26X26,50	BGA, BGA479,26X26,50	SPGA, PGA478,26X26,50	SPGA, PGA478,26X26,50	SPGA, PGA478,26X26,50	SPGA, PGA478,26X26,50
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
bit size	32	32	32	64	32	32	64	64
JESD-30 code	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478	S-PBGA-B479	S-CPGA-P478	S-CPGA-P478	S-XPGA-P478	S-XPGA-P478
Number of terminals	478	478	478	479	478	478	478	478
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC	CERAMIC
encapsulated code	SPGA	SPGA	SPGA	BGA	SPGA	SPGA	SPGA	SPGA
Encapsulate equivalent code	PGA478,26X26,50	PGA478,26X26,50	BGA479,26X26,50	BGA479,26X26,50	PGA478,26X26,50	PGA478,26X26,50	PGA478,26X26,50	PGA478,26X26,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH
power supply	1.3 V	1.3 V	1,1.8 V	1,1.8 V	1.3 V	1.3 V	1.3 V	1.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	1600 MHz	2100 MHz	1600 MHz	1600 MHz	1800 MHz	2100 MHz	2100 MHz	1500 MHz
Maximum slew rate	21000 mA	21000 mA	21000 mA	21000 mA	21000 mA	21000 mA	21000 mA	21000 mA
surface mount	NO	NO	NO	YES	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	BALL	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	BOTTOM	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR, RISC	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Maker	Intel	-	Intel	Intel	Intel	Intel	Intel	Intel
Parts packaging code	PGA	PGA	PGA	-	PGA	PGA	-	-
Contacts	478	478	478	-	478	478	-	-
Address bus width	32	32	32	-	32	32	-	-
boundary scan	YES	YES	YES	-	YES	YES	-	-
External data bus width	64	64	64	-	64	64	-	-
Format	FIXED POINT	FIXED POINT	FIXED POINT	-	FIXED POINT	FIXED POINT	-	-
Integrated cache	YES	YES	YES	-	YES	YES	-	-
length	35 mm	35 mm	35 mm	-	35 mm	35 mm	-	-
low power mode	YES	YES	YES	-	YES	YES	-	-
Maximum seat height	3.27 mm	3.27 mm	3.27 mm	-	3.27 mm	3.27 mm	-	-
Maximum supply voltage	1.26 V	1.26 V	1.26 V	-	1.26 V	1.26 V	-	-
Minimum supply voltage	1.14 V	1.14 V	1.14 V	-	1.14 V	1.14 V	-	-
Nominal supply voltage	1.2 V	1.2 V	1.2 V	-	1.2 V	1.2 V	1.3 V	1.3 V
width	35 mm	35 mm	35 mm	-	35 mm	35 mm	-	-

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