EEWORLDEEWORLDEEWORLD

Part Number

Search

NATT470M16V63X63NBF

Description
Surface Mount Aluminum Electrolytic Capacitors
File Size135KB,5 Pages
ManufacturerNIC
Websitehttps://www.niccomp.com
Download Datasheet View All

NATT470M16V63X63NBF Overview

Surface Mount Aluminum Electrolytic Capacitors

Surface Mount Aluminum Electrolytic Capacitors
FEATURES
CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING
AVAILABLE WITH ANTI-VIBRATION WIDE TERMINATIONS
EXTENDED TEMPERATURE & LOAD LIFE (1,000 ~ 2,000 HOURS @ +125°C)
RoHS
SUITABLE FOR DC-DC CONVERTER, DC-AC INVERTER, ETC.
DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERING
Compliant
SAC
Alloy Compatible
230°C ~ 260°C
NATT Series
• MEETS THE REQUIREMENTS OF AEC-Q200*
*Contact NIC for supporting test data
CHARACTERISTICS
Rated Voltage Rating
Rated Capacitance Range
Operating Temp. Range
Capacitance Tolerance
Max. Leakage Current
After 2 Miuntes @ 20°C
Tan
δ
@ 120Hz/20°C
Low Temperature
Stability
Impedance Ratio @ 120Hz
Load Life Test @ 125°C
1,000 ~ 2,000 hours
(see specifications tables
for specific part numbers)
Cap
(μF)
2.2
3.3
4.7
10
22
33
47
100
220
330
470
680
1000
1500
2200
3300
4700
6.3 ~ 100Vdc
2.2 ~ 4,700μF
-55
~ +125°C
±20% (M)
0.01CV or 3μA
whichever is greater
W.V. (Vdc)
S.V. (Vdc)
Tan
δ
W.V. (Vdc)
Z-25°C/Z+20°C
Z-40°C/Z+20°C
Capacitance Change
Tan
δ
Leakage Current
Working Voltage (Vdc)
25
35
-
-
-
-
-
6.3x6.3
-
6.3x6.3
-
6.3x6.3
6.3x6.3
6.3x8
6.3x8
8x10.5
8x10.5
10x10.5
10x10.5
12.5x14
12.5x14
12.5x14
16x17
16x17
-
-
-
6.3x8
6.3x8
8x10.5
8x10.5
10x10.5
10x10.5
12.5x14
12.5x14
12.5x14
16x17
16x17
16x17
-
-
-
-
includes all homogeneous materials
*See Part Number System for Details
P N b S
f D il
LOW ESR COMPONENT
LIQUID ELECTROLYTE
For Performance Data
see www.LowESR.com
6.3
8.0
0.30
6.3
4
8
10
13
0.24
10
3
6
16
25
35
50
63
20
32
44
63
79
0.20
0.16
0.14
0.14
0.12
16
25
35
50
63
2
2
2
2
2
4
3
3
3
3
Within ±30% of initial measured value
100
125
0.10
100
2
3
Less than ±300% of the specified maximum value
Less than the specified maximum value
STANDARD VALUES AND CASE SIZES (mm)
Code
2R2
3R3
4R7
100
220
330
470
101
221
331
471
681
102
152
222
332
472
6.3
-
-
-
-
-
-
-
6.3x6.3
6.3x8
8x10.5
8x10.5
10x10.5
12.5x14
12.5x14
12.5x14
16x17
16x17
10
-
-
-
-
-
-
6.3x6.3
6.3x8
6.3x8
8x10.5
8x10.5
10x10.5
12.5x14
12.5x14
12.5x14
16x17
16x17
-
16
-
-
-
-
-
-
6.3x6.3
6.3x8
8x10.5
8x10.5
10x10.5
12.5x14
12.5x14
12.5x14
16x17
16x17
-
-
50
6.3x6.3
6.3x6.3
6.3x6.3
6.3x6.3
6.3x8
6.3x8
8x10.5
8x10.5
10x10.5
10x10.5
12.5x14
12.5x14
12.5x14
16x17
16x17
16x17
-
-
-
-
-
63
-
-
-
-
8x10.5
8x10.5
8x10.5
10x10.5
10x10.5
12.5x14
12.5x14
16x17
16x17
16x17
-
-
-
-
-
-
100
-
-
-
8x10.5
8x10.5
10x10.5
12.5x14
16x17
-
-
-
-
-
-
-
-
-
PEAK REFLOW
TEMPERATURE CODES
Code
N
L
K
J
H
Peak Reflow
Temperature
260°C
250°C
245°C
240°C
235°C
TERMINATION FINISH &
PACKAGING OPTIONS CODES
Code
Finish & Reel Size
B
Sn-Bi Finish & 13" Reel
LB
Sn-Bi Finish & 15" Reel
S
100% Sn Finish & 13" Reel
LS 100% Sn Finish & 15" Reel
Note 1: 16mm diameter parts are
only available with Sn
nish.
Note 2: 12.5mm & 16mm parts are only
available on 15" reels.
CASE SIZE DIMENSIONS (mm)
Case Size
φD±0.5
L max. A±0.2 B±0.2 I±0.3
W
P±0.3
6.3x6.3
6.3
6.3
6.6
6.6
2.5 0.5~0.8 2.2
6.3X8
6.3
8.0
6.6
6.6
2.5 0.5~0.8 2.2
8x10.5
8.0
10.5
8.3
8.3
2.9 0.7~1.0 3.2
10x10.5
10.0
10.5
10.3 10.3 3.2 1.1~1.4 4.6
12.5x14
12.5
14.0
12.8 12.8 4.5 1.1~1.4 4.6
16x17
16.0
17.0
16.3 16.3 5.5 1.8~2.1 7.0
W
0.3mm max.
+
I
I
-
L
P
B
A
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
1
【TI Technical Article】: Using TI multi-standard base station SoC to achieve comprehensive improvement in performance, efficiency and differentiation
Since the advent of wireless networks, data throughput has grown rapidly, and the demand for mobile network capacity has also increased. Long Term Evolution ( 4G LTE ) provides higher spectral efficie...
德仪DSP新天地 DSP and ARM Processors
Analysis and design of embedded DDR information line routing
[b]Introduction[/b] Embedded DDR (Double Data Rate) design is the most important and core part of embedded hardware design with DDR. As the processing power of embedded systems becomes more and more p...
程序天使 Embedded System
A strange phenomenon (solved)
I learned the MSP430 teaching video in the TI classroom some time ago, and was fortunate to get an MSP430LaunchPad development board. Today I wanted to try the buttons. The program I wrote was very si...
千里千寻 Microcontroller MCU
An SI engineer who does not understand processing cannot be called Mr. High Speed
Author: Huang Gang, a member of Yibo Technology Expressway MediaSimulation is the simulation of PCB design, and PCB design is the design used for processing and production. As the error factors brough...
yvonneGan PCB Design
EEWORLD University Hall----Live Replay: Use ModusToolbox? to build a system to flexibly respond to IoT design challenges
Live replay: Use ModusToolbox? to build a system to flexibly meet IoT design challenges : https://training.eeworld.com.cn/course/5777...
hi5 Talking
Capacitor decoupling principle
[align=left]Transferred from QQ Space[/align][align=left][font=宋体][color=#000000][size=15.3333px]Author: Bingyang[/size][/color][/font][/align] [align=left]Using capacitor decoupling is the main metho...
okhxyyo Power technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 127  1143  618  2175  1434  3  24  13  44  29 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号