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Am29LV200BB-70RFI

Description
128K X 16 FLASH 3V PROM, 120 ns, PDSO48
Categorystorage    storage   
File Size41KB,7 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

Am29LV200BB-70RFI Overview

128K X 16 FLASH 3V PROM, 120 ns, PDSO48

Am29LV200BB-70RFI Parametric

Parameter NameAttribute value
MakerAMD
Parts packaging codeTSOP1
package instructionREVERSE, MO-142DD, TSOP-48
Contacts48
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time70 ns
Other featuresBOTTOM BOOT BLOCK
Spare memory width16
startup blockBOTTOM
JESD-30 codeR-PDSO-G48
length18.4 mm
memory density2097152 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals48
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1-R
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Programming voltage3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
typeNOR TYPE
width12 mm
ADVANCE INFORMATION
Am29LV200B
2 Megabit (256 K x 8-Bit/128 K x 16-Bit)
CMOS 3.0 Volt-only Boot Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s
Single power supply operation
— Full voltage range: 2.7 to 3.6 volt read and write
operations for battery-powered applications
— Regulated voltage range: 3.0 to 3.6 volt read and
write operations and for compatibility with high
performance 3.3 volt microprocessors
s
Manufactured on 0.35
µm
process technology
— Compatible with 0.5
µm
Am29LV200 device
s
High performance
— Full voltage range: access times as fast as 80 ns
— Regulated voltage range: access times as fast as
70 ns
s
Ultra low power consumption (typical values at 5
MHz)
— 200 nA Automatic Sleep mode current
— 200 nA standby mode current
— 7 mA read current
— 15 mA program/erase current
s
Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
three 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and
three 32 Kword sectors (word mode)
— Supports full chip erase
— Sector Protection features:
A hardware method of locking a sector to prevent
any program or erase operations within that
sector
Sectors can be locked in-system or via
programming equipment
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
s
Unlock Bypass Program Command
— Reduces overall programming time when issuing
multiple program command sequences
s
Top or bottom boot block configurations
available
s
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
s
Minimum 1,000,000 write cycle guarantee per
sector
s
Package option
— 48-pin TSOP
— 44-pin SO
s
Compatibility with JEDEC standards
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write protection
s
Data# Polling and toggle bits
— Provides a software method of detecting program
or erase operation completion
s
Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting
program or erase cycle completion
s
Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
s
Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
array data
This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
1/23/98
Publication#
21521
Rev:
A
Amendment/0
Issue Date:
January 1998

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