89 package. All devices are 100% RF and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG003 will work for other various applications within
the DC to 6 GHz frequency range such as CATV and
mobile wireless.
Functional Diagram
GND
4
1
RF IN
2
GND
3
RF OUT
Applications
•
•
•
•
•
Mobile Infrastructure
CATV / FTTX
W-LAN / ISM
RFID
WiMAX / WiBro
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Specifications
(1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3
(3)
Typical Performance
(1)
Units
MHz
MHz
dB
dBm
dBm
dB
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
VSWR
Min
DC
Typ
1000
20
+24
+39
3.5
2000
19
15
10
+23
+36
3.6
7.2
110
10:1
Max
6000
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
21
-19
-14
+24.4
+39
3.5
Typical
900
20
-18
-13
+24
+39
3.5
1900
19
-16
-10
+23
+36
3.6
2140
18.7
-15
-10
+22.5
+35
3.7
Noise Figure
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
(2)
Noise Figure
Device Voltage
Device Current
Output mismatch w/o spurs
18
+34
6.7
7.6
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +9 V, R
bias
= 16
Ω,
50
Ω
System.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Storage Temperature
RF Input Power (continuous)
Device Current
Junction Temperature
Thermal Resistance
-65 to +150
°C
+10 dBm
160 mA
+160
°C
86
°C/W
Rating
Ordering Information
Part No.
ECG003B-G
ECG003B-PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 package)
700 –2400 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com, www.TriQuint.com
Page 1 of 4
January 2008
ECG003
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
InGaP HBT Gain Block
Typical Device RF Performance
(3)
Supply Bias = +9 V, R
bias
= 16
Ω,
I
cc
= 110 mA
MHz
dB
dB
dB
dBm
dBm
dB
100
21
-20
-15
+24.4
+38
3.9
500
21
-19
-14
+24.4
+39
3.6
900
20.4
-18
-13
+24
+39
3.5
1900
19
-16
-10
+23
+36
3.6
2140
18.7
-15
-10
+22.5
+35
3.7
2400
18.2
-13
-8
+20.5
+34
3.7
3500
17.4
-12
-7
+18.7
+31
4.2
5800
14
-6
-3
12
1. Test conditions: T = 25º C, Supply Voltage = +9 V, Device Voltage = 7.2 V, Rbias = 16
Ω,
Icc = 110 mA typical, 50
Ω
System.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not
account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3.
Gain vs. Frequency
22
20
Gain (dB)
18
S11, S22 vs. Frequency
0
-5
Icc (mA)
Icc vs. Vde
140
120
100
80
60
40
20
+25C
-10
-15
16
+25C
14
500
1000
-40C
+85C
2500
3000
-20
S11
-25
0
1
2
3
4
Frequency (GHz)
5
6
S22
1500
2000
Frequency (MHz)
OIP3 vs. Frequency
0
0.0
2.0
4.0
Vde (V)
6.0
8.0
10.0
Noise Figure vs. Frequency
4
3.5
3
2.5
2
P1dB (dBm)
P1dB vs. Frequency
30
25
20
15
+25C
-40C
-85C
2500
3000
10
500
45
40
35
30
+25C
25
500
1000
-40C
+85C
2500
3000
OIP3 (dBm)
NF (dB)
1500
2000
Frequency (MHz)
1.5
500
1000
1500
Frequency (MHz)
2000
1000
1500
2000
Frequency (MHz)
S-Parameters (V
device
= +7.2 V, I
CC
= 110 mA, T = 25°C, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
-20.36
-19.29
-17.78
-16.23
-14.71
-13.16
-12.14
-11.24
-10.30
-9.20
-7.76
-6.63
-5.54
-0.18
-24.13
-51.50
-75.63
-98.28
-118.71
-139.91
-161.53
174.59
147.71
120.30
92.76
70.28
20.46
20.19
19.84
19.40
19.06
18.65
18.23
17.77
17.32
16.71
15.97
14.85
13.49
177.69
157.68
136.88
117.06
97.71
78.13
59.26
40.27
20.70
0.41
-19.87
-40.81
-59.45
-23.19
-23.08
-22.93
-22.61
-22.16
-21.61
-20.91
-20.11
-19.35
-18.62
-18.16
-18.05
-18.34
-0.38
-2.33
-4.52
-7.13
-9.76
-13.40
-17.67
-23.92
-31.44
-41.28
-52.98
-66.03
-79.15
-13.95
-13.44
-12.45
-11.26
-9.96
-8.82
-7.63
-6.59
-5.32
-4.19
-3.10
-2.28
-1.78
-2.86
-35.26
-68.47
-97.26
-123.04
-145.90
-167.85
171.00
150.44
128.81
107.78
87.09
67.70
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com, www.TriQuint.com
Page 2 of 4
January 2008
ECG003
InGaP HBT Gain Block
Recommended Application Circuit
Vcc
Icc = 110 mA
R3
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF OUT
ECG003B
C1
Blocking
Capacitor
R1
18
Ω
R2
4.7
Ω
C2
Blocking
Capacitor
RF IN
Reference
Designator
L1
C1, C2, C3
50
820 nH
.018 µF
Recommended Component Values
Frequency (MHz)
500
900
1900
2200
220 nH
68 nH
27 nH
22 nH
1000 pF
100 pF
68 pF
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The component values in the table below are contained on the evaluation board to achieve optimal broadband
performance.
3. R1 and R2 are shown in the circuit diagram to avoid potential instabilities. The configuration shown above assures
of unconditional stability with the use of the device. It is expected that linearity parameters (OIP3 and P1dB) to
degrade about only 0.5 dB, while overall gain will be about 2 dB less than the performance shown in page 1 and 2 of
this datasheet. Input and output return loss is expected to improve with the use of the I/O series resistances at 2 GHz.
Recommended Bias Resistor Values
Supply
R3 value
Size
Voltage
9V
16 ohms
2010
10 V
25 ohms
2512
12 V
44 ohms
2512
The proper value for R3 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +9 V. A
1% tolerance resistor is recommended.
Ref. Desig.
L1
C1, C2
C3
C4
R1
R2
R3
Value / Type
39 nH wirewound inductor
56 pF chip capacitor
0.018
μF
chip capacitor
Do Not Place
18
Ω
chip resistor
4.7
Ω
chip resistor
16
Ω
1% tolerance
Size
0603
0603
0603
0603
0603
2010
ECG003B-PCB Performance Data
(WJ’s evaluation board uses the circuit shown above.)
Gain
20
S11 & S22 (dB)
0
Return Loss
18
16
14
12
10
-10
-20
S11
-30
S22
0
1
2
Frequency (GHz)
3
4
0
1
2
3
4
Frequency (GHz)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com, www.TriQuint.com
Page 3 of 4
January 2008
ECG003
InGaP HBT Gain Block
ECG003B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
°C
reflow temperature) and leaded (maximum 245
°C
reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“E003G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E003” designator followed by an
alphanumeric lot code; it may also have been
marked with an “8” designator followed by a
3-digit numeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
E003G
XXXX-X
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
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