ZMM55-B30_R1_10001 datasheet, PDF

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ZMM55-B30_R1_10001: DescriptionZener Diode, 30V V(Z), 2%, 0.5W, Silicon, Unidirectional, ROHS COMPLIANT, GLASS, LL34, MINIMELF-2; CategoryDiscrete semiconductor diode; File Size98KB，6 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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ZMM55-B30_R1_10001 Overview

Zener Diode, 30V V(Z), 2%, 0.5W, Silicon, Unidirectional, ROHS COMPLIANT, GLASS, LL34, MINIMELF-2

ZMM55-B30_R1_10001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
package instruction	ROHS COMPLIANT, GLASS, LL34, MINIMELF-2
Reach Compliance Code	compliant
ECCN code	EAR99
Shell connection	ISOLATED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	80 Ω
JESD-30 code	O-LELF-R2
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.5 W
Nominal reference voltage	30 V
surface mount	YES
technology	ZENER
Terminal form	WRAP AROUND
Terminal location	END
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	2%
Working test current	5 mA

ZMM55-B30_R1_10001 Preview

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ZMM55-C2V4 SERIES

SURFACE MOUNT ZENER DIODES

VOLTAGE

2.4 to 75 Volts

POWER

500 mWatts

FEATURES

• Planar Die construction

• 500mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

0.063(1.6)

0.020(0.5)

0.012(0.3)

0.146(3.7)

0.130(3.3)

0.055(1.4)DIA.

• Lead free in comply with EU RoHS 2011/65/EU directives

MECHANICAL DATA

• Case: Molded Glass MINI-MELF

• Terminals: Solderable per MIL-STD-750, Method 2026

• Polarity: See Diagram Below

• Approx. Weight: 0.03 grams

• Mounting Position: Any

• Packing information

T/R - 2.5K per 7" plastic Reel

T/R - 10K per 13" plastic Reel

0.020(0.5)

0.012(0.3)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Parameter

Power Dissipation at T

= 25

Junction Temperature

Storage Temperature Range

Symbol

Value

500

175

-65 to +175

Units

TOT

Parameter

Thermal Resistance Junction to Ambient Air

Forward Voltage at I

= 200mA

Symbol

Min.

Typ.

Max.

0.3

1.5

Units

C/mW

JA

May 10,2013-REV.07

PAGE . 1

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