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HYS72D64000HU-8-A

Description
DDR DRAM Module, 64MX72, 0.8ns, CMOS, DIMM-184
Categorystorage    storage   
File Size302KB,18 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Environmental Compliance
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HYS72D64000HU-8-A Overview

DDR DRAM Module, 64MX72, 0.8ns, CMOS, DIMM-184

HYS72D64000HU-8-A Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerInfineon
Parts packaging codeDIMM
package instructionDIMM,
Contacts184
Reach Compliance Codecompliant
ECCN codeEAR99
access modeSINGLE BANK PAGE BURST
Maximum access time0.8 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XDMA-N184
memory density4831838208 bit
Memory IC TypeDDR DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals184
word count67108864 words
character code64000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64MX72
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
HYS64/72D64000/128020GU-7/8-A
Unbuffered DDR-I SDRAM-Modules
2.5 V 184-pin Unbuffered DDR-I SDRAM Modules
512 MByte & 1024 MByte Modules
PC1600, PC2100 & PC2700
Preliminary datasheet rev. 0.81
• 184-pin Unbuffered 8-Byte Dual-In-Line
DDR-I SDRAM non-parity and ECC-Modules
for PC and Server main memory applications
• One bank 64M x 64, 64M x 72 and two bank
128M x 64, 128M
×
72 organization
• JEDEC standard Double Data Rate
Synchronous DRAMs (DDR-I SDRAM)
Single + 2.5 V (
±
0.2 V) power supply
• Built with 512 Mbit DDR-I SDRAMs organized
as 64Mb x 8 in 66-Lead TSOPII package
• Programmable CAS Latency, Burst Length,
and Wrap Sequence (Sequential &
Interleave)
• Performance:
-6
Component Speed Grade
Module Speed Grade
f
CK
f
CK
• Auto Refresh (CBR) and Self Refresh
• All inputs and outputs SSTL_2 compatible
• Serial Presence Detect with E
2
PROM
• Jedec standard MO-206 form factor:
133.35 mm
×
31.75 mm
×
4.00 mm max.
• Jedec standard reference layout
• Gold plated contacts
-7
PC2100
143
133
-8
PC1600
125
100
Unit
DDR333B DDR266A DDR200
PC2700
166
133
MHz
MHz
Clock Frequency (max.) @ CL = 2.5
Clock Frequency (max.) @ CL = 2
The HYS64/72D64000GU and HYS64/72D128020GU are industry standard 184-pin 8-byte Dual
in-line Memory Modules (DIMMs) organized as 64M
×
64 and 128M
×
64 for non-parity and 64M x
72 and 128M x 72 for ECC main memory applications. The memory array is designed with 512Mbit
Double Data Rate Synchronous DRAMs. A variety of decoupling capacitors are mounted on the PC
board. The DIMMs feature serial presence detect based on a serial E
2
PROM device using the 2-pin
I
2
C protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes
are available to the customer.
INFINEON Technologies
1
2002-09-10 (rev.0.81)

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Description DDR DRAM Module, 64MX72, 0.8ns, CMOS, DIMM-184 DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184 DDR DRAM Module, 64MX64, 0.75ns, CMOS, DIMM-184 DDR DRAM Module, 128MX64, 0.8ns, CMOS, DIMM-184 DDR DRAM Module, 128MX72, 0.7ns, CMOS, DIMM-184 DDR DRAM Module, 128MX64, 0.7ns, CMOS, DIMM-184 DDR DRAM Module, 128MX72, 0.8ns, CMOS, DIMM-184
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Parts packaging code DIMM DIMM DIMM DIMM DIMM DIMM DIMM
package instruction DIMM, DIMM, DIMM, DIMM, DIMM, DIMM, DIMM,
Contacts 184 184 184 184 184 184 184
Reach Compliance Code compliant compliant compliant compliant compliant compliant compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Maximum access time 0.8 ns 0.75 ns 0.75 ns 0.8 ns 0.7 ns 0.7 ns 0.8 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-XDMA-N184 R-XDMA-N184 R-XDMA-N184 R-XDMA-N184 R-XDMA-N184 R-XDMA-N184 R-XDMA-N184
memory density 4831838208 bit 4831838208 bit 4294967296 bit 8589934592 bit 9663676416 bit 8589934592 bit 9663676416 bi
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE
memory width 72 72 64 64 72 64 72
Number of functions 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1
Number of terminals 184 184 184 184 184 184 184
word count 67108864 words 67108864 words 67108864 words 134217728 words 134217728 words 134217728 words 134217728 words
character code 64000000 64000000 64000000 128000000 128000000 128000000 128000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 64MX72 64MX72 64MX64 128MX64 128MX72 128MX64 128MX72
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM DIMM DIMM DIMM DIMM
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
self refresh YES YES YES YES YES YES YES
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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