Z8L38210ASG datasheet, PDF - EEWORLD Datasheet

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Z8L38210ASG: DescriptionMicroprocessor, 16-Bit, 10MHz, CMOS, PQFP144, PLASTIC, VQFP-144; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，134 Pages; ManufacturerIXYS; Environmental Compliance

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Z8L38210ASG Overview

Microprocessor, 16-Bit, 10MHz, CMOS, PQFP144, PLASTIC, VQFP-144

Z8L38210ASG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IXYS
Parts packaging code	QFP
package instruction	PLASTIC, VQFP-144
Contacts	144
Reach Compliance Code	not_compliant
ECCN code	3A001.A.2.C
Address bus width	24
bit size	16
boundary scan	NO
maximum clock frequency	20 MHz
External data bus width	16
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	S-PQFP-G144
length	20 mm
low power mode	YES
Number of terminals	144
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.6 mm
speed	10 MHz
Maximum supply voltage	3.63 V
Minimum supply voltage	2.97 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	20 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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Z8L38210ASG Related Products

	Z8L38210ASG	Z8L38210FSG	Z8038220FSG	Z8038220ASG	Z8L38210ASC	Z8L38210FSC
Description	Microprocessor, 16-Bit, 10MHz, CMOS, PQFP144, PLASTIC, VQFP-144	Microprocessor, 16-Bit, 10MHz, CMOS, PQFP144, PLASTIC, QFP-144	Microprocessor, 16-Bit, 20MHz, CMOS, PQFP144, PLASTIC, QFP-144	Microprocessor, 16-Bit, 20MHz, CMOS, PQFP144, PLASTIC, VQFP-144	Microprocessor, 16-Bit, 10MHz, CMOS, PQFP144, PLASTIC, VQFP-144	Microprocessor, 16-Bit, 10MHz, CMOS, PQFP144, PLASTIC, QFP-144
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Contains lead	Contains lead
Is it Rohs certified?	conform to	conform to	conform to	conform to	incompatible	incompatible
Maker	IXYS	IXYS	IXYS	IXYS	IXYS	IXYS
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	PLASTIC, VQFP-144	PLASTIC, QFP-144	PLASTIC, QFP-144	PLASTIC, VQFP-144	PLASTIC, VQFP-144	PLASTIC, QFP-144
Contacts	144	144	144	144	144	144
Reach Compliance Code	not_compliant	not_compliant	compliant	compliant	compliant	compli
ECCN code	3A001.A.2.C	3A001.A.2.C	3A991.A.2	3A991.A.2	3A001.A.2.C	3A001.A.2.C
Address bus width	24	24	24	24	24	24
bit size	16	16	16	16	16	16
boundary scan	NO	NO	NO	NO	NO	NO
maximum clock frequency	20 MHz	20 MHz	40 MHz	40 MHz	20 MHz	20 MHz
External data bus width	16	16	16	16	16	16
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	NO	NO	NO	NO	NO	NO
JESD-30 code	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144
length	20 mm	28 mm	28 mm	20 mm	20 mm	28 mm
low power mode	YES	YES	YES	YES	YES	YES
Number of terminals	144	144	144	144	144	144
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	QFP	QFP	LFQFP	LFQFP	QFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	260	260	225	225
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	4.07 mm	4.07 mm	1.6 mm	1.6 mm	4.07 mm
speed	10 MHz	10 MHz	20 MHz	20 MHz	10 MHz	10 MHz
Maximum supply voltage	3.63 V	3.63 V	5.5 V	5.5 V	3.63 V	3.63 V
Minimum supply voltage	2.97 V	2.97 V	4.5 V	4.5 V	2.97 V	2.97 V
Nominal supply voltage	3.3 V	3.3 V	5 V	5 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.65 mm	0.65 mm	0.5 mm	0.5 mm	0.65 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	40	40	30	30
width	20 mm	28 mm	28 mm	20 mm	20 mm	28 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
JESD-609 code	-	-	e3	e3	e0	e0
Terminal surface	-	-	MATTE TIN	MATTE TIN	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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