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PC7447AVGHY1000NB

Description
RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size716KB,50 Pages
ManufacturerAtmel (Microchip)
Environmental Compliance
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PC7447AVGHY1000NB Overview

RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360

PC7447AVGHY1000NB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerAtmel (Microchip)
Parts packaging codeBGA
package instructionBGA, BGA360,19X19,50
Contacts360
Reach Compliance Codecompliant
ECCN code3A001.A.3
Other featuresALSO OPERATES AT 1.3V SUPPLY
Address bus width36
bit size32
boundary scanYES
maximum clock frequency167 MHz
External data bus width64
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B360
length25 mm
low power modeYES
Number of terminals360
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Encapsulate equivalent codeBGA360,19X19,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.1,1.8/2.5 V
Certification statusNot Qualified
Maximum seat height2.8 mm
speed1000 MHz
Maximum supply voltage1.15 V
Minimum supply voltage1.05 V
Nominal supply voltage1.1 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width25 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Features
3000 Dhrystone 2.1 MIPS at 1.3 GHz
Selectable Bus Clock (30 CPU Bus Dividers up to 28x)
Selectable MPx/60x Interface Voltage (1.8V, 2.5V)
P
D
Typically 18W at 1.33 GHz at V
DD
= 1.3V; 8.0W at 1 GHz at V
DD
= 1.1V
Full Operating Conditions
Nap, Doze and Sleep Power Saving Modes
Superscalar (Four Instructions Fetched Per Clock Cycle)
4 GB Direct Addressing Range
Virtual Memory: 4 Hexabytes (2
52
)
64-bit Data and 36-bit Address Bus Interface
Integrated L1: 32 KB Instruction and 32 KB Data Cache
Integrated L2: 512 KB
11 Independent Execution Units and three Register Files
Write-back and Write-through Operations
f
INT
Max = 1.167 MHz
f
BUS
Max = 133 MHz/166 MHz
PowerPC 7447A
RISC
Microprocessor
PC7447A
Description
The PC7447A host processor is a high-performance, low-power, 32-bit implementa-
tions of the PowerPC
®
Reduced Instruction Set Computer (RISC) architecture
combined with a full 128-bit implementation of Freescale’s AltiVec technology.
This microprocessor is ideal for leading-edge embedded computing and signal pro-
cessing applications. The PC7447A features 512 KB of on-chip L2 cache. The
PC7447A microprocessor has no backside L3 cache, allowing for a smaller package
designed as a pin-for-pin replacement for the PC7447 microprocessor. This device
benefits from a silicon-on-insulator (SOI) CMOS process technology, engineered to
help deliver tremendous power savings without sacrificing speed. A low-power version
of the PC7447A microprocessor is also available.
Figure 1-1 on page 2
shows a block diagram of the PC7447A. The core is a high-per-
formance superscalar design supporting a double-precision floating-point unit and a
SIMD multimedia unit. The memory storage subsystem supports the MPX bus proto-
col and a subset of the 60x bus protocol to the main memory and other system
resources.
Note that the PC7447A is a footprint-compatible, drop-in replacement in a PC7447
application if the core power supply is 1.3V.
Screening
Full Military Temperature Range (T
J
= -55°C, +125°C)
Industrial Temperature Range (T
J
= -40°C, +110°C)
GH suffix
HITCE 360
Rev. 5387D–HIREL–07/06

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Description RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360 RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, LGA-360 RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, LGA-360 RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, LGA-360 RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, LGA-360 RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360 RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360 RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360
Is it Rohs certified? conform to incompatible incompatible incompatible incompatible conform to conform to conform to
Parts packaging code BGA LGA LGA LGA LGA BGA BGA BGA
package instruction BGA, BGA360,19X19,50 LGA, LGA360,19X19,50 LGA, LGA360,19X19,50 LGA, LGA360,19X19,50 LGA, LGA360,19X19,50 BGA, BGA360,19X19,50 BGA, BGA360,19X19,50 BGA, BGA360,19X19,50
Contacts 360 360 360 360 360 360 360 360
Reach Compliance Code compliant unknow unknow unknow unknow compliant compliant compliant
ECCN code 3A001.A.3 3A001.A.3 3A001.A.2.C 3A001.A.3 3A001.A.2.C 3A001.A.2.C 3A001.A.3 3A001.A.2.C
Other features ALSO OPERATES AT 1.3V SUPPLY ALSO OPERATES AT 1.3V SUPPLY ALSO OPERATES AT 1.3V SUPPLY ALSO OPERATES AT 1.3V SUPPLY ALSO OPERATES AT 1.3V SUPPLY ALSO OPERATES AT 1.3V SUPPLY ALSO OPERATES AT 1.3V SUPPLY ALSO OPERATES AT 1.3V SUPPLY
Address bus width 36 36 36 36 36 36 36 36
bit size 32 32 32 32 32 32 32 32
boundary scan YES YES YES YES YES YES YES YES
maximum clock frequency 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz
External data bus width 64 64 64 64 64 64 64 64
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES YES YES YES YES YES
JESD-30 code S-CBGA-B360 S-CBGA-N360 S-CBGA-N360 S-CBGA-N360 S-CBGA-N360 S-CBGA-B360 S-CBGA-B360 S-CBGA-B360
length 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm
low power mode YES YES YES YES YES YES YES YES
Number of terminals 360 360 360 360 360 360 360 360
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code BGA LGA LGA LGA LGA BGA BGA BGA
Encapsulate equivalent code BGA360,19X19,50 LGA360,19X19,50 LGA360,19X19,50 LGA360,19X19,50 LGA360,19X19,50 BGA360,19X19,50 BGA360,19X19,50 BGA360,19X19,50
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
power supply 1.1,1.8/2.5 V 1.1,1.8/2.5 V 1.1,1.8/2.5 V 1.1,1.8/2.5 V 1.1,1.8/2.5 V 1.1,1.8/2.5 V 1.1,1.8/2.5 V 1.1,1.8/2.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.8 mm 2.2 mm 2.2 mm 2.2 mm 2.2 mm 2.8 mm 2.8 mm 2.8 mm
speed 1000 MHz 1000 MHz 1000 MHz 1167 MHz 1167 MHz 1167 MHz 1167 MHz 1000 MHz
Maximum supply voltage 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V
Minimum supply voltage 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V
Nominal supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form BALL NO LEAD NO LEAD NO LEAD NO LEAD BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
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