MC14539BDR2 datasheet, PDF - EEWORLD Datasheet

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MC14539BDR2: DescriptionIC,LOGIC MUX,DUAL,4-INPUT,CMOS,SOP,16PIN,PLASTIC; Categorylogic logic; File Size637KB，10 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC14539BDR2 Overview

IC,LOGIC MUX,DUAL,4-INPUT,CMOS,SOP,16PIN,PLASTIC

MC14539BDR2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	SOP, SOP16,.25
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G16
JESD-609 code	e0
Logic integrated circuit type	MULTIPLEXER
Number of functions	2
Number of entries	4
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
method of packing	TAPE AND REEL
power supply	5/15 V
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL

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MC14539BDR2 Related Products

	MC14539BDR2	MC14539BCPDS	MC14539BALS	MC14539BCLD	MC14539BCLDS	MC14539BCPD
Description	IC,LOGIC MUX,DUAL,4-INPUT,CMOS,SOP,16PIN,PLASTIC	IC,LOGIC MUX,DUAL,4-INPUT,CMOS,DIP,16PIN,PLASTIC	IC,LOGIC MUX,DUAL,4-INPUT,CMOS,DIP,16PIN,CERAMIC	IC,LOGIC MUX,DUAL,4-INPUT,CMOS,DIP,16PIN,CERAMIC	IC,LOGIC MUX,DUAL,4-INPUT,CMOS,DIP,16PIN,CERAMIC	IC,LOGIC MUX,DUAL,4-INPUT,CMOS,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDSO-G16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER
Number of functions	2	2	2	2	2	2
Number of entries	4	4	4	4	4	4
Number of terminals	16	16	16	16	16	16
Maximum operating temperature	85 °C	85 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	SOP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	SOP16,.25	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
surface mount	YES	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	NXP	-	NXP	NXP	NXP	NXP

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