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SEG04G72B1BC2MT-30R

Description
4GB DDR2 . SDRAM registered SO-RDIMM
File Size583KB,16 Pages
ManufacturerETC2
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SEG04G72B1BC2MT-30R Overview

4GB DDR2 . SDRAM registered SO-RDIMM

preliminary
Data Sheet
Rev.0.9
07.01.2013
4GB DDR2
– SDRAM registered SO-RDIMM
Features:
200 Pin SO-RDIMM
SEG04G72B1BC2MT-30R
4GByte in FBGA Technology
RoHS compliant
200-pin 72-bit Small Outline Registered Dual-In-Line
Double Data Rate Synchronous DRAM Module
Module organization: dual rank 512Mx72
V
DD
= 1.8V +0.1V, V
DDQ
= 1.8V +0.1V
1.8V I/O ( SSTL_18 compatible)
Serial Presence Detect with EEPROM
Phase-lock loop (PLL) clock driver to reduce loading
Supports ECC error detection and correction
Gold-contact pad
This module family is fully pin and functional
compatible to the JEDEC PC2-5300 spec. and
JEDEC- Standard MO 224. (see www.jedec.org)
The pcb and all components are manufactured
according to the RoHS compliance specification
[EU Directive 2002/95/EC Restriction of Hazardous
Substances (RoHS)]
DDR2 SDRAM component Micron
Options:
Data Rate / Latency
DDR2 667 MT/s CL5
Module densities
4GB with 18 dies and 2 ranks
Standard Grade
(T
A
)
(T
C
)
0°C to 70°C
0°C to 85°C
Marking
-30
MT47H256M8EB-25E:C
256Mx8 DDR2 SDRAM in FBGA-60 package
Four bit prefetch architecture
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency – 1 t
CK
Programmable burst length: 4 or 8
Adjustable data-output drive strength
On-die termination (ODT)
DLL to align DQ and DQS transitions with CK
Environmental Requirements:
Operating temperature (T
C
)
Standard Grade
0°C to 85°C
Operating Humidity
10% to 90% relative humidity, noncondensing
Operating Pressure
105 to 69 kPa (up to 10000 ft.)
Storage Temperature
-55°C to 100°C
Storage Humidity
5% to 95% relative humidity, noncondensing
Storage Pressure
1682 PSI (up to 5000 ft.) at 50°C
Figure:
mechanical dimensions
1
the reference according MO224
Page 1
of 16
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