DM54S287J datasheet, PDF - EEWORLD Datasheet

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DM54S287J: DescriptionIC 256 X 4 OTPROM, 60 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM; Categorystorage storage; File Size123KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM54S287J Overview

IC 256 X 4 OTPROM, 60 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM

DM54S287J Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP16,.3
Contacts	16
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	60 ns
JESD-30 code	R-GDIP-T16
JESD-609 code	e0
length	19.43 mm
memory density	1024 bit
Memory IC Type	OTP ROM
memory width	4
Number of functions	1
Number of terminals	16
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256X4
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum slew rate	0.13 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

DM54S287J Related Products

	DM54S287J	DM74S287VX	DM54S287AJ
Description	IC 256 X 4 OTPROM, 60 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM	256X4 OTPROM, 50ns, PQCC20, PLASTIC, LCC-20	256X4 OTPROM, 40ns, CDIP16, CERAMIC, DIP-16
Maker	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DIP	QLCC	DIP
package instruction	DIP, DIP16,.3	QCCJ,	DIP, DIP16,.3
Contacts	16	20	16
Reach Compliance Code	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99
Maximum access time	60 ns	50 ns	40 ns
JESD-30 code	R-GDIP-T16	S-PQCC-J20	R-GDIP-T16
length	19.43 mm	8.89 mm	19.43 mm
memory density	1024 bit	1024 bit	1024 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4
Number of functions	1	1	1
Number of terminals	16	20	16
word count	256 words	256 words	256 words
character code	256	256	256
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	125 °C
Minimum operating temperature	-55 °C	-	-55 °C
organize	256X4	256X4	256X4
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	QCCJ	DIP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	4.57 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.25 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.75 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	YES	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	COMMERCIAL	MILITARY
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL
width	7.62 mm	8.89 mm	7.62 mm
Is it lead-free?	Contains lead	-	Contains lead
Is it Rohs certified?	incompatible	-	incompatible
JESD-609 code	e0	-	e0
Encapsulate equivalent code	DIP16,.3	-	DIP16,.3
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED
power supply	5 V	-	5 V
Maximum slew rate	0.13 mA	-	0.13 mA
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED

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