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AM29DL640D120WHE

Description
IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,BGA,63PIN,PLASTIC
Categorystorage    storage   
File Size1MB,54 Pages
ManufacturerCypress Semiconductor
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AM29DL640D120WHE Overview

IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,BGA,63PIN,PLASTIC

AM29DL640D120WHE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Reach Compliance Codecompliant
Maximum access time120 ns
Spare memory width8
startup blockBOTTOM/TOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B63
memory density67108864 bit
Memory IC TypeFLASH
Number of departments/size16,126
Number of terminals63
word count4194304 words
character code4000000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA63,8X12,32
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Parallel/SerialPARALLEL
power supply3/3.3 V
Certification statusNot Qualified
ready/busyYES
Department size8K,64K
Maximum standby current0.000005 A
Maximum slew rate0.045 mA
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
switch bitYES
typeNOR TYPE
Am29DL640D
Data Sheet
This product has been retired and is not available for designs.
For new and current designs involving TSOP packages, S29JL064H supersedes Am29DL640D and is the factory-
recommended migration path. Please refer to the S29JL064H datasheet for specifications and ordering informa-
tion.
For new and current designs involving Fine-pitch BGA (FBGA) packages, S29PL064J supersedes Am29DL640D
and is the factory-recommended migration path. Please refer to the S29PL064J Datasheet for specifications and
ordering information.
Availability of this document is retained for reference and historical purposes only.
July 2003
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that
originally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appropri-
ate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To
order these products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion mem-
ory solutions.
Publication Number
23695
Revision
C
Amendment
3
Issue Date
December 13, 2005

AM29DL640D120WHE Related Products

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Description IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,BGA,63PIN,PLASTIC IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,BGA,63PIN,PLASTIC IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,TSSOP,48PIN,PLASTIC IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,BGA,63PIN,PLASTIC IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,TSSOP,48PIN,PLASTIC IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,TSSOP,48PIN,PLASTIC IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,BGA,63PIN,PLASTIC IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,TSSOP,48PIN,PLASTIC IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,TSSOP,48PIN,PLASTIC IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,BGA,63PIN,PLASTIC
Is it Rohs certified? incompatible conform to conform to incompatible incompatible conform to conform to incompatible conform to conform to
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
Maximum access time 120 ns 90 ns 90 ns 120 ns 120 ns 120 ns 120 ns 120 ns 120 ns 120 ns
Spare memory width 8 8 8 8 8 8 8 8 8 8
startup block BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP
command user interface YES YES YES YES YES YES YES YES YES YES
Universal Flash Interface YES YES YES YES YES YES YES YES YES YES
Data polling YES YES YES YES YES YES YES YES YES YES
JESD-30 code R-PBGA-B63 R-PBGA-B63 R-PDSO-G48 R-PBGA-B63 R-PDSO-G48 R-PDSO-G48 R-PBGA-B63 R-PDSO-G48 R-PDSO-G48 R-PBGA-B63
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
Number of departments/size 16,126 16,126 16,126 16,126 16,126 16,126 16,126 16,126 16,126 16,126
Number of terminals 63 63 48 63 48 48 63 48 48 63
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000 4000000 4000000 4000000 4000000 4000000
Maximum operating temperature 125 °C 85 °C 85 °C 85 °C 125 °C 85 °C 85 °C 85 °C 125 °C 125 °C
Minimum operating temperature -55 °C -40 °C -40 °C -40 °C -55 °C -40 °C -40 °C -40 °C -55 °C -55 °C
organize 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA TSSOP FBGA TSSOP TSSOP FBGA TSSOP TSSOP FBGA
Encapsulate equivalent code BGA63,8X12,32 BGA63,8X12,32 TSSOP48,.8,20 BGA63,8X12,32 TSSOP48,.8,20 TSSOP48,.8,20 BGA63,8X12,32 TSSOP48,.8,20 TSSOP48,.8,20 BGA63,8X12,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ready/busy YES YES YES YES YES YES YES YES YES YES
Department size 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K
Maximum standby current 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A
Maximum slew rate 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY MILITARY
Terminal form BALL BALL GULL WING BALL GULL WING GULL WING BALL GULL WING GULL WING BALL
Terminal pitch 0.8 mm 0.8 mm 0.5 mm 0.8 mm 0.5 mm 0.5 mm 0.8 mm 0.5 mm 0.5 mm 0.8 mm
Terminal location BOTTOM BOTTOM DUAL BOTTOM DUAL DUAL BOTTOM DUAL DUAL BOTTOM
switch bit YES YES YES YES YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE

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