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FM250-BS-H

Description
Rectifier Diode, Schottky, 1 Phase, 1 Element, 2A, 50V V(RRM), Silicon, DO-214AA, SMB-S, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size93KB,7 Pages
ManufacturerFORMOSA
Websitehttp://www.formosams.com/
Environmental Compliance
Download Datasheet Parametric View All

FM250-BS-H Overview

Rectifier Diode, Schottky, 1 Phase, 1 Element, 2A, 50V V(RRM), Silicon, DO-214AA, SMB-S, 2 PIN

FM250-BS-H Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerFORMOSA
package instructionSMB-S, 2 PIN
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresLOW POWER LOSS
applicationEFFICIENCY
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)0.7 V
JEDEC-95 codeDO-214AA
JESD-30 codeR-PDSO-F2
Maximum non-repetitive peak forward current50 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current2 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Maximum repetitive peak reverse voltage50 V
Maximum reverse current500 µA
surface mountYES
technologySCHOTTKY
Terminal formFLAT
Terminal locationDUAL
Chip Schottky Barrier Rectifier
FM220-BS THRU FM2200-BS
List
Formosa MS
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2010/07/10
Revised Date
2011/06/28
Revision
B
Page.
7
Page 1
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