WIMA FKM 3
Film and Foil Capacitors with
Mixed Dielectric for Pulse Applications
PCM 7.5 mm to 15 mm
Special Features
˜
Pulse duty construction
˜
Constant capacitance value
versus temperature (similar to
the obsolete Polycarbonate)
˜
Low dissipation factor
˜
According to RoHS 2002/95/EC
D
Electrical Data
Capacitance range:
1000 pF to 0.1
m
F (E12-values on request)
Rated voltages:
100 VDC, 250 VDC, 400 VDC, 630 VDC
Capacitance tolerances:
± 20%, ±10%, ±5%
Operating temperature range:
–55+ C to +100+ C
Climatic test category:
55/100/56 in accordance with IEC
Insulation resistance
at +20+ C:
5 x 10
5
M¸
(mean value: 1 x 10
6
M¸)
Measuring voltage: 100 V/1 min.
Test voltage:
2 U
r
, 2 sec.
Dissipation factors
at +20+ C: tan
d
at f
1 kHz
10 kHz
100 kHz
C
0.1
mF
3 x 10
-3
5 x 10
-3
8 x 10
-3
Capacitance change
versus temperature
(f = 1 kHz) (general guide)
C/C
(%)
4
3
2
1
0
-1
-2
-3
-4
-55 -40
-20
Typical Applications
For general DC-applications
requiring a high capacitance
stability versus temperature e.g.
˜
Automotive electronics
˜
Lighting
0
20
40
60
80
Construction
Dielectric:
Mixed film
Capacitor electrodes:
Metal foil
Internal construction:
Voltage derating:
A voltage derating factor of 1.35 % per K
must be applied from +85+ C for DC
voltages and from +75+ C for AC
voltages
Reliability:
Operational life 300 000 hours
Failure rate 5 fit (0.5 x U
r
and 40+ C)
100
T(°C)
Maximum pulse rise time:
1000 V/
m
sec for pulses equal to the
rated voltage
Plastic film
Metal foil electrode
Terminating wire
Mechanical Tests
Pull test on leads:
10 N in direction of leads according to
IEC 60068-2-21
Vibration:
6 hours at 10 ... 2000 Hz and 0.75 mm
displacement amplitude or 10 g in
accordance with IEC 60068-2-6
Low air density:
1kPa = 10 mbar in accordance with
IEC 60068-2-13
Bump test:
4000 bumps at 390 m/sec
2
in
accordance with IEC 60068-2-29
Packing
Available taped and reeled.
Detailed taping information and graphs
at the end of the catalogue.
Encapsulation:
Solvent-resistant, flame-retardant plastic
case with epoxy resin seal, UL 94 V-0
Terminations:
Tinned wire.
Marking:
Colour: Red. Marking: Black.
Epoxy resin seal: Yellow.
For further details and graphs please
refer to Technical Information.
01.10
51
D
Recommendation for Processing
and Application of
Through-Hole Capacitors
Soldering Process
A preheating of through-hole WIMA
capacitors is allowed for temperatures
T
max
100 ° C.
In practice a preheating duration of
t
5 min. has been proven to be best.
Single wave soldering
Soldering bath temperature: T
260 ° C
Immersion time:
t
5 sec
Double wave soldering
Soldering bath temperature: T
260 ° C
Immersion time:
2 x t
3 sec
Due to different soldering processes and
heat requirements the graphs are to be
regarded as a recommendation only.
Wave soldering
T
260
240
220
200
180
160
140
120
100
80
60
40
20
[°C]
see detail-
enlargement
2s
3s
10 s
t
30
60
90
120
150
180
210
240 [sec]
Typical temperature/time graph for double wave soldering
WIMA Quality and Environmental Philosophy
ISO 9001:2000 Certification
ISO 9001:2000 is an international basic
standard of quality assurance systems for
all branches of industry. The approval
according to ISO 9001:2000 of our
factories by the VDE inspectorate certifies
that organisation, equipment and moni-
toring of quality assurance in our factories
correspond to internationally recognized
standards.
WIMA Environmental Policy
All WIMA capacitors, irrespective of
whether through-hole devices or SMD,
are made of environmentally friendly
materials. Neither during manufacture
nor in the product itself any toxic
substances are used, e.g.
–
–
–
–
–
Lead
PCB
CFC
Hydrocarbon chloride
Chromium 6+
–
–
–
–
–
PBB/PBDE
Arsenic
Cadmium
Mercury
etc.
RoHS Compliance
According to the RoHS Directive 2002/95/EC
certain hazardous substances like e.g. lead,
cadmium, mercury must not be used any
longer in electronic equipment as of July 1st,
2006. For the sake of the environment WIMA
has refraind from using such substances since
years already.
WIMA WPCS
The WIMA Process Control System (WPCS)
is a quality surveillance and optimization
system developed by WIMA. WPCS is a
major part of the quality-oriented WIMA
production. Points of application of WPCS
during production process:
”
incoming material inspection
”
metallization
”
film inspection
”
schoopage
”
pre-healing
”
lead attachment
”
cast resin preparation/
encapsulation
”
100% final inspection
”
AQL check
We merely use pure, recyclable materials
for packing our components, such as:
”
carton
”
cardboard
”
adhesive tape made of paper
”
polystyrene
We almost completely refrain from using
packing materials such as:
”
foamed polystyrene (Styropor®)
”
adhesive tapes made of plastic
”
metal clips
Tape for lead-free WIMA capacitors
DIN EN ISO 14001:2005
WIMA’s environmental management has
been established in accordance with the
guidelines of DIN EN ISO 14001:2005.
The certification has been granted in
June 2006.
16
01.10
D
Typical Dimensions for
Taping Configuration
P
2
P
Vh
H
H
1
W
2
P
1
Diagram 1:
PCM 2.5/5/7.5mm
W
0
D
0
F
P
0
P
d
P
W
W
1
H
1
t
P
1
P
1
H
d
F
P
0
P
2
F
P
2
d
P
0
Diagram 2: PCM 10/15 mm
Diagram 3: PCM 22.5 and 27.5*mm
*PCM 27.5 taping possible with two feed holes between components
Dimensions for Radial Taping
Designation
Carrier tape width
Hold-down tape width
Hole position
Hold-down tape position
Feed hole diameter
Pitch of component
Feed hole pitch
Feed hole centre
to lead
Hole centre to
component centre
Feed hole centre to bottom
edge of the component
Feed hole centre to top
edge of the component
Lead spacing at
upper edge of carrier tape
Lead diameter
Component alignment
Total tape thickness
Package
(see also page 141)
Unit
Dims in mm.
„
Symbol
PCM 2.5 taping
W
W
0
W
1
W
2
D
0
P
P
0
P
1
P
2
H
H
1
F
d
Dh
t
18.0
p0.5
6.0
for hot-sealing
adhesive tape
PCM 5 taping
18.0
p0.5
6.0
for hot-sealing
adhesive tape
PCM 7.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 10 taping*
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 15 taping*
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 22.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 27.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
25.4
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
25.4
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
38.1
p1.5
12.7
p0.3
7.8
p0.7
19.05
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
30.0 to 43.0
22.5
p0.8
0.8
–0.05
p
3.0 max.
0.7
p0.2
54
p2
B 60
p2
68
p2
depending
on PCM and
component dimensions
+0,08
cumulative pitch
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
*
38.1
p1.5
or 50.8
p1.5
12.7
p0.3
5.3
p0.7
19.05
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
35.0 to 45.0
27.5
p0.8
0.8
–0.05
p
3.0 max.
0.7
p0.2
+0.08
cumulative pitch
error max.
1.0 mm/20 pitch
5.1
p0.5
6.35
p1.3
16.5
p0.3
18.5
p0.5
H+H
component
< H
1
32.25 max.
2.5
p0.5
0.4
p0.05
p
2.0 max.
0.7
p0.2
3.85
p0.7
6.35
p1.3
16.5
p0.3
18.5
p0.5
H+H
component
< H
1
32.25 max.
5.0
+0.8
–0.2
2.6
p0.7
6.35
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
24.5 to 31.5
7.5
p0.8
„
7.7
p0.7
12.7
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
25.0 to 31.5
10.0
p0.8
+0.06
„
5.2
p0.7
12.7
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
26.0 to 37.0
15
p0.8
+0,06
0.5
p0.05
p
2.0 max.
0.7
p0.2
ROLL/AMMO
0.5
p0.05
or
0.6
–0.05
0.5
p0.05
or
0.6
–0.05
0.8
–0.05
p
3.0 max.
0.7
p0.2
AMMO
+0,08
p
3.0 max.
0.7
p0.2
p
3.0 max.
0.7
p0.2
52
p2
B 58
p2
or
66
p2
REEL
P
360 max.
P
30
p1
B
52
p2
58
p2
depending on
comp. dimensions
REEL
P
360 max.
P
30
p1
REEL
P
500 max.
P
25
p1
see details page 143.
Please clarify customer-specific deviations with the manufacturer.
Diameter of leads see General Data.
140
01.10
*
PCM 10 and PCM 15 can be crimped to PCM 7.5.
Position of components according to PCM 7.5 (sketch 1). P
0
= 12.7 or 15.0 is possible
Embedded System
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